Method of using resistance soldering device
A method of method of resistance soldering may include providing a controllable electrical power supply having a negative pole and a positive pole. The method may include providing an electrical terminal having a first surface and a second surface opposite the first surface on which a solder layer is disposed. The method may include providing a resistance soldering device with an electrode having a first electrical conductor connected to the positive pole of the electrical power supply, a second electrical conductor connected to the negative pole of the electrical power supply, an electrically resistive bridge interconnecting the first and second electrical conductors. The method may include turning the electrical power supply on to provide an electrical current between the positive and negative poles. The method may include contacting the electrode to the first surface of the electrical terminal.
1. A method of resistance soldering, comprising:
a) providing a controllable electrical power supply having a negative pole and a positive pole;
b) providing an electrical terminal having a first surface and a second surface opposite the first surface on which a solder layer is disposed;
c) providing a resistance soldering device with an electrode having a first electrical conductor connected to the positive pole of the electrical power supply, a second electrical conductor connected to the negative pole of the electrical power supply, an electrically resistive bridge interconnecting the first and second electrical conductors;
d) turning the electrical power supply on to provide an electrical current between the positive and negative poles; and
e) contacting the electrode to the first surface of the electrical terminal.
2. The method in accordance with claim 1 , wherein the electrode is a first electrode and wherein the resistance soldering device further comprises a second electrode and wherein step e) further comprises contacting the first and second electrodes on two distinct points on the first surface of the electrical terminal.
3. The method in accordance with claim 2 , wherein the resistance soldering device further comprises a mechanism holding the first and second electrodes and wherein step e) further comprises varying a distance between free ends of the first and second electrodes via the mechanism.
4. The method in accordance with claim 1 , wherein the electrode includes a thermally conductive foot defining a pair of projections sized, shaped, and arranged to contact the electrical terminal on at least two different points and configured to contact the first surface of the electrical terminal and wherein step e) further comprises contacting the pair of projections on two distinct points on the first surface of the electrical terminal.
5. The method in accordance with claim 4 , wherein the thermally conductive foot is configured to be removeable from the resistance soldering device and replaceable with another thermally conductive foot defining a different pair of projections configured to contact a different electrical terminal configuration on at least two different points and wherein the method further comprises:
f) detaching the thermally conductive foot from the resistance soldering device; and
g) attaching the another thermally conductive foot to the resistance soldering device.
6. The method in accordance with claim 1 , wherein the electrode comprises a temperature measuring device and wherein the method further comprises:
h) determining a temperature of the electrode via the temperature measuring device;
i) determining whether the temperature at least meets a temperature threshold; and
j) performing step e) in accordance with the temperature at least meeting the temperature threshold.
7. The method in accordance with claim 1 , wherein the resistance soldering device further includes a cooling device configured to cool the electrical terminal and wherein the method further comprises:
k) turning off the electrical power supply provided to the positive and negative poles; and
l) cooling the electrical terminal and the solder layer via the cooling device, wherein steps k) and l) are performed after completion of step e).
8. The method in accordance with claim 7 , wherein the cooling device is a tube connected to an air movement device.
9. The method in accordance with claim 1 , wherein the resistance soldering device further includes a spring device configured to apply a compressive force between the electrode and the electrical terminal and wherein the method further comprises:
m) applying the compressive force to the electrical terminal, wherein step m) is performed concurrently with step e).
10. The method in accordance with claim 9 , wherein the spring device is a helical compression spring.