Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
A substrate processing apparatus includes: a processing module including a process container in which at least one substrate is processed and a substrate loading port installed at a front side of the processing module, a utility system including a supply system which supplies a processing gas into the first process container and a surface of the first utility system is connected or arranged close to a rear surface of the processing module; a vacuum-exhauster behind the processing module and configured to exhaust an inside of the process container; an exhaust pipe that brings the process container into fluid communication with the vacuum-exhauster; a pipe housing which supports the exhaust pipe; and a first vibration-damping fastener connecting the vacuum-exhauster and the pipe housing. The exhaust pipe includes a first flexible portion that allows displacement of the exhaust pipe's end, and the vacuum-exhauster and pipe housing are installed at a floor.
1 . A substrate processing apparatus, comprising:
a processing module including a process container in which at least one substrate is processed and a first gate valve installed at a front side of the processing module;
a utility system including a supply system configured to supply a processing gas into the process container, a surface of the utility system is connected or arranged close to a rear surface of the processing module;
a vacuum-exhauster arranged behind the processing module and configured to exhaust an inside of the process container;
an exhaust pipe configured to bring the process container into fluid communication with the vacuum-exhauster;
a pipe housing configured to support the exhaust pipe; and
a first vibration-damping fastener connecting the vacuum-exhauster and the pipe housing,
wherein the exhaust pipe includes a first flexible portion configured to allow displacement of an end of the exhaust pipe and installed outside the vacuum-exhauster, and
wherein the vacuum-exhauster and the pipe housing are installed at a floor.
2 . The substrate processing apparatus of claim 1 , wherein the first vibration-damping fastener and the first flexible portion are configured to be capable of suppressing a vibration transmitted from the vacuum-exhauster to the process container.
3 . The substrate processing apparatus of claim 1 , wherein the pipe housing is installed outside the processing module, and includes a frame and a panel configured to cover an outside of the frame, and
wherein the pipe housing further includes a vibration-damper which is installed on at least one connector between the frame and the exhaust pipe.
4 . The substrate processing apparatus of claim 1 , further comprising a second vibration-damping fastener which connects the processing module and the pipe housing, and
wherein the first vibration-damping fastener and the second vibration-damping fastener are made of resin or rubber.
5 . The substrate processing apparatus of claim 3 , wherein the first flexible portion is installed on a side of the exhaust pipe adjacent to the vacuum-exhauster, and the at least one connector is installed closer to the process container than the first flexible portion.
6 . The substrate processing apparatus of claim 3 , wherein the first flexible portion is further configured such that a fixer configured to fix both ends of the first flexible portion is attachable to the first flexible portion.
7 . The substrate processing apparatus of claim 1 , wherein the vacuum-exhauster and the pipe housing are installed at the floor so that an air intake port of the vacuum-exhauster is at the same height as an exhaust port of the process container.
8 . The substrate processing apparatus of claim 3 , wherein the vibration-damper is made of a vibration-damping alloy that absorbs mechanical vibration, and the first vibration-damping fastener is made of resin or rubber.
9 . The substrate processing apparatus of claim 1 , wherein the exhaust pipe includes a plurality of separable sections connected via elastic seals, and at least one connector is installed at each of the sections.
10 . The substrate processing apparatus of claim 1 , wherein the exhaust pipe includes a second flexible portion configured to allow displacement of another end of the exhaust pipe, and
wherein the apparatus further comprises a holder that bridges both sides of the second flexible portion to bear a load generated between the both sides of the second flexible portion, and is made of a vibration-damping member.
11 . The substrate processing apparatus of claim 3 , wherein the vibration-damper has a plate-shape, and
wherein the vibration-damper is configured to support at least a portion of a gravity applied to the exhaust pipe as a shear load in a direction parallel to a plate-shaped surface of the vibration-damper.
12 . The substrate processing apparatus of claim 1 , wherein the vacuum-exhauster is a pump having a rotor rotating shaft extending in a vertical direction.
13 . The substrate processing apparatus of claim 1 , wherein the vacuum-exhauster is installed at the floor via a vibration-damping member.
14 . A substrate processing apparatus, comprising:
a processing module including a process furnace in which at least one substrate is processed and a first gate valve installed at a front side of the processing module;
a utility system including a supply system configured to supply a processing gas into the process furnace, a surface of the utility system is connected or arranged close to a rear surface of the processing module;
a vacuum-exhauster arranged behind the processing module and configured to exhaust an inside of the process furnace;
an exhaust pipe configured to bring the process furnace into fluid communication with the vacuum-exhauster;
a pipe housing configured to support the exhaust pipe; and
a first vibration-damper fastener connecting the vacuum-exhauster and the pipe housing,
wherein the exhaust pipe includes a first flexible portion configured to allow displacement of an end of the exhaust pipe and installed outside the vacuum-exhauster.
15 . The substrate processing apparatus of claim 14 , wherein the exhaust pipe further includes a connector connecting the exhaust pipe to the pipe housing at a position closer to the process furnace than the first flexible portion.
16 . The substrate processing apparatus of claim 14 , wherein the vacuum-exhauster and the pipe housing are installed at a floor.
17 . A substrate processing method comprising:
providing the substrate processing apparatus of claim 1 ; and
processing the at least one substrate in the process container while damping a vibration transmitted from the vacuum-exhauster to the process container via the exhaust pipe.
18 . A method of manufacturing a semiconductor device comprising the substrate processing method of claim 17 .
19 . The substrate processing apparatus of claim 1 , wherein the pipe housing is installed outside the processing module, and includes a frame, a panel configured to cover an outside of the frame and at least one connector connecting the exhaust pipe to the frame.
20 . The substrate processing apparatus of claim 19 , wherein the first vibration-damping fastener is configured to be capable of suppressing transmission of a vibration from the vacuum-exhauster to the process container through the pipe housing, and
wherein the first flexible portion is configured to be capable of suppressing the vibration transmitted from the vacuum-exhauster to the process container through the exhaust pipe.