APPARATUSES INCORPORATING MICRO-LEDS AND METHODS FOR FABRICATING THE SAME
In accordance with one or more aspects of the present disclosure, an apparatus including pixels is provided. The apparatus may include a first micro light-emitting device configured to emit light of a first color, a second micro light-emitting device configured to emit light of a second color, and a third micro light-emitting device for emitting light of a third color. The first micro light-emitting device includes a first light-emitting structure for emitting light of the first color. The second micro light-emitting device includes a second light-emitting structure for emitting light of the first color. The third micro light-emitting device includes a light-emitting structure for emitting light of the third color that is formed on a third light-emitting structure for emitting light of the first color.
1 . An apparatus, comprising:
a plurality of light-emitting devices for emitting light of a first color; and
a light-emitting device for emitting light of a second color, wherein the light-emitting device for emitting light of the second color is fabricated on a first light-emitting device of the plurality of light-emitting devices for emitting light of the first color.
2 . The apparatus of claim 1 , wherein the light-emitting device for emitting light of the second color is electrically connected to a conductive pad, and wherein the first light-emitting device of the plurality of light-emitting devices for emitting light of the first color is bonded to the conductive pad.
3 . The apparatus of claim 2 , wherein the light-emitting device for emitting light of the second color is bonded to the first light-emitting device of the plurality of light-emitting devices for emitting light of the first color.
4 . The apparatus of claim 3 , further comprising a conductive via fabricated in the first light-emitting device of the plurality of light-emitting devices for emitting light of the first color.
5 . The apparatus of claim 3 , a sidewall of the first light-emitting device of the plurality of light-emitting devices for emitting light of the first color is coated with a conductive material.
6 . The apparatus of claim 5 , wherein the light-emitting device for emitting light of the second color is electrically connected to the conductive pad through the conductive material.
7 . The apparatus of claim 1 , further comprising:
a light-conversion structure that converts light emitted by a second light-emitting device of the plurality of light-emitting devices for emitting light of the first color into light of a third color.
8 . The apparatus of claim 7 , wherein the light-conversion structure comprises a plurality of quantum dots.
9 . The apparatus of claim 8 , further comprising an electrode layer, wherein the electrode layer is fabricated on the light-emitting device for emitting light of the second color, the second light-emitting device of the plurality of light-emitting devices for emitting light of the first color, and a third light-emitting device of the plurality of light-emitting devices for emitting light of the first color.
10 . The apparatus of claim 9 , further comprising a plurality of metal sidewalls fabricated on the electrode layer.
11 . The apparatus of claim 1 , further comprising a substrate, wherein the plurality of light-emitting devices for emitting light of the first color is bonded to the substrate.
12 . A method, comprising:
fabricating, in a first light-emitting stack configured to emit light of a first color, a conductive via;
fabricating, on the conductive via, a light-emitting device for emitting light of a second color;
selectively removing one or more portions of the first light-emitting stack to fabricate a plurality of light-emitting devices for emitting light of the first color, wherein the light-emitting device for emitting light of the second color is fabricated on a first light-emitting device of the plurality of light-emitting devices for emitting light of the first color.
13 . The method of claim 12 , wherein fabricating the conductive via in the first light-emitting stack comprises creating an opening in the first light-emitting stack and depositing a metallic material in the opening.
14 . The method of claim 13 , wherein the first light-emitting stack is bonded to a substrate prior to fabricating the conductive via.
15 . The method of claim 12 , further comprising fabricating a light-conversion structure on a second light-emitting device of the plurality of light-emitting devices for emitting light of the first color.
16 . The method of claim 15 , wherein the light-conversion structure comprises a plurality of quantum dots.
17 . The method of claim 12 , wherein fabricating, on the conductive via, the light-emitting device for emitting light of the second color comprises:
bonding a second light-emitting stack to the first light-emitting stack and the conductive via; and
selectively removing one or more portions of the second light-emitting stack to form the light-emitting device for emitting light of the second color.
18 . The method of claim 12 , further comprising fabricating an electrode layer, wherein the electrode layer provides ohmic contact for the light-emitting device for emitting light of the second color and the second light-emitting device of the plurality of light-emitting devices for emitting light of the first color.
19 . The method of claim 18 , further comprising bonding a light-conversion structure to the electrode layer.
20 . The method of claim 12 , wherein the first light-emitting stack comprises a plurality of epitaxial layers of a group III-V material.