(meth)acrylic-epoxy UV initiated adhesive compositions and adhesive-containing articles
Curable and cured compositions as well as articles that contain the curable or cured compositions are provided. The curable composition comprises (a) a (meth)acrylic-based multiblock copolymer, (b) a random (meth)acylate copolymer comprising a monomeric unit having a pendant poly(alkylene oxide) group, wherein the monomeric unit having the pendant poly(alkylene oxide) group has a number average molecular weight of at least 300 Daltons, (c) an epoxy resin, and (d) a cationic photoinitiator. Articles containing the curable composition can be die-cut and can retain their dimensions with minimal oozing when stored under ambient conditions.
1 . A curable composition comprising:
a) a (meth)acrylic-based multiblock copolymer;
b) a random (meth)acrylate copolymer comprising monomeric units having a pendant poly(alkylene oxide) group, wherein the monomeric unit having the pendant poly(alkylene oxide) group has a number average molecular weight of at least 300 Daltons;
c) an epoxy resin; and
d) a cationic photoinitiator.
2 . The curable composition of claim 1 , wherein the (meth)acrylic-based multiblock copolymer is a triblock copolymer of formula A-B-A where A blocks phase separate from the B block.
3 . The curable composition of claim 2 , wherein each A block comprises monomeric units derived from methyl methacrylate and the B block comprises monomeric units derived from n-butyl (meth)acrylate.
4 . The curable composition of claim 1 , wherein the curable composition comprises 5 to 60 weight percent of the (meth)acrylic-based multiblock copolymer based on a total weight of resin components in the curable composition.
5 . The curable composition of claim 1 , wherein the pendant (alkylene oxide) group on the random (meth)acrylate copolymer is a poly(ethylene oxide) group, a poly(propylene oxide) group, a poly(tetramethylene oxide) group, or a copolymer thereof.
6 . The curable composition of claim 1 , wherein the random (meth)acylate copolymer is crosslinked.
7 . The curable composition of claim 1 , wherein the curable composition comprises 30 to 85 weight percent random (meth)acrylate copolymer based on a total weight of resin components in the curable composition.
8 . The curable composition of claim 1 , wherein the curable composition comprises 10 to 50 weight percent epoxy resin based on a total weight of the resin components in the curable composition.
9 . The curable composition of claim 1 , wherein the curable composition is free or contains less than 0.1 weight percent of a liquid polyether polyol based on a total weight of resin components in the curable composition.
10 . The curable composition of claim 1 , wherein the random (meth)acrylate copolymer consists of monomeric units derived from a) a (meth)acrylate macromer having a pendent poly(alkylene oxide) group, wherein the pendant poly(alkylene oxide) group is the pendant poly(alkylene oxide) group of claim 1 ; b) an alkyl (meth)acrylate; and c) optionally at least one polar monomer that is free of an acidic group and free of a nitrogen-containing group.
11 . A first article comprising:
a curable composition according to claim 1 ; and
a first substrate or a first release liner positioned adjacent to a first surface of the curable composition.
12 . The first article of claim 11 , wherein the article comprises the curable composition, the first release liner positioned adjacent to the first surface of the curable composition, and a second release liner positioned adjacent to a second surface of the curable composition opposite the first release liner.
13 . The first article of claim 11 , wherein the first article is in a roll.
14 . The first article of claim 11 , wherein the first article is a die-cut part suitable for adhering a first component to a second component.
15 . A cured composition comprising a reaction product of the curable composition of claim 1 .
16 . A second article comprising:
a first substate;
a second substrate; and
the cured composition of claim 15 positioned between the first substrate and the second substrate, wherein the first substate is bonded to the second substrate with the cured composition.