Wedge tool and method of manufacturing semiconductor device
A wedge tool according to one aspect of the present disclosure is a wedge tool used for wedge bonding of pressing a metal wire and applying ultrasonic vibration, thereby bonding the metal wire to a bonded body, including: a wire holding groove extending along a longitudinal direction of the metal wire in a tip end portion of the wedge tool and holding the metal wire; and at least two convex parts formed in a groove bottom part of the wire holding groove and having a side surface located away from a sidewall of the wire holding groove and arranged in the longitudinal direction of the metal wire.
1 . A wedge tool used for wedge bonding of pressing a metal wire and applying ultrasonic vibration, thereby bonding the metal wire to a bonded body, comprising:
a wire holding groove extending along a longitudinal direction of the metal wire in a tip end portion of the wedge tool and holding the metal wire, the wire holding groove including a groove bottom part and opposite sidewalls extending from a lowermost point of the groove bottom part; and
at least two columnar convex parts formed in the groove bottom part of the wire holding groove and each having a perimeter vertically extending from the opposite sidewalls of the wire holding groove with opposite outermost side surfaces located away from the opposite sidewalls of the wire holding groove and arranged in the longitudinal direction of the metal wire,
each of the at least two columnar convex parts straddles the lowermost point of the groove bottom part, and
each of the opposite outermost side surfaces begins in contact with a respective one of the opposite sidewalls of the wire holding groove and extends outward from the respective one of the opposite sidewalls to a distal end of the columnar convex part.
2 . A wedge tool used for wedge bonding of pressing a metal wire and applying ultrasonic vibration, thereby bonding the metal wire to a bonded body, comprising:
a wire holding groove extending along a longitudinal direction of the metal wire in a tip end portion of the wedge tool and holding the metal wire, the wire holding groove including a groove bottom part and opposite sidewalls extending from a lowermost point of the groove bottom part; and
columnar convex parts formed in the groove bottom part of the wire holding groove and having heights from the groove bottom part different from each other, and each of the columnar convex parts having a perimeter vertically extending from the opposite sidewalls of the wire holding groove and including a distal portion having opposite outermost side surfaces located away from the opposite sidewalls of the wire holding groove,
each of the columnar convex parts straddles the lowermost point of the groove bottom part, and
each of the opposite outermost side surfaces begins in contact with a respective one of the opposite sidewalls of the wire holding groove and extends outward from the respective one of the opposite sidewalls to a distal end of the columnar convex part.
3 . The wedge tool according to claim 2 , wherein
the columnar convex part includes a first columnar convex part and a second columnar convex part formed away from each other side by side along a longitudinal direction of the metal wire, and the first columnar convex part and the second columnar convex part have lengths from the groove bottom part different from each other.
4 . The wedge tool according to claim 2 , wherein
the columnar convex part includes a first columnar convex part and a second columnar convex part integrally formed in a longitudinal direction of the metal wire, and the first columnar convex part and the second columnar convex part have lengths from the groove bottom part different from each other.
5 . The wedge tool according to claim 1 , wherein
a height of the columnar convex part which is largest from the groove bottom part is within a range of 10±5% of a diameter of the metal wire.
6 . A method of manufacturing a semiconductor device bonding a metal wire and a bonded body, comprising:
a step of pressing the metal wire to the bonded body using the wedge tool according to claim 1 ;
a step of applying ultrasonic vibration while the metal wire is pressed; and
a step of determining whether press force applied to the bonded body is larger than predetermined force by determining whether or not a contact mark is formed in the metal wire by the columnar convex part in the step of pressing the metal wire.
7 . A method of manufacturing a semiconductor device bonding a metal wire and a bonded body, comprising:
a step of pressing the metal wire to the bonded body using the wedge tool according to claim 1 ;
a step of applying ultrasonic vibration while the metal wire is pressed; and
a step of determining appropriateness of press force applied to the bonded body in accordance with a depth of a contact mark formed in the metal wire by the columnar convex part in the step of pressing the metal wire.
8 . A method of manufacturing a semiconductor device bonding a metal wire and a bonded body, comprising:
a step of pressing the metal wire to the bonded body using the wedge tool according to claim 1 ;
a step of applying ultrasonic vibration while the metal wire is pressed; and
a step of determining appropriateness of press force applied to the bonded body in accordance with a total number of contact marks formed in the metal wire by the columnar convex part in the step of pressing the metal wire.
9 . A method of manufacturing a semiconductor device bonding a metal wire and a bonded body, comprising:
a step of pressing the metal wire to the bonded body using the wedge tool according to claim 4 ;
a step of applying ultrasonic vibration while the metal wire is pressed; and
a step of determining appropriateness of press force applied to the bonded body in accordance with a length of a contact mark formed in the metal wire in a longitudinal direction of the metal wire by the columnar convex part in the step of pressing the metal wire.
10 . The wedge tool according to claim 2 , wherein
a height of the columnar convex part which is largest from the groove bottom part is within a range of 10±5% of a diameter of the metal wire.
11 . A method of manufacturing a semiconductor device bonding a metal wire and a bonded body, comprising:
a step of pressing the metal wire to the bonded body using the wedge tool according to claim 2 ;
a step of applying ultrasonic vibration while the metal wire is pressed; and
a step of determining whether press force applied to the bonded body is larger than predetermined force by determining whether or not a contact mark is formed in the metal wire by the columnar convex part in the step of pressing the metal wire.
