Black wheels for transporting ultra-thin silicon wafer
A black wheel for transporting an ultra-thin silicon wafer may include grooves provided on a side surface of the black wheel along a circumferential direction of the black wheel. Compressed air lines are respectively accommodated within the grooves, and an air outlet of each of the compressed air lines is provided to align with a side of the ultra-thin silicon wafer close to a next process device.
1 . A black wheel for transporting an ultra-thin silicon wafer to a next process device, comprising grooves provided on a side surface of the black wheel along a circumferential direction of the black wheel,
wherein compressed air lines are fixed onto a guard plate of the next process device and respectively accommodated within the grooves;
during a process of transporting the ultra-thin silicon wafer,
the black wheel is configured to keep rotating such that the ultra-thin silicon wafer is first absorbed onto the side surface of the black wheel and then transported towards the next process device;
the grooves are configured to avoid the compressed air lines such that the black wheel, the ultra-thin silicon wafer absorbed onto the side surface of the black wheel, and the compressed air lines are not interfered with each other; and
the compressed air lines are configured to blow an end of the ultra-thin silicon wafer absorbed onto the side surface of the black wheel away from the side surface when the end of the ultra-thin silicon wafer approaches the next process device, such that the end of the ultra-thin silicon wafer blown away from the side surface is transported onto the next process device.
2 . The black wheel of claim 1 , wherein the grooves are arranged parallel to an end surface of the black wheel.
3 . The black wheel of claim 1 , wherein the grooves are uniformly distributed on a side surface of the black wheel along an axial direction of the black wheel.
4 . The black wheel of claim 1 , wherein respective bottom surfaces of the grooves are at a same distance from a side surface of the black wheel, and the compressed air lines are provided at a same height from the side surface of black wheel.
5 . The black wheel of claim 1 , wherein the compressed air lines are in clearance fit with the grooves respectively.
6 . The black wheel of claim 1 , wherein each of the grooves has a depth larger than a diameter of each of the compressed air lines.
7 . The black wheel of claim 1 , wherein both side faces of each of the grooves are disposed vertically.
8 . The black wheel of claim 1 , wherein both side faces of each of the grooves are disposed symmetrically inclined with respect to a vertical direction.
9 . The black wheel of claim 1 , wherein when the ultra-thin silicon wafer is absorbed onto the side surface of the black wheel and approaches the next process device, an air outlet of each of the compressed air lines faces a side of the ultra-thin silicon wafer facing the black wheel and faces away from the next process device.
10 . The black wheel of claim 1 , wherein the black wheel is located between the ultra-thin silicon wafer to be transported and the next process device.
11 . A black wheel for transporting an ultra-thin silicon wafer, wherein the black wheel is configured to convert the ultra-thin silicon wafer from a vertical state to a horizontal state and transport the ultra-thin silicon wafer onto a horizontal conveyor belt at a next process;
wherein the black wheel comprises grooves provided on a side surface of the black wheel along a circumferential direction of the black wheel;
compressed air lines are fixed onto a guard plate of the conveyor belt and respectively accommodated within the grooves;
during a process of transporting the ultra-thin silicon wafer,
the black wheel is configured to keep rotating such that the ultra-thin silicon wafer in the vertical state is first absorbed onto the side surface of the black wheel and then transported towards the conveyor belt;
the grooves are configured to avoid the compressed air lines such that the black wheel, the ultra-thin silicon wafer absorbed onto the side surface of the black wheel, and the compressed air lines are not interfered with each other; and
the compressed air lines are configured to blow an end of the ultra-thin silicon wafer absorbed onto the side surface of the black wheel away from the side surface when the end of the ultra-thin silicon wafer approaches the conveyor belt, such that the end of the ultra-thin silicon wafer blown away from the side surface is transported onto the conveyor belt.
12 . The black wheel of claim 11 , wherein the grooves are arranged parallel to an end surface of the black wheel.
13 . The black wheel of claim 11 , wherein the grooves are uniformly distributed on a side surface of the black wheel along an axial direction of the black wheel.
14 . The black wheel of claim 11 , wherein respective bottom surfaces of the grooves are at a same distance from a side surface of the black wheel.
15 . The black wheel of claim 11 , wherein the compressed air lines are in clearance fit with the grooves.
16 . The black wheel of claim 11 , wherein each of the grooves has a depth larger than a diameter of each of the compressed air lines.
17 . The black wheel of claim 11 , wherein both side faces of each of the grooves are disposed vertically.
18 . The black wheel of claim 11 , wherein both side faces of each of the grooves are disposed symmetrically inclined with respect to a vertical direction.
19 . The black wheel of claim 11 , wherein when the ultra-thin silicon wafer is absorbed onto the side surface of the black wheel and approaches the conveyor belt, an air outlet of each of the compressed air lines faces a side of the ultra-thin silicon wafer facing the black wheel and faces away from the conveyor belt.
20 . The black wheel of claim 11 , wherein the black wheel is located between the ultra-thin silicon wafer to be transported and the conveyor belt.