Low stress asymmetric dual side module
Implementations of semiconductor packages may include a first substrate having two or more die coupled to a first side, a clip coupled to each of the two or more die on the first substrate and a second substrate having two or more die coupled to a first side of the second substrate. A clip may be coupled to each of the two or more die on the second substrate. The package may include a lead frame between the first substrate and the second substrate and a molding compound. A second side of each of the first substrate and the second substrate may be exposed through the molding compound. A perimeter of the first substrate and a perimeter of the second substrate may not fully overlap when coupled through the lead frame.
1. A method of forming semiconductor packages, the method comprising:
providing a first panel of a plurality of first substrates and a second panel of a plurality of second substrates;
printing a first sintering material on the first panel of the plurality of first substrates and the second panel of the plurality of second substrates in predetermined locations;
coupling two or more die to each of the first panel of the plurality of first substrates and the second panel of the plurality of second substrates at the predetermined locations;
dispensing a second sintering material onto each of the two or more die;
coupling a clip to each of the two or more die;
electrically coupling the two or more die to the plurality of first substrates and the plurality of second substrates;
singulating the first panel and the second panel into the plurality of first substrates and the plurality of second substrates, respectively;
dispensing solder onto a plurality of predetermined locations on a first substrate of the first plurality of substrates and a second substrate of the second plurality of substrates;
coupling the first substrate of the plurality of first substrates to a first side of a lead frame; and
coupling the second substrate of the plurality of second substrates to a second side of the lead frame.
2. The method of claim 1 , further comprising trimming the lead frame to expose a plurality of leads.
3. The method of claim 1 , further comprising encapsulating the lead frame on the first side and the second side, wherein a second side of each of the first substrate and the second substrate is exposed.
4. The method of claim 1 , further comprising directly coupling the clip to the first substrate and the second substrate through the first sintering material.
5. The method of claim 1 , further comprising coupling a heat sink with one of the first substrate, the second substrate, or any combination thereof.
6. The method of claim 1 , further comprising coupling one or more leads with one of a C-shaped or S-shaped cross sectional shape between the first substrate and the second substrate.
7. The method of claim 1 , wherein the first substrate and the second substrate are asymmetrically coupled through the lead frame.
8. A method of forming a semiconductor package, the method comprising:
coupling a first die to a first substrate through a first sintering material;
coupling a second die to a second substrate through a second sintering material;
coupling a first clip to the first die through a third sintering material;
coupling a second clip to the second die through a fourth sintering material;
coupling the first substrate to a lead frame;
coupling the second substrate to the lead frame, wherein the lead frame is directly coupled to and between the first substrate and the second substrate upon coupling the second substrate to the lead frame; and
partially encapsulating the lead frame in a molding compound.
9. The method of claim 8 , wherein only a portion of the first substrate is coupled directly under the second substrate and only a portion of the second substrate is coupled directly over the first substrate.
10. The method of claim 8 , further comprising coupling a heat sink with one of the first substrate, the second substrate, or any combination thereof.
11. The method of claim 8 , further comprising coupling one or more leads with one of a C-shaped or S-shaped cross sectional shape between the first substrate and the second substrate.
12. The method of claim 8 , further comprising coupling a third die to the first substrate through the first sintering material, coupling a fourth die to the second substrate through the second sintering material, coupling a third clip to the third die through the third sintering material, and coupling a fourth clip to the fourth die through the fourth sintering material.
13. The method of claim 11 , wherein the one or more leads is directly coupled to a terminal of the first substrate and a terminal of the second substrate and wherein the terminal of the first substrate is aligned with the terminal of the second substrate.
14. The method of claim 11 , wherein the one or more leads is directly coupled to a terminal of the first substrate and a terminal of the second substrate and wherein the terminal of the first substrate is misaligned with the terminal of the second substrate.
15. A method of forming a semiconductor package, the method comprising:
coupling a first die to a first substrate through a first sintering material;
coupling a second die to a second substrate through a second sintering material; and
asymmetrically coupling the first substrate to the second substrate through a lead frame that is directly coupled to the first substrate and the second substrate; and
at least partially encapsulating the lead frame in a molding compound.
16. The method of claim 15 , further comprising coupling a plurality of clips to the first substrate and the second substrate.
17. The method of claim 15 , wherein a perimeter of a first side of the first substrate extends outside of a perimeter of a first side of the second substrate and the perimeter of the first side of the second substrate extends outside of the perimeter of the first side of the first substrate, wherein the first side of the first substrate faces the first side of the second substrate.
18. The method of claim 15 , further comprising coupling one or more leads with a cross sectional shape that provides separation between the first substrate and the second substrate.
19. The method of claim 15 , further comprising coupling a first clip directly to the first die through a third sintering material and coupling a second clip directly to the second die through a fourth sintering material.
20. The method of claim 15 , further comprising coupling a first clip directly to the first substrate through the first sintering material and coupling a second clip directly to the second substrate through the second sintering material.