12 . A method of manufacturing a semiconductor device bonding a metal wire and a bonded body, comprising:
a step of pressing the metal wire to the bonded body using the wedge tool according to claim 2 ;
a step of applying ultrasonic vibration while the metal wire is pressed; and
a step of determining appropriateness of press force applied to the bonded body in accordance with a depth of a contact mark formed in the metal wire by the columnar convex part in the step of pressing the metal wire.
13 . A method of manufacturing a semiconductor device bonding a metal wire and a bonded body, comprising:
a step of pressing the metal wire to the bonded body using the wedge tool according to claim 3 ;
a step of applying ultrasonic vibration while the metal wire is pressed; and
a step of determining appropriateness of press force applied to the bonded body in accordance with a total number of contact marks formed in the metal wire by the columnar convex part in the step of pressing the metal wire.
14 . A method of manufacturing a semiconductor device bonding a metal wire and a bonded body, comprising:
a step of pressing the metal wire to the bonded body using a wedge tool, the wedge tool comprising:
a wire holding groove extending along a longitudinal direction of the metal wire in a tip end portion of the wedge tool and holding the metal wire; and
at least two convex parts formed in a groove bottom part of the wire holding groove and each having a side surface located away from a sidewall of the wire holding groove and arranged in the longitudinal direction of the metal wire;
a step of applying ultrasonic vibration while the metal wire is pressed; and
a step of determining whether press force applied to the bonded body is larger than predetermined force by determining whether or not a contact mark is formed in the metal wire by the convex part in the step of pressing the metal wire.
15 . A method of manufacturing a semiconductor device bonding a metal wire and a bonded body, comprising:
a step of pressing the metal wire to the bonded body using a wedge tool, the wedge tool comprising:
a wire holding groove extending along a longitudinal direction of the metal wire in a tip end portion of the wedge tool and holding the metal wire; and
at least two convex parts formed in a groove bottom part of the wire holding groove and each having a side surface located away from a sidewall of the wire holding groove and arranged in the longitudinal direction of the metal wire;
a step of applying ultrasonic vibration while the metal wire is pressed; and
a step of determining appropriateness of press force applied to the bonded body in accordance with a depth of a contact mark formed in the metal wire by the convex part in the step of pressing the metal wire.
16 . A method of manufacturing a semiconductor device bonding a metal wire and a bonded body, comprising:
a step of pressing the metal wire to the bonded body using a wedge tool, the wedge tool comprising:
a wire holding groove extending along a longitudinal direction of the metal wire in a tip end portion of the wedge tool and holding the metal wire; and
at least two convex parts formed in a groove bottom part of the wire holding groove and each having a side surface located away from a sidewall of the wire holding groove and arranged in the longitudinal direction of the metal wire;
a step of applying ultrasonic vibration while the metal wire is pressed; and
a step of determining appropriateness of press force applied to the bonded body in accordance with a total number of contact marks formed in the metal wire by the convex part in the step of pressing the metal wire.
17 . A method of manufacturing a semiconductor device bonding a metal wire and a bonded body, comprising:
a step of pressing the metal wire to the bonded body using a wedge tool, the wedge tool comprising:
a wire holding groove extending along a longitudinal direction of the metal wire in a tip end portion of the wedge tool and holding the metal wire; and
convex parts formed in a groove bottom part of the wire holding groove and having heights from the groove bottom part different from each other,
wherein the convex part includes a first convex part and a second convex part integrally formed in a longitudinal direction of the metal wire, and the first convex part and the second convex part have lengths from the groove bottom part different from each other;
a step of applying ultrasonic vibration while the metal wire is pressed; and
a step of determining appropriateness of press force applied to the bonded body in accordance with a length of a contact mark formed in the metal wire in a longitudinal direction of the metal wire by the convex part in the step of pressing the metal wire.
18 . A method of manufacturing a semiconductor device bonding a metal wire and a bonded body, comprising:
a step of pressing the metal wire to the bonded body using a wedge tool, the wedge tool comprising:
a wire holding groove extending along a longitudinal direction of the metal wire in a tip end portion of the wedge tool and holding the metal wire; and
convex parts formed in a groove bottom part of the wire holding groove and having heights from the groove bottom part different from each other;
a step of applying ultrasonic vibration while the metal wire is pressed; and
a step of determining whether press force applied to the bonded body is larger than predetermined force by determining whether or not a contact mark is formed in the metal wire by the convex part in the step of pressing the metal wire.
19 . A method of manufacturing a semiconductor device bonding a metal wire and a bonded body, comprising:
a step of pressing the metal wire to the bonded body using a wedge tool, the wedge tool comprising:
a wire holding groove extending along a longitudinal direction of the metal wire in a tip end portion of the wedge tool and holding the metal wire; and
convex parts formed in a groove bottom part of the wire holding groove and having heights from the groove bottom part different from each other;
a step of applying ultrasonic vibration while the metal wire is pressed; and
a step of determining appropriateness of press force applied to the bonded body in accordance with a depth of a contact mark formed in the metal wire by the convex part in the step of pressing the metal wire.