Copper plating solution and negative electrode composite current collector prepared using same
A negative electrode composite current collector including a copper plating solution is described. The copper plating solution includes a leveling agent represented by a general formula (1) where an anion X is F − , Cl − , or Br − ; R 1 , R 2 , and R 3 are each independently selected from O or S; and R 4 , R 5 , and R 6 are each independently selected from hydrogen, a substituted or unsubstituted alkyl, a substituted or unsubstituted vinyl, a substituted or unsubstituted aryl, and a substituted or unsubstituted heteroaryl.
1 . A method for preparing a negative electrode composite current collector comprising electroplating using a copper plating solution comprising a leveling agent represented by a general formula (1),
wherein an anion X is F − , Cl − , or Br − ;
R 1 , R 2 , and R 3 are each independently selected from O or S; and
R 4 , R 5 , and R 6 are each independently selected from hydrogen, a substituted or unsubstituted alkyl, a substituted or unsubstituted vinyl, a substituted or unsubstituted aryl, and a substituted or unsubstituted heteroaryl to form copper layers on two surfaces of a polymer matrix.
2 . The method for preparing the negative electrode composite current collector according to claim 1 , wherein R 4 , R 5 , and R 6 are each independently selected from hydrogen, a substituted or unsubstituted alkyl having 1-6 carbon atoms, a substituted or unsubstituted vinyl having 2-6 carbon atoms, and a substituted or unsubstituted pyrimidyl.
3 . The method for preparing the negative electrode composite current collector according to claim 1 , wherein the leveling agent is
4 . The method for preparing the negative electrode composite current collector according to claim 1 , wherein the copper plating solution further comprises copper sulfate, sulfuric acid, hydrochloric acid, a brightener, a moistening agent, and deionized water.
5 . The method for preparing the negative electrode composite current collector according to claim 4 , wherein the brightener is a compound containing a disulfide bond, a sulfonic acid group, or a sulfhydryl group.
6 . The method for preparing the negative electrode composite current collector according to claim 5 , wherein the brightener is one or two of bis-(sodium sulfopropyl)-disulfide and sodium 3-mercaptopropanesulphonate.
7 . The method for preparing the negative electrode composite current collector according to claim 4 , wherein the moistening agent is at least one of polyethylene glycol and polypropylene glycol.
8 . The method for preparing the negative electrode composite current collector according to claim 7 , wherein the polyethylene glycol has a number-average molecular weight of 4000-15000, and the polypropylene glycol has a number-average molecular weight of 5000-20000.
9 . The method for preparing the negative electrode composite current collector according to claim 1 , wherein the copper plating solution further comprises a grain refiner.
10 . The method for preparing the negative electrode composite current collector according to claim 9 , wherein the grain refiner is at least one of acetaldehyde and ethylene diamine tetraacetic acid.
11 . The method for preparing the negative electrode composite current collector according to claim 1 , wherein each liter of copper plating solution contains 60-120 g/L of copper sulfate, 80-110 mL/L of 98% sulfuric acid, 40-90 ppm of hydrochloric acid measured in chloride ions, 2-12 mL/L of the brightener, 1-4 mL/L of the leveling agent, 0.5-2 mL/L of the moistening agent, 0.01-0.2 mL/L of the grain refiner, and deionized water for the rest part.
12 . The method for preparing the negative electrode composite current collector according to claim 1 , wherein an applicable temperature range of the copper plating solution is 20-50° C., optionally 20-45° C., and further optionally 20-35° C.
13 . The method for preparing the negative electrode composite current collector according to claim 1 , wherein an applicable cathode current density of the copper plating solution is 1-20 A/dm 2 , optionally 1-15 A/dm 2 , and further optionally 1-10 A/dm 2 .
14 . The method for preparing the negative electrode composite current collector according to claim 1 , wherein an applicable anode current density of the copper plating solution is 0.5-3 A/dm 2 .
15 . The method for preparing the negative electrode composite current collector according to claim 1 , wherein the copper plating solution has a pH value ranging from 0.5 to 4.