IP Library › Granted Patent US 12,733,444
Granted Patent B2
US 12,733,444 · App. 18/621,553 · Granted Sep 8, 2026

Electrostatic chuck

Inventors: Junhyung Kim (Suwon-si, KR); Hyunjoo Jeon (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H10P72/722H01J37/32715H01J2237/2007H01J2237/334
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Quick Facts
Patent No.
US 12,733,444
App. No.
18/621,553
Granted
Sep 8, 2026
Kind
B2
Abstract

An electrostatic chuck comprising; an electrostatic chuck body configured to have a step protruding from a lower end thereof in a radial direction, an adhesive layer on an upper surface of the electrostatic chuck body, a ceramic puck configured to be adhered to the adhesive layer and configured to have an edge protruding from the upper surface of the electrostatic chuck body, and a sealing member on a lower portion of an edge of the ceramic puck. The electrostatic chuck body is provided with an installation portion configured to have an inclined surface, and the sealing member is configured to be in contact with the inclined surface.

Claims (41)

1 . An electrostatic chuck comprising:

an electrostatic chuck body having a step protruding from a lower end thereof in a radial direction;

an adhesive layer on an upper surface of the electrostatic chuck body;

a ceramic puck adhered to the adhesive layer and having an edge protruding from the upper surface of the electrostatic chuck body; and

a sealing member on a lower edge portion of the ceramic puck,

wherein the electrostatic chuck body is provided with an installation portion having an inclined surface,

the sealing member is in contact with the inclined surface,

wherein the sealing member is in contact with a bottom surface of the ceramic puck, and

wherein the sealing member is a separate component from the adhesive layer.

2 . The electrostatic chuck of claim 1 , wherein the sealing member has a ring shape with a circular cross section.

3 . The electrostatic chuck of claim 2 , wherein the sealing member includes a material having elasticity and is configured to generate a restoring force by tension when installed on the installation portion.

4 . The electrostatic chuck of claim 1 , wherein the sealing member has a ring shape with a trapezoidal cross section.

5 . The electrostatic chuck of claim 4 , wherein a first surface of the sealing member is in surface contact with the inclined surface.

6 . The electrostatic chuck of claim 5 , wherein a second surface opposite to the first surface of the sealing member is in contact with the bottom surface of the ceramic puck.

7 . The electrostatic chuck of claim 1 , wherein the installation portion is fixed to the electrostatic chuck body and has a triangular cross section.

8 . The electrostatic chuck of claim 5 , wherein the installation portion is provided as a plurality of installation portions spaced apart from each other.

9 . An electrostatic chuck comprising:

an electrostatic chuck body having a step protruding from a lower end thereof in a radial direction;

an adhesive layer on an upper surface of the electrostatic chuck body;

a ceramic puck adhered to the adhesive layer and having an edge protruding from the upper surface of the electrostatic chuck body; and

a sealing member on a lower edge portion of the ceramic puck,

wherein the electrostatic chuck body is provided with an installation portion having an inclined surface,

the sealing member is in contact with a bottom surface of the ceramic puck, and

a first surface of the sealing member is in surface contact with the inclined surface,

wherein the installation portion is formed of a material having a hardness greater than or equal to the hardness of the electrostatic chuck body.

10 . The electrostatic chuck of claim 1 , wherein the installation portion is on a side surface of the electrostatic chuck body and the bottom surface of the ceramic puck, and has a trapezoidal cross section.

11 . The electrostatic chuck of claim 10 , wherein a thermal interface material (TIM) is interposed between the installation portion and the side surface of the electrostatic chuck body and between the installation portion and the bottom surface of the ceramic puck.

12 . The electrostatic chuck of claim 10 , wherein the installation portion includes a thermally conductive material.

13 . The electrostatic chuck of claim 10 , wherein the sealing member is in contact with the edge protruding from the upper surface of the electrostatic chuck body.

14 . An electrostatic chuck comprising:

an electrostatic chuck body having a step protruding from a lower end thereof in a radial direction;

an adhesive layer on an upper surface of the electrostatic chuck body;

a ceramic puck adhered to the adhesive layer and having an edge protruding from the upper surface of the electrostatic chuck body; and

a sealing member below the edge of the ceramic puck,

wherein the electrostatic chuck body is provided with an installation portion having an inclined surface, and

the sealing member includes a material having elasticity and is configured to generate a restoring force by tension when installed on the installation portion,

wherein the sealing member is in contact with a bottom surface of the ceramic puck, and

wherein the sealing member is a separate component from the adhesive layer.

15 . The electrostatic chuck of claim 14 , wherein the sealing member has a ring shape with a circular cross section.

16 . The electrostatic chuck of claim 14 , wherein the sealing member has a ring shape with a trapezoidal cross section.

17 . The electrostatic chuck of claim 16 , wherein a first surface of the sealing member is in surface contact with the inclined surface.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2024
From: KIM, JUNHYUNG; JEON, HYUNJOO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 066968/0070 →
Priority Claims (1)
KR 10-2023-0054012 · Apr 25, 2023 · national
Continuity (1)
Related Publication 20240363383A1 · Oct 31, 2024
References Cited (21)
US 9583371B2 · Shim et al. · 2017 [cited by applicant]
US 11521837B2 · Koiwa · 2022 [cited by applicant]
US 20100027188A1 · Liu et al. · 2010 [cited by applicant]
US 20140069585A1 · Aoto · 2014 [cited by examiner]
US 20150187614A1 · Gaff et al. · 2015 [cited by applicant]
US 20180151402A1 · Noorbakhsh · 2018 [cited by applicant]
US 20200161103A1 · Liu · 2020 [cited by applicant]
US 20200273680A1 · Koiwa · 2020 [cited by examiner]
US 20220102181A1 · Ono · 2022 [cited by examiner]
US 20220139680A1 · Lee et al. · 2022 [cited by applicant]
CN 108695225A · 2018 [cited by applicant]
CN 213026046U · 2021 [cited by applicant]
CN 114649178A · 2022 [cited by applicant]
EP 0742580A2 · 1996 [cited by applicant]
JP 2005033181A · 2005 [cited by applicant]
JP 2017168649A · 2017 [cited by applicant]
JP 2022175820A · 2022 [cited by applicant]
KR 1020190078656A · 2019 [cited by applicant]
KR 1020220167832A · 2022 [cited by applicant]
Korean Office Action dated Jan. 27, 2026 issued in Korean Patent Application No. 10-2023-0054012. [cited by applicant]
Korean Office Action dated Jan. 6, 2026 issued in Korean Patent Application No. 10-2023-0054012 (Translation not available). [cited by applicant]