IP Library › Patent Application 18597644
Patent Application
App. No. 18/597,644

X-RAY DETECTOR COMPONENT, X-RAY DETECTION MODULE, IMAGING DEVICE AND METHOD FOR MANUFACTURING AN X-RAY DETECTOR COMPONENT

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Patent No.
US None
App. No.
18/597,644
Abstract

The invention relates to an X-ray detector component including an X-ray detector chip made from a silicon substrate and comprising charge collecting electrodes. The X-ray detector chip is suitable for providing an X-ray-dependent current at the charge collecting electrodes. The X-ray detector component further includes a CMOS read-out circuit chip including connection electrodes. The X-ray detector chip and the CMOS read-out circuit chip are mechanically and electrically connected in such a manner that the charge collecting electrodes and the connection electrodes are electrically connected. The invention further relates to an X-ray detection module, an imaging device and a method for manufacturing an X-ray detector component.

Claims (28)

1 . An X-ray detector component comprising:

an X-ray detector chip made from a silicon substrate and comprising charge collecting electrodes; the X-ray detector chip being suitable for providing an X-ray-dependent current at the charge collecting electrodes; and

a CMOS read-out circuit chip comprising connection electrodes,

wherein the X-ray detector chip and the CMOS read-out circuit chip are mechanically and electrically connected in such a manner that the charge collecting electrodes and the connection electrodes are electrically connected, and

wherein the X-ray-detector chip is free of GaAs and/or CdTe and/or CdZnTe.

2 . The X-ray detector component according to claim 1 , wherein the X-ray detector chip comprises a plurality of detector elements.

3 . The X-ray detector component according to claim 1 , wherein the X-ray detector chip and the CMOS read-out circuit chip are connected by at least one hybrid bond.

4 . The X-ray detector component according to claim 1 , wherein the X-ray detector chip and the CMOS read-out circuit chip are connected by solder means.

5 . The X-ray detector component according to claim 1 , wherein the X-ray detector chip comprises a direct X-ray detector.

6 . The X-ray detector component according to claim 1 , wherein the X-ray detector chip comprises a single-photon detector.

7 . The X-ray detector component according to claim 6 , wherein the X-ray detector chip comprises a single-photon avalanche photodiode.

8 . The X-ray detector component according to claim 1 , wherein the charge collecting electrodes are formed in such a manner that field lines between a top electrode of the X-ray detector chip and the charge collecting electrodes are curved towards the charge collecting electrodes.

9 . The X-ray detector component according to claim 1 , wherein trenches extend between the charge collecting electrodes.

10 . The X-ray detector component according to claim 9 , wherein the trenches are filled with a non-conducting material.

11 . The X-ray detector component according to claim 1 , wherein the X-ray-detector chip is suitable to operate with X-ray photon energies equal or less than 100 keV.

12 . The X-ray detector component according to claim 1 , wherein the CMOS read-out circuit chip comprises a photon counter circuit.

13 . The X-ray detector component according to claim 1 , wherein the X-ray-detector chip is configured to detect X-ray energies in the range between 25 keV and 35 keV.

14 . The X-ray detector component according to claim 1 , wherein the X-ray-detector chip comprises a top electrode arranged on a top side of the detector chip and the charge collecting electrodes are arranged on a bottom side of the detector chip.

15 . The X-ray detector component according to claim 1 , wherein the silicon substrate is depleted, in particular fully depleted.

16 . The X-ray detector component according to claim 1 , wherein a back end of line of the CMOS read-out circuit chip faces the X-ray detector chip.

17 . An X-ray detection module comprising a multitude of X-ray detector components according to claim 1 .

18 . An imaging device comprising an X-ray detection module according to claim 17 , the imaging device being an imaging medical device, e.g., for mammography or dental X-raying, or a screening device, e.g., for material failure analysis or baggage scanning or packet scanning.

19 . A method for manufacturing an X-ray detector component, the method comprising:

providing an X-ray detector wafer comprising a plurality of charge collecting electrodes;

providing a CMOS read-out circuit wafer comprising a plurality of connection electrodes;

mechanically and electrically connecting the X-ray detector wafer and the CMOS read-out circuit wafer in such a manner that the charge collecting electrodes and the connection electrodes are electrically connected; and

separating the X-ray detector wafer and CMOS read-out circuit wafer, which are connected, into a plurality of X-ray detector components, wherein

the X-ray-detector chip is free of GaAs, and/or of CdTe and/or of CdZnTe.

Assignments (2)
CHANGE OF NAME Recorded Sep 21, 2026
From: TITAN NEWCO AG
To: INFINEON TECHNOLOGIES INTERNATIONAL SWITZERLAND AG
Reel/Frame 076079/0939 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 7, 2024
From: HOFRICHTER, JENS
To: AMS INTERNATIONAL AG
Reel/Frame 066688/0752 →