Flexible neural implant with improved insertion and fixation characteristics

1 . A substantially planar neural electrode array, said electrode array comprising:

a flexible base;

a connector cable, attached to said base;

one or more flexible shafts protruding from said base, said shafts arranged to protrude in the same plane from the same surface of said base so as to form a comb-like structure,

wherein each of said one or more shafts comprises one or more electrode contacts, said electrode contacts being electrically coupled to said connector cable;

wherein a first reinforcement layer extends over said base and a proximal part of said one or more shafts, said proximal part being adjacent to said base;

a second, resorbable or dissolvable reinforcement layer extends over a distal part of said one or more shafts, said distal part being distant from said base;

wherein there is overlap between said first reinforcement layer and said second resorbable reinforcement layer.

2 . The electrode array according to claim 1 , wherein said proximal part has a length greater than or equal to 50 microns and smaller than or equal to 500 microns.

3 . The electrode array according to claim 1 , wherein the distal tips of said shafts have a tip angle inferior to 45°.

4 . The electrode array according to claim 1 , wherein said base comprises one or more orifices.

5 . The electrode array according to claim 1 , wherein said connector cable is a split multi-core meandering cable.

6 . A neural implant, said implant comprising:

one or more neural electrode arrays according to claim 1 ;

an electronics unit;

wherein the connector cables of said one or more electrode arrays are electrically connected to said electronics unit.

7 . The implant according to claim 6 , wherein the bases of said one or more electrode arrays are connected by means of a platform.

8 . The implant according to claim 7 , wherein said platform is created in situ.

9 . The implant according to claim 6 , wherein said one or more electrode arrays are stored on a detachable holder,

wherein said holder separates said one or more electrode arrays from each other.

10 . A method for the fabrication of a neural electrode array according to claim 1 , said method comprising the steps of:

providing a planar substrate coating said substrate with a sacrificial layer;

depositing at least a first layer of electrically insulating material on said sacrificial layer;

depositing one or more metal traces and electrode contacts on said first layer;

depositing at least a second layer of electrically insulating material on said first layer and said metal traces;

applying the first reinforcement layer;

applying the second, resorbable reinforcement layer.

11 . The method according to claim 10 , wherein said first reinforcement layer is applied using a first dip coating process and said second reinforcement layer is applied using a second dip coating process.

12 . The method according to claim 10 , wherein said first reinforcement layer is applied using a molding process and said second reinforcement layer is applied using a dip coating process.

13 . The method according to claim 10 , wherein said first reinforcement layer is applied using a deposition process and said second reinforcement layer is applied using a dip coating process.

14 . The method according to claim 10 , wherein said first reinforcement layer is fabricated separately from an uncoated electrode array;

wherein said first reinforcement layer is attached to said uncoated electrode array and

wherein said second reinforcement layer is applied using a dip coating process.

15 . The method according to claim 10 , wherein the planar substrate is a single-crystal silicon wafer,

wherein the crystal planes of said wafer are inclined at a substantially sharp angle to the surface of said wafer and

wherein said surface is patterned and etched anisotropically to create a mold for said neural electrode array in said wafer.