Method for manufacturing an electronic device
A method for manufacturing an electronic device is disclosed. The electronic device has a first region and a transparent region. The method includes the steps of providing a flexible substrate, forming an electric circuit layer on the flexible substrate at an elevated temperature, forming an opening in the transparent region after forming the electric circuit layer, wherein the opening penetrates through a portion of the electric circuit layer, and forming a filling layer on the flexible substrate after forming the opening, wherein at least a part of the filling layer is formed in the opening to enhance a transmittance of the transparent region.
1. A method for manufacturing an electronic device comprising a first region and a transparent region, the method comprising:
providing a flexible substrate;
forming an electric circuit layer on the flexible substrate at an elevated temperature;
after forming the electric circuit layer, forming an opening in the transparent region, and the opening penetrating through a portion of the electric circuit layer, and
after forming the opening, forming a filling layer on the flexible substrate, wherein at least a part of the filling layer is formed in the opening to enhance a transmittance of the transparent region.
2. The method according to claim 1 , wherein the elevated temperature is equal to or higher than 200° C.
3. The method according to claim 1 , wherein the filling layer comprises an organic material.
4. The method according to claim 1 , wherein the filling layer comprises an inorganic material.
5. The method according to claim 1 , wherein the filling layer comprises an organic material and an inorganic material.
6. The method according to claim 1 , further comprising forming a light emitting unit on the electric circuit layer in the first region.
7. The method according to claim 6 , wherein the light emitting unit comprises an organic light emitting diode.
8. The method according to claim 1 , wherein the electric circuit layer comprises a driving circuit in the first region.
9. The method according to claim 1 , wherein another part of the filling layer is formed on the electric circuit layer in the first region.