Heat dissipation structure, high-voltage distribution box, battery, and electrical device
View Patent ↗A heat dissipation structure includes a housing configured to form an accommodation cavity and a heat source disposed in the accommodation cavity. The heat source includes a heat dissipation surface, and the heat source includes a first connecting portion. The heat dissipation structure further includes a heat transfer block inserted in the housing and including at least one surface exposed outside the housing, a first heat transfer surface, and a second connecting portion. The first connecting portion is connected to the second connecting portion directly or through a connecting piece so that the first heat transfer surface keeps in close fit with the heat dissipation surface.
1 . A heat dissipation structure, comprising:
a housing, configured to form an accommodation cavity, wherein the housing comprises a wall assembly, the wall assembly wraps around to form a mounting through-hole;
a heat source, wherein the heat source is disposed in the accommodation cavity, the heat source comprises a heat dissipation surface, and the heat source comprises a first connecting portion;
a heat transfer block inserted in the housing and disposed in the mounting through-hole, and the wall assembly is in close fit with an outer wall of the heat transfer block, the heat transfer block comprises at least one surface exposed outside the housing, the heat transfer block comprises a first heat transfer surface, and the heat transfer block comprises a second connecting portion; and
a heat transfer plate, the heat transfer block further comprises a second heat transfer surface located outside the accommodation cavity, and the second heat transfer surface is in close fit with the heat transfer plate;
wherein the first connecting portion is connected to the second connecting portion directly or through a connecting piece so that the first heat transfer surface keeps in close fit with the heat dissipation surface.
2 . The heat dissipation structure according to claim 1 , wherein the connecting piece passes through the first connecting portion and the second connecting portion to keep the close fit between the first heat transfer surface and the heat dissipation surface.
3 . The heat dissipation structure according to claim 1 , wherein the first connecting portion is a first connecting hole located on the heat dissipation surface, the second connecting portion is a second connecting hole located on the first heat transfer surface, and the connecting piece passes through the first connecting hole and the second connecting hole sequentially and is in threaded fit with at least the second connecting hole.
4 . The heat dissipation structure according to claim 1 , wherein the first connecting portion is a hook structure, the second connecting portion is a slot structure, and the first connecting portion and the second connecting portion are able to be snap-fastened to each other to keep the close fit between the first heat transfer surface and the heat dissipation surface.
5 . The heat dissipation structure according to claim 1 , wherein the housing further comprises a bottom plate, and the wall assembly is disposed protrusively on the bottom plate.
6 . The heat dissipation structure according to claim 1 , wherein the heat dissipation structure comprises two mounting through-holes and two heat transfer blocks, the two heat transfer blocks are disposed in the two mounting through-holes respectively, and the two heat transfer blocks are located at two ends of the heat source respectively.
7 . The heat dissipation structure according to claim 1 , wherein the heat transfer block is a hollow structure.
8 . The heat dissipation structure according to claim 1 , wherein the heat transfer block is a columnar structure, and the first heat transfer surface and the second heat transfer surface are located at two ends of the columnar structure respectively.
9 . The heat dissipation structure according to claim 1 , wherein a cooling flow channel that allows passage of a cooling liquid is disposed inside the heat transfer plate.
10 . The heat dissipation structure according to claim 1 , further comprising: a deformable heat transfer pad, and the heat transfer pad is disposed between the second heat transfer surface and the heat transfer plate.
11 . A high-voltage distribution box, comprising:
the heat dissipation structure according to claim 1 ;
wherein the heat source comprises a first electrical connecting piece and a second electrical connecting piece, the first electrical connecting piece is connected to the second electrical connecting piece, and the first electrical connecting piece comprises the heat dissipation surface.
12 . The high-voltage distribution box according to claim 11 , wherein:
the second connecting portion is a second connecting hole located on the first heat transfer surface;
the first electrical connecting piece comprises a third connecting hole; the second electrical connecting piece comprises a fourth connecting hole; and
the connecting piece passes through the fourth connecting hole, the third connecting hole, and the second connecting hole, and is in threaded fit with at least the second connecting hole so that the first electrical connecting piece, the second electrical connecting piece, and the heat transfer block are connected sequentially.
13 . The high-voltage distribution box according to claim 11 , wherein the first electrical connecting piece is a fuse, and the second electrical connecting piece is a high-voltage copper busbar.
14 . A battery, comprising the high-voltage distribution box according to claim 11 .
15 . An electrical device, comprising the battery according to claim 14 , wherein the battery is configured to provide electrical energy.