METHOD OF FULLY ENCAPSULATING ELECTRONICS WITHIN A STRAP
Herein disclosed is a method of manufacturing a strap comprising providing a mould for a strap, the strap comprising a first opening and a second opening, providing a printed circuit board (PCB), comprising at least one electronic component, applying a membrane to said electronic component, attaching a chassis to said PCB at said electronic component such that said membrane is sealed against said electronic component; injecting a wet applied structural component into said mould.
1 . A strap for a wearable device, comprising:
a printed circuit board (PCB) on which is mounted electronic components including a transmitter for transmitting radio signals and a button in electrical communication with said transmitter,
a chassis attached to said button,
a depressible button interface mounted on said chassis,
a membrane providing a waterproof seal for said button,
wherein when said depressible button interface is pressed, said waterproof seal deforms and actuates said button.
2 . The strap of claim 1 further comprising at least one battery located within said strap and in electronic communication with said PCB.
3 . The strap of claim 2 wherein said battery is a coin cell.
4 . The strap of claim 1 wherein said strap comprises polyurethane.
5 . The strap of claim 1 wherein the strap comprises a watch housing.
6 . The strap of claim 1 wherein said waterproof layer is formed of silicone.
7 . The strap of claim 1 wherein said waterproof seal is compressed between said button and said chassis.
8 . The strap of 7 claim 1 wherein said chassis is attached to said PCB by a plurality of pins.