IP Library › Granted Patent US 12,581,177
Granted Patent B2
US 12,581,177 · App. 18/562,103 · Granted Mar 17, 2026

Camera device

Inventors: Sang Ok Park (Seoul, KR); Jung Cheol Kim (Seoul, KR); Hyun Soo Kim (Seoul, KR)
Assignee: LG INNOTEK CO., LTD.
H04N23/54H04N23/51H04N23/55H04N23/53
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Quick Facts
Patent No.
US 12,581,177
App. No.
18/562,103
Granted
Mar 17, 2026
Kind
B2
Abstract

The present embodiment relates to a camera device comprising: a first substrate; a base being disposed on the first substrate; an image sensor being disposed on the first substrate to move in a direction perpendicular to an optical axis; a housing coupling with the base; a bobbin being disposed on the base and disposed to move in a direction of the optical axis; a sensing substrate being disposed in the housing; and a connection substrate connecting the image sensor and the first substrate, wherein the connection substrate may comprise a first terminal part being connected to the first substrate and a second terminal part being connected to the sensing substrate.

Claims (64)

1 . A camera device comprising:

a first substrate;

an image sensor configured to move in a direction perpendicular to an optical axis with respect to the first substrate;

a housing disposed on the first substrate;

a bobbin disposed in the housing and configured to move in a direction of the optical axis;

a sensing substrate disposed on the housing; and

a connection substrate connecting the image sensor and the first substrate,

wherein the connection substrate comprises a first terminal part connected to the first substrate and a second terminal part connected to the sensing substrate, and

wherein the connection substrate comprises a first coupling region coupled to the first substrate, a second coupling region configured to move together with the image sensor, and a connection part connecting the first coupling region and the second coupling region.

2 . The camera device of claim 1 , comprising:

a second substrate electrically connected with the image sensor; and

a holder coupled with the second substrate.

3 . The camera device of claim 2 , wherein the second coupling region is coupled to the holder, and

wherein the second terminal part is disposed on the first coupling region.

4 . The camera device of claim 1 , comprising:

a sensing magnet disposed on the bobbin; and

a Hall sensor or a driver IC configured to sense the sensing magnet and disposed on the sensing substrate.

5 . A camera device comprising:

a fixed part comprising a first substrate and a sensing substrate;

a first moving part configured to move in an optical axis direction with respect to the fixed part;

a second moving part configured to move in a direction perpendicular to the optical axis direction; and

a connection substrate connecting the fixed part and the second moving part,

wherein the connection substrate comprises a first terminal part connected to the first substrate and a second terminal part connected to the sensing substrate, and

wherein the connection substrate comprises a connection part connected to the second moving part, an extension part extending from the connection part, and a terminal part connected to the extension part and coupled to the first substrate.

6 . The camera device of claim 5 , wherein the connection substrate is configured to move in a direction perpendicular to the optical axis direction with respect to a first coupling region coupled to the fixed part.

7 . The camera device of claim 5 ,

wherein at least a portion of the extension part is configured to move in a direction perpendicular to the optical axis direction with respect to the terminal part.

8 . The camera device of claim 5 , wherein the second moving part comprises an image sensor, and

wherein the first moving part comprises a lens.

9 . A camera device comprising:

a fixed part comprising a first substrate;

a first moving part disposed in the fixed part and comprising a lens;

a second moving part comprising an image sensor disposed at a position corresponding with the lens and a second substrate electrically connected with the image sensor;

a first coil configured to move the first moving part;

a second coil configured to move the second moving part;

a connection substrate connecting the first substrate and the second moving part;

a sensing substrate disposed on the fixed part; and

a driver IC disposed on the sensing substrate and electrically connected with the first coil,

wherein the connection substrate comprises a first terminal and a second terminal,

wherein the first terminal of the connection substrate is connected with the first substrate,

wherein the sensing substrate is connected with the second terminal of the connection substrate, and

wherein the connection substrate comprises a connection part connected with the second substrate, a terminal part coupled with the first substrate, and an extension part connecting the connection part and the terminal part.

10 . The camera device of claim 9 , wherein the first terminal and the second terminal of the connection substrate are disposed on an outer surface of the connection substrate.

11 . The camera device of claim 10 , wherein the second terminal of the connection substrate is disposed to be spaced apart from the first terminal on the outer surface of the connection substrate.

12 . The camera device of claim 9 , wherein the first terminal of the connection substrate is disposed on a lower end of the connection substrate, and

wherein the second terminal of the connection substrate is disposed spaced apart from the lower end of the connection substrate.

13 . The camera device of claim 9 , wherein the second terminal of the connection substrate is disposed above the first terminal in an optical axis direction.

14 . The camera device of claim 9 ,

wherein the first terminal and the second terminal are disposed on the terminal part.

15 . The camera device of claim 9 , comprising a sensing magnet and a correction magnet disposed opposite to each other on the first moving part,

wherein the driver IC comprises a sensor configured to detect the sensing magnet, and

wherein the driver IC is disposed to face the sensing magnet.

16 . The camera device of claim 9 , comprising an upper elastic member and a lower elastic member connecting the fixed part and the first moving part,

wherein the lower elastic member is disposed below the upper elastic member,

wherein the lower elastic member comprises two lower elastic members spaced apart from each other, and

wherein the two lower elastic members electrically connect the sensing substrate and the first coil.

17 . The camera device of claim 16 , wherein the sensing substrate comprises a first terminal connected with the second terminal of the connection substrate, and a second terminal connected with the two lower elastic members.

18 . The camera device of claim 17 , wherein the second terminal of the connection substrate comprises four second terminals, and

wherein the first terminal of the sensing substrate comprises four first terminals coupled with the four second terminals of the connection substrate.

19 . The camera device of claim 9 , wherein the sensing substrate is bent at least twice in a direction perpendicular to an optical axis direction.

20 . An optical device comprising:

a main body;

the camera device of claim 9 disposed on the main body; and

a display disposed on the main body and configured to output a video or an image photographed by the camera device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 22, 2023
From: PARK, SANG OK; KIM, JUNG CHEOL; KIM, HYUN SOO
To: LG INNOTEK CO., LTD.
Reel/Frame 065646/0905 →
Priority Claims (1)
KR 10-2021-0065813 · May 21, 2021 · national
Continuity (1)
Related Publication 20240244306A1 · Jul 18, 2024
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