System-in-package network processors

1. An integrated circuit device comprising:

a base die that comprises memory; and

an application-specific integrated circuit die coupled to the base die via an interface, wherein the application-specific integrated circuit die and the base die are vertically aligned so the base die is vertically below at least a portion of a surface area of the application-specific integrated circuit die with a region of the application-specific integrated circuit die being vertically aligned with a corresponding region-aligned memory of the memory of the base die that is allocated to the region, wherein the application-specific integrated circuit die is to implement a processing function that uses the region-aligned memory.

2. The integrated circuit device of claim 1 , wherein the processing function employs a data structure for performance of the processing function or a data packet to be processed by the processing function, or both, and wherein the base die stores the data structure, the data packet, or both.

3. The integrated circuit device of claim 1 , wherein the interface comprises a high-density interconnect, a 3D interconnect, or a microbump interconnect.

4. The integrated circuit device of claim 1 , wherein the application-specific integrated circuit die is to implement a processor.

5. The integrated circuit device of claim 4 , wherein the processor is implemented in the region of the application-specific integrated circuit die and accesses a data structure or data packet stored in a first region-aligned memory circuitry associated with the region.

6. The integrated circuit device of claim 4 , wherein the processor is implemented in the region of the application-specific integrated circuit, a data structure is stored in a second region-aligned memory, and the processor accesses the data structure using a network-on-chip (NOC) of the base die.

7. The integrated circuit device of claim 1 , wherein the application-specific integrated circuit die is to implement a network processor.

8. The integrated circuit device of claim 7 , wherein the application-specific integrated circuit die is configured to implement a programmable logic in the application-specific integrated circuit die.

9. The integrated circuit device of claim 7 , wherein the network processor is to implement a quality of service (QOS) functionality, a packet filtering functionality, a packet routing, an encryption functionality, a decryption functionality, an error checking functionality, a direct memory access management functionality, or a look-up table functionality, or a combination thereof.

10. A system comprising:

a memory; and

a processing device comprising:

a base die that comprises on-package memory comprising a plurality of regions; and

a processor die having a plurality of regions, wherein the processor die and the base die are vertically aligned so the base die is vertically below at least a portion of a surface area of the processor die with the plurality of regions of the base die vertically aligned to corresponding regions of the plurality of regions of the processor die, and the processing device is operable to execute processes using data from the base die.

11. The system of claim 10 , wherein the processor die comprises an application-specific integrated circuit (ASIC) or a general-purpose processor, or any combination thereof.

12. The system of claim 10 , wherein the processing device is configured to:

implement a first function configured to exchange data with the on-package memory in the base die using a high-speed interface between the processor die and the base die; and

utilize buffer manager circuitry configured to exchange data with the memory.

13. The system of claim 12 , wherein the first function comprises processing header data, and wherein the buffer manager circuitry processes payload data and stores a link data structure that associates a header of the header data with a payload of the payload data.

14. The system of claim 12 , wherein the buffer manager circuitry exchanges payloads with the memory or references to payloads with the memory.

15. The system of claim 12 , wherein the processor die is programmable to swap the first function for a second function in the processor die.

16. The system of claim 10 , wherein the processing device comprises a data bridge that receives data in a first protocol and transmits data in a second protocol different from the first protocol.

17. The system of claim 10 , comprising an interface that comprises a high-density interconnect, a 3D interconnect, or a microbump interconnect between the base die and the processor die.

18. A system comprising:

a memory die that comprises on-package memory comprising a plurality of regions; and

a network processor die to implement a network processor and having a plurality of regions, wherein the processor die and the memory die are vertically aligned so the memory die is vertically below at least a portion of a surface area of the processor die with the plurality of regions of the memory die vertically aligned to corresponding regions of the plurality of regions of the network processor die, and the network processor is operable to execute processes using data from the memory die.

19. The system of claim 18 , wherein the network processor is to:

implement a first virtual network function (VNF) profile that comprises a first processing function;

switch from the first processing function to a second processing function; and

implement a second VNF profile that comprises the second processing function.

20. The system of claim 19 , wherein the first processing function and the second processing function each comprise at least one of a quality of service (QOS) functionality, a packet filtering functionality, a packet routing, an encryption functionality, a decryption functionality, an error checking functionality, a direct memory access management functionality, or a look-up table functionality, or a combination thereof, and the first processing function and the second processing functions are different.