IP Library Granted Patent US 12,411,044
Granted Patent B2
US 12,411,044 · App. 18/548,201 · Granted Sep 9, 2025

Earphone

Inventors: Endong Li (Guangdong, CN); Tieyi Liang (Guangdong, CN); Jinhua Zou (Guangdong, CN)
Assignee: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
G01J5/0011G01J5/049G01J5/0802G01J5/0808H04R1/1016H04R1/1075
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Quick Facts
Patent No.
US 12,411,044
App. No.
18/548,201
Granted
Sep 9, 2025
Kind
B2
Abstract

An earphone comprises a housing defining an audio opening; a speaker driver positioned within the housing; and a body temperature measuring module. The audio opening is configured to be positioned within or facing toward an ear canal of a wearer in a wearing position of the earphone. The speaker driver comprises a diaphragm facing toward the audio opening, defining an audio channel between the diaphragm and the opening. The body temperature measuring module is positioned within the audio channel, the and comprises a reflector, and a temperature sensor configured to receive an infrared light transmitted through the audio opening and reflected by the reflector.

Claims (26)

1. An earphone, comprising:

a housing defining an audio opening, the audio opening configured to be positioned within or facing toward an ear canal of a wearer in a wearing position of the earphone;

a speaker driver positioned within the housing, the speaker driver comprising a diaphragm facing toward the audio opening, defining an audio channel between the diaphragm and the opening; and

a body temperature measuring module positioned within the audio channel, the body temperature measuring module comprising a reflector and a temperature sensor, the temperature sensor configured to receive an infrared light transmitted through the audio opening and reflected by the reflector.

2. The earphone according to claim 1 , wherein the body temperature measuring module further comprises an optical filter at or near the audio opening.

3. The earphone according to claim 2 , wherein the optical filter is configured to allow IR light of a selected wavelength to pass through while substantially absorbing light of other wavelengths.

4. The earphone according to claim 1 , wherein the reflector comprises a shaped inner surface of the housing and a coating applied to the shaped inner surface.

5. The earphone according to claim 4 , wherein the coating is a silver coating.

6. The earphone according to claim 4 , wherein the shaped inner surface and the coating is of a curved surface and is configured to reflect and converge the infrared light onto the temperature sensor.

7. The earphone according to claim 1 , wherein the temperature sensor is an FIR sensor.

8. The earphone according to claim 1 , wherein the temperature sensor is arranged in a horizontal orientation in which the photo surface of the temperature sensor is substantially parallel to an axis of the audio channel.

9. The earphone according to claim 1 , wherein the temperature sensor is mounted on a flexible PCB.

10. The earphone according to claim 1 , wherein the temperature sensor is a single chip FIR sensor.

11. The earphone according to claim 1 , wherein the earphone is an in-ear earphone or TWS earphone.

12. An earphone, comprising:

a housing defining an audio opening, the audio opening configured to be positioned within or facing toward an ear canal of a wearer in a wearing position of the earphone;

a speaker driver positioned within the housing, the speaker driver comprising a diaphragm facing toward the audio opening, defining an audio channel between the diaphragm and the opening; and

positioned within the audio channel, at least the following: a reflector and a temperature sensor, the temperature sensor positioned to receive an infrared light transmitted through the audio opening and reflected by the reflector.

13. The earphone according to claim 12 , wherein further positioned within the audio channel is an optical filter at or near the audio opening.

14. The earphone according to claim 13 , wherein the optical filter is structured to allow IR light of a selected wavelength to pass through while substantially absorbing light of other wavelengths.

15. The earphone according to claim 12 , wherein the reflector comprises a shaped inner surface of the housing and a coating applied to the shaped inner surface.

16. The earphone according to claim 15 , wherein the coating is a silver coating.

17. The earphone according to claim 15 , wherein the shaped inner surface and the coating is of a curved surface and is configured to reflect and converge the infrared light onto the temperature sensor.

18. The earphone according to claim 12 , wherein the temperature sensor is an FIR sensor.

19. The earphone according to claim 12 , wherein the temperature sensor is arranged in a horizontal orientation in which the photo surface of the temperature sensor is substantially parallel to an axis of the audio channel.

20. The earphone according to claim 12 , wherein the temperature sensor is mounted on a flexible PCB.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 28, 2023
From: LI, ENDONG; LIANG, TIEYI; ZOU, JINHUA
To: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
Reel/Frame 064726/0932 →
Continuity (1)
Related Publication 20240142309A1 · May 2, 2024
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