THERMALLY CONDUCTIVE COMPOSITION
A thermally conductive composition includes a polymer formed from a condensation-curable silyl-modified resin and particulate alumina filler having a high total specific surface area. The composition exhibits a thermal conductivity of at least 1 W/m*K. and is curable without added environmental moisture and with reduced catalyst loading.
1 . A thermally conductive composition, comprising:
a condensation-curable silyl-modified resin; and
particulate alumina filler having a total specific surface area of at least 1 m 2 /g, wherein a portion of the particulate alumina filler has an average particle size of less than 1 μm, the portion comprising 0.1-10 wt. % of the composition;
less than 0.1 wt. % organo-metal catalyst; and
less than 0.5 wt. % water,
wherein the composition exhibits a thermal conductivity of at least 1 W/m*K.
2 . The thermally conductive composition of claim 1 , wherein the particulate alumina is unmodified.
3 . The thermally conductive composition of claim 1 , wherein at least the portion of the particulate alumina filler includes fumed alumina.
4 . The thermally conductive composition of claim 1 , wherein the alumina filler includes at least one of alpha and gamma crystal structure.
5 . The thermally conductive composition of claim 1 , wherein the total specific surface area is between 4 m 2 /g and 150 m 2 /g.
6 . The thermally conductive composition of claim 1 , comprising:
between 1 wt. % and 7 wt. % of the silyl-modified resin; and
between 50 wt. % and 95 wt. % of the particulate alumina filler.
7 . The thermally conductive composition of claim 1 , comprising between 0.1 wt. % and 1 wt. % of the portion of the particulate alumina filler having an average particle size of less than 1 μm.
8 . The thermally conductive composition of claim 1 , comprising between 5 wt. % and 20 wt. % of a plasticizer having a viscosity of less than 100 cP at 25° C.
9 . The thermally conductive composition of claim 1 , wherein:
the silyl-modified resin is a silane-terminated polyether; and/or
the silyl-modified non-silicone polymer includes an alkoxy silane terminal group; and/or
the silyl-modified non-silicone polymer is free of —Si—O— units; and/or
the silyl-modified non-silicone polymer is a two part composition.
10 . The thermally conductive composition of claim 1 , wherein each component has an extrusion rate of greater than 50 g/minute, preferably greater than 150 g/minute and more preferably greater than 300 g/minute when extruded through a Nordson EFD syringe barrel at 90 psi.
11 . Cured reaction products of the thermally conductive composition of claim any one of claim 1 .
12 . Cured reaction products of the thermally conductive composition of claim 1 , having a cured hardness of between 20 Shore 00 and 80 Shore A at 25° C.
13 . A battery system, comprising:
a battery; and
the thermally conductive composition of claim 1 thermally coupled to the battery.
14 . A thermal interface material, comprising:
1-7 wt. % of a condensation-curable silyl-modified resin; and
50-95 wt. % of thermally conductive particulate filler having a particle size distribution, with a first portion of the thermally conductive filler being alumina and comprising between 0.1 wt. % and 10 wt. % of the thermal interface material, and having an average particle size of between 5 nm and 1000 nm and a specific surface area of between 4 m 2 /g and 150 m 2 /g,
wherein the thermal interface material exhibits a thermal conductivity of at least 1 W/m*K, and a cured hardness of between 20 Shore 00 and 80 Shore A at 25 ºC.
15 . The thermal interface material of claim 14 , wherein:
the particulate alumina filler has a total specific surface area of at least 1 m 2 /g; and/or
the first portion of the thermally conductive filler has an average particle size of between 5 nm and 250 nm; and/or
the particulate alumina filler is unmodified.
16 . A two-part curable composition, comprising:
a first part including thermally conductive filler having a particle size distribution, with a first portion of the thermally conductive filler being alumina and comprising between 0.1 wt. % and 10 wt. % of the first part and having an average particle size of between 5 nm and 1000 nm and a specific surface area of between 4 m 2 /g and 150 m 2 /g, and a second portion of the thermally conductive filler comprising between 80 wt. % and 95 wt. % of the first part and having an average particle size of between 1 μm and 100 μm; and
a second part including a condensation-curable silyl-modified resin, wherein the resin is curable with exposure to the first part to a gel condition having a hardness of between 20 Shore 00 and 80 Shore A at 25° C.
17 . The two-part curable composition of claim 16 wherein:
the silyl-modified resin is a silane-terminated polyether; and/or
the silyl-modified non-silicone polymer includes an alkoxy silane terminal group; and/or
the silyl-modified non-silicone polymer is free of —Si—O— units.
18 . The two-part curable composition of claim 16 , wherein the first part includes less than 0.5 wt. % organo-metal catalyst and less than 0.5 wt. % water.
19 . The two-part curable composition of claim 16 , wherein the second part includes between 80 wt. % and 95 wt. % thermally conductive filler selected from alumina, aluminum trihydrate, aluminum nitride, aluminum hydroxide, graphite, zinc oxide, magnesium oxide, silicon carbide, boron nitride, metal particles, and combinations thereof.
20 . The two-part curable composition of claim 16 , wherein the cured material exhibits a thermal conductivity of at least 1 W/m*K.
21 . The two-part curable composition of claim 16 , wherein the cured material includes particulate alumina having a total specific surface area of at least 1 m 2 /g.
22 . (canceled)