Substrate unit
A substrate unit includes a circuit board, a connector portion installed at the front end portion of the upper side of the circuit board, a busbar connected to the circuit board and fixed to the lower side of the circuit board, a bottom portion including a recessed portion overlapping the front end portion of the circuit board and arranged on the lower side of the busbar, and a bonding layer fixing the busbar to the bottom portion. The busbar includes a non-bonding region that faces the recessed portion. A bonding region includes the bonding layer surrounding three sides other than a front side, namely a left side, a right side, and a rear side, of the non-bonding region. Notches are located on a left side and a right side of the front end portion and overlap extension lines of boundary between the non-bonding and the bonding region.
1. A substrate unit comprising:
a circuit board;
a connector portion that is installed at a front end portion of an upper side of the circuit board;
a busbar that is connected to the circuit board and is fixed to a lower side of the circuit board;
a bottom portion that includes a recessed portion formed at a position overlapping the front end portion of the circuit board and that is arranged on a lower side of the busbar; and
a bonding layer that fixes the busbar to the bottom portion,
wherein the busbar includes:
a non-bonding region that faces the recessed portion and is not provided with the bonding layer;
a bonding region in which the bonding layer is provided surrounding three sides other than a front side, namely a left side, a right side, and a rear side, of the non-bonding region; and
notches that are located on a left side and a right side of the front end portion and that overlap extension lines of boundary between the non-bonding region and the bonding region.
2. The substrate unit according to claim 1 , wherein the notches have a triangular shape, and one side of the triangular shape is along a front edge of the busbar.
3. The substrate unit according to claim 1 , wherein the bonding layer contains epoxy resin.