Multilayer ceramic capacitor including step layers with different thicknesses
A multilayer ceramic electronic component includes a multilayer body including first and second internal electrode layers each alternately laminated with ceramic layers and exposed at a respective end surface, first step layers on a same plane as a respective one of the second internal electrode layers and exposed at a first end surface, and second step layers on a same plane as a respective one of the first internal electrode layers and exposed at a second end surface. The first step layers each have a thickness in a height direction of the multilayer body greater at a location closer to the first main surface than the second main surface, and the second step layers each have a thickness in the height direction of the multilayer body greater at a location closer to the first main surface than the second main surface.
1 . A multilayer ceramic electronic component comprising:
a multilayer body including a plurality of laminated ceramic layers, a first main surface and a second main surface opposed to each other in a height direction, a first lateral surface and a second lateral surface opposed to each other in a width direction orthogonal or substantially orthogonal to the height direction, a first end surface and a second end surface opposed to each other in a length direction orthogonal or substantially orthogonal to the height direction and the width direction, a plurality of first internal electrode layers that are each alternately laminated with a respective one of the plurality of ceramic layers and each exposed at the first end surface, a plurality of second internal electrode layers that are each alternately laminated with a respective one of the plurality of ceramic layers and each exposed at the second end surface, a plurality of first step layers that are each provided on a same plane as a respective one of the plurality of second internal electrode layers and each exposed at the first end surface, and a plurality of second step layers that are each provided on a same plane as a respective one of the plurality of first internal electrode layers and each exposed at the second end surface;
a first external electrode on the first end surface; and
a second external electrode on the second end surface; wherein
the plurality of first step layers each have a thickness in the height direction of the multilayer body that is greater at a location closer to the first main surface than the second main surface; and
the plurality of second step layers each have a thickness in the height direction of the multilayer body that is greater at a location closer to the first main surface than the second main surface.
2 . The multilayer ceramic electronic component according to claim 1 , wherein
the plurality of first step layers each have a thickness which is about 20% or more and about 120% or less of a thickness of each of the plurality of second internal electrode layers; and
the plurality of second step layers each have a thickness which is about 20% or more and about 120% or less of a thickness of each of the plurality of first internal electrode layers.
3 . The multilayer ceramic electronic component according to claim 1 , wherein
the plurality of second step layers are each in contact with a respective one of the plurality of first internal electrode layers; and
the plurality of first step layers are each in contact with a respective one of the plurality of second internal electrode layers.
4 . The multilayer ceramic electronic component according to claim 1 , wherein when a region of about 0 μm or more and about 60 μm or less from an end of one of the plurality of first internal electrode layers in the length direction toward the first end surface and a region of about 0 μm or more and about 60 μm or less from an end of one of the plurality of second internal electrode layers in the length direction toward the second end surface are each defined as an L-direction end portion:
a coverage ratio of the L-direction end portion of each of the first internal electrode layers is lower than a coverage ratio of a counter portion of each of the first internal electrode layers; and
a coverage ratio of the L-direction end portion of each of the second internal electrode layers is lower than a coverage ratio of a counter portion of each of the second internal electrode layers.
5 . The multilayer ceramic electronic component according to claim 4 , wherein, in the L-direction end portion of each of the plurality of first and second internal electrode layers, a concentration of an additive including at least one of Ni, V, or Sn is lower at a location closer to the second main surface than the first main surface.
6 . The multilayer ceramic electronic component according to claim 1 , wherein the multilayer body has a rectangular or substantially rectangular parallelepiped shape.
7 . The multilayer ceramic electronic component according to claim 1 , wherein the multilayer ceramic electronic component is a capacitor.
8 . The multilayer ceramic electronic component according to claim 1 , wherein the plurality of laminated ceramic layers include one of a dielectric ceramic, a piezoelectric ceramic, a semiconductor ceramic, or a magnetic ceramic.
9 . The multilayer ceramic electronic component according to claim 1 , wherein thicker layers of the plurality of first or second step layers are provided at an end of the multilayer body.
10 . The multilayer ceramic electronic component according to claim 1 , wherein the plurality of first or second step layers are partially provided on a portion of the multilayer body.
11 . A multilayer ceramic electronic component comprising:
a multilayer body including a plurality of laminated ceramic layers, a first main surface and a second main surface opposed to each other in a height direction, a first lateral surface and a second lateral surface opposed to each other in a width direction orthogonal or substantially orthogonal to the height direction, a first end surface and a second end surface opposed to each other in a length direction orthogonal or substantially orthogonal to the height direction and the width direction, a plurality of end surface-exposed electrode layers that are each alternately laminated with a respective one of the plurality of ceramic layers, each exposed at the first end surface and the second end surface, and each function as an internal electrode layer, a plurality of lateral surface-exposed electrode layers that are each alternately laminated with a respective one of the plurality of ceramic layers, each exposed at the first lateral surface and the second lateral surface, and each function as an internal electrode layer, a plurality of lateral surface step layers that are each provided on a same plane as a respective one of the plurality of end surface-exposed electrode layers and each exposed at the first lateral surface and the second lateral surface, and a plurality of end surface step layers that are each provided on a same plane as a respective one of the plurality of lateral surface-exposed electrode layers and each exposed at the first end surface and the second end surface;
first external electrodes respectively on the first end surface and the second end surface; and
second external electrodes respectively on the first lateral surface and the second lateral surface; wherein
the plurality of lateral surface step layers each have a thickness in the height direction of the multilayer body that is greater at a location closer to the first main surface than the second main surface; and
the plurality of end surface step layers each have a thickness in the height direction of the multilayer body that is greater at a location closer to the first main surface than the second main surface.
12 . The multilayer ceramic electronic component according to claim 11 , wherein
the plurality of lateral surface step layers each have a thickness which is about 20% or more and about 120% or less of a thickness of each of the plurality of end surface-exposed electrode layers; and
the plurality of end surface step layers each have a thickness which is about 20% or more and about 120% or less of a thickness of each of the plurality of lateral surface-exposed electrode layers.
13 . The multilayer ceramic electronic component according to claim 11 , wherein
the plurality of end surface step layers are each in contact with a respective one of the plurality of lateral surface-exposed electrode layers; and
the plurality of lateral surface step layers are each in contact with a respective one of the plurality of end surface-exposed electrode layers.
14 . The multilayer ceramic electronic component according to claim 11 , wherein the multilayer body has a rectangular or substantially rectangular parallelepiped shape.
15 . The multilayer ceramic electronic component according to claim 11 , wherein the multilayer ceramic electronic component is a capacitor.
16 . The multilayer ceramic electronic component according to claim 11 , wherein the plurality of laminated ceramic layers include one of a dielectric ceramic, a piezoelectric ceramic, a semiconductor ceramic, or a magnetic ceramic.
17 . The multilayer ceramic electronic component according to claim 11 , wherein thicker layers of the plurality of lateral surface or end surface step layers are provided at an end of the multilayer body.
18 . The multilayer ceramic electronic component according to claim 11 , wherein the plurality of lateral surface or end surface step layers are partially provided on a portion of the multilayer body.