Semiconductor processing chambers and methods for cleaning the same
A processing chamber may include a gas distribution member, a substrate support, and a pumping liner. The gas distribution member and the substrate support may at least in part define a processing volume. The pumping liner may define an internal volume in fluid communication with the processing volume via a plurality of apertures of the pumping liner circumferentially disposed about the processing volume. The processing chamber may further include a flow control mechanism operable to direct fluid flow from the internal volume of the pumping liner into the processing volume via a subset of the plurality of apertures of the pumping liner during fluid distribution into the processing volume from the gas distribution member.
1 . A method for cleaning a processing chamber, the method comprising:
flowing a first gas through a gas distribution member of a processing chamber into a processing volume defined at least in part by the gas distribution member and a substrate support of the processing chamber;
flowing a second gas through a gas inlet of a pumping liner of the processing chamber into an internal volume of the pumping liner, wherein the pumping liner is disposed radially outward from the substrate support, and wherein the internal volume is in fluid communication with the processing volume via a plurality of apertures of the pumping liner circumferentially disposed about the processing volume;
flowing a portion of the second gas from the internal volume of the pumping liner into the processing volume through a first subset of apertures of the plurality of apertures while maintaining the flow of the first gas into the processing volume; and
flowing the portion of the second gas from the processing volume into the internal volume of the pumping liner via a second subset of apertures of the plurality of apertures.
2 . The method of claim 1 , wherein the internal volume of the pumping liner comprises a first volume and a second volume separated by a pair of choke plates, wherein:
flowing the second gas through the gas inlet of the pumping liner into the internal volume of the pumping liner comprises flowing the second gas through the gas inlet of the pumping liner into the first volume;
flowing the portion of the second gas from the internal volume of the pumping liner into the processing volume comprises flowing the portion of the second gas from the first volume into the processing volume, wherein the portion of the second gas is distributed throughout an entirety of the processing volume; and
flowing the portion of the second gas from the processing volume into the internal volume of the pumping liner comprises flowing the portion of the second gas from the processing volume into the second volume.
3 . The method of claim 1 , wherein the first gas is distributed throughout an entirety of the processing volume at a substantially uniform concentration.
4 . The method of claim 1 , wherein the first gas is flowed at a first flow rate, and wherein the second gas is flowed at a second flow rate greater than the first flow rate.
5 . The method of claim 1 , wherein the gas inlet is a first gas inlet, the method further comprising:
stop flowing the second gas through the first gas inlet of the pumping liner into the internal volume of the pumping liner;
flowing a third gas through a second gas inlet of the pumping liner into the internal volume of the pumping liner;
flowing a portion of the third gas from the internal volume of the pumping liner into the processing volume through the second subset of apertures of the plurality of apertures; and
flowing the portion of the third gas from the processing volume into the internal volume of the pumping liner via the first subset of apertures of the plurality of apertures.
6 . The method of claim 1 , further comprising flowing a third gas through an annular gap surrounding the substrate support in an upward direction toward the processing volume.
7 . The method of claim 1 , wherein flowing the second gas through the gas inlet of the pumping liner into an internal volume of the pumping liner, bypasses the gas distribution member.
8 . The method of claim 1 , further comprising flowing a portion of the second gas from the internal volume of the pumping liner directly into a first foreline volume, a second foreline volume, or both a first foreline volume and a second foreline volume.
9 . The method of claim 8 , further comprising a flow control mechanism, and operating the flow control mechanism to direct the flow of the second gas into the first foreline volume, the second foreline volume, or both the first foreline volume and the second foreline volume.
10 . The method of claim 8 , wherein the pumping liner comprises a first laterally extending liner portion and a first toroidally shaped liner portion.
11 . The method of claim 10 , further comprising flowing the portion of the second gas through at least a portion of the first laterally extending liner portion and at least a portion of the first toroidally shaped liner portion, and into the first foreline volume, the second foreline volume, or both the first foreline volume and the second foreline volume.
12 . The method of claim 10 , wherein the pumping liner further comprises a second laterally extending liner portion and a second toroidally shaped liner portion, and further comprising flowing the portion of the second gas through at least a portion of the second laterally extending liner portion and at least a portion of the second toroidally shaped liner portion, and into the first foreline volume, the second foreline volume, or both the first foreline volume and the second foreline volume.
13 . A deposition method, comprising:
flowing a first gas through a gas distribution member of a processing chamber into a processing volume defined at least in part by the gas distribution member and a substrate support of the processing chamber supporting a semiconductor substrate thereon; and
flowing a second gas through a gas inlet of a pumping liner of the processing chamber into an internal volume of the pumping liner, wherein the pumping liner is disposed radially outward from the substrate support, wherein the internal volume of the pumping liner is in fluid communication with the processing volume via a plurality of apertures circumferentially disposed about the processing volume, wherein the first gas is flowed at a first flow rate, wherein the second gas is flowed at a second flow rate less than the first flow rate such that the first gas is flowed from the processing volume into the internal volume of the pumping liner via the plurality of apertures while the flow of the second gas into the processing volume is substantially prevented, and wherein a pressure difference between two peripheral locations inside the processing volume is less than 0.001 torr.
14 . The deposition method of claim 13 , wherein the gas inlet is a first gas inlet, the deposition method further comprising:
flowing a third gas through a second gas inlet of the pumping liner into the internal volume of the pumping liner, wherein the first gas inlet and the second gas inlet are diametrically opposed from each other, wherein the third gas is flowed at a third flow rate less than the first flow rate such that the flow of the third gas into the processing volume is substantially prevented, and wherein the flow of the first gas, the flow of the second gas, and the flow of the third gas collectively create an axially symmetrical pressure profile inside the processing volume about a central axis of the processing volume.
15 . The deposition method of claim 13 , further comprising flowing a third gas through an annular gap surrounding the substrate support in an upward direction toward the processing volume.
16 . A method for cleaning a processing chamber, the method comprising:
flowing a first gas through a gas distribution member of a processing chamber into a processing volume defined at least in part by the gas distribution member and a substrate support of the processing chamber; and
flowing a second gas through a gas inlet of a pumping liner of the processing chamber directly into an internal volume of the pumping liner, wherein the pumping liner is disposed radially outward from the substrate support, and wherein the internal volume is in fluid communication with the processing volume via a plurality of apertures of the pumping liner circumferentially disposed about the processing volume;
wherein the pumping liner comprises a first laterally extending liner portion and a first toroidally shaped liner portion.
17 . The method of claim 16 , further comprising flowing the portion of the second gas through at least a portion of the first laterally extending liner portion and at least a portion of the first toroidally shaped liner portion, and into a first foreline volume, a second foreline volume, or both a first foreline volume and a second foreline volume.
18 . The method of claim 17 , wherein the pumping liner further comprises a second laterally extending liner portion and a second toroidally shaped liner portion, and further comprising flowing the portion of the second gas through at least a portion of the second laterally extending liner portion and at least a portion of the second toroidally shaped liner portion, and into the first foreline volume, the second foreline volume, or both the first foreline volume and the second foreline volume.
19 . The method of claim 16 , wherein flowing the second gas through the gas inlet of the pumping liner into an internal volume of the pumping liner, bypasses the gas distribution member.
20 . The method of claim 16 , further comprising flowing a portion of the second gas from the internal volume of the pumping liner directly into a first foreline volume, a second foreline volume, or both a first foreline volume and a second foreline volume.