Granted Patent B2

US 12,226,642 · App. 18/549,368 · Granted Feb 18, 2025

Inventors: Martin Henschel (Berlin, DE); Devan Hughes (Tualatin, OR); Eric Austin (Portland, OR)

Assignee: BIOTRONIK SE & Co. KG

A61N1/37512A61N1/37518A61N1/3754A61N1/0573A61N1/3756

Abstract

Claims (13)

1. A manufacturing method for a header assembly for an implantable intracardiac device, wherein the header assembly comprises at least one tine extending from a base ring, wherein the base ring is conically formed, further comprising a header cap and a header base, wherein the header cap and the header base each comprises a supporting side surface corresponding to the conical form of the base ring, wherein the manufacturing method comprises the following steps:

an assembly step, wherein the base ring is placed between the header base and the header cap such that the base ring is located adjacent the supporting header base side surface of the header base and the supporting header cap side surface of the header cap, and

a fixing step, wherein the header cap is fixed to the header base such that the base ring is located in an inclined slot base ring groove formed by the supporting header cap side surface and the supporting header base side surface.

2. The manufacturing method according to claim 1 , wherein each of the header base and the header cap comprises a lateral surface beside its respective supporting side surface which are located at least partially adjacent to each other after the assembly step, wherein the fixing of the header cap and the header base is provided at least partially at their respective lateral surface.

3. The manufacturing method according to claim 2 , wherein the header cap and/or the header base comprises a protrusion at its respective lateral surface, wherein at least a part of the material forming the protrusion is used for fixing of the header cap at the header base.

4. The manufacturing method according to claim 1 , wherein the base ring groove is sized such that the conical base ring is rotatable within the base ring groove after the fixing step.

5. The manufacturing method according to claim 1 , wherein the header cap and the header base are fixed by heat staking, ultrasonic staking, or mechanical welding.

6. The manufacturing method according to claim 1 , further comprising attaching the header assembly to the implantable intracardiac device.

7. The manufacturing method according to claim 6 , wherein a pin-shaped electrode of the implantable intracardiac device or a feedthrough of the implantable intracardiac device comprises at least one receiving notch at its shell surface or its side surface, respectively, wherein attaching the header assembly to the implantable intracardiac device involves melting a section of the header cap or the header base so that the melted section flows into the receiving notch.

8. The manufacturing method according to claim 7 , wherein the section is provided by a protrusion of the respective lateral surface of the header cap and/or the header base.

9. The manufacturing method according to claim 7 , wherein attaching the header assembly to the implantable intracardiac device involves melting the section of the header cap so that the melted section flows into the receiving notch of the feedthrough.

10. A header assembly produced using the manufacturing method according to claim 1 .

11. An implantable intracardiac device produced using the manufacturing method according to claim 6 .

Assignments (1)

Priority Claims (1)

Continuity (2)

References Cited (10)