Electronic device

1 . An electronic device, comprising: a carrier having a predetermined region and comprising a pad disposed in the predetermined region; and a protection layer disposed over the carrier and defining the predetermined region, wherein the protection layer is configured to block an encapsulation layer from covering the pad, wherein in a cross-sectional view, the protection layer comprises a blocking structure disposed at opposite two sides of the pad, the blocking structure defines a recess, the blocking structure is covered by the encapsulation layer and a portion of the blocking structure is exposed by the encapsulation layer.

2 . The electronic device of claim 1 , wherein the blocking structure is spaced apart from the pad.

3 . The electronic device of claim 1 , wherein a first elevation of a top surface of the pad is lower than a second elevation of the recess with respect to a surface of the carrier facing away from the protection layer.

4 . The electronic device of claim 1 , wherein, in the cross-sectional view, a width of the recess is greater than a depth of the recess.

5 . The electronic device of claim 1 , wherein the carrier comprises a conductive layer defines a trench and the pad, wherein the blocking structure is disposed within and above the trench.

6 . The electronic device of claim 1 , wherein the blocking structure has a curved surface.

7 . An electronic device, comprising: a carrier comprising a plurality of pads; an encapsulation layer covering a periphery region of the carrier, wherein, in a top view, a portion of the encapsulation layer is disposed at a periphery area of at least one pad of the pads; and a protection layer disposed between the carrier and the encapsulation layer, wherein the protection layer has a first recess and a second recess between which the encapsulation layer extends, wherein the encapsulation layer further extends into the first recess and the second recess.

8 . The electronic device of claim 7 , wherein, in the top view, the portion of the encapsulation layer has an inner contour substantially identical to an outer contour of the at least one pad.

9 . The electronic device of claim 8 , wherein, in the top view, the inner contour of the portion of the encapsulation layer has a first curvature substantially identical to a second curvature of the outer contour of the at least one pad.

10 . The electronic device of claim 7 , wherein, in the top view, the encapsulation layer is disposed between the plurality of pads.

11 . The electronic device of claim 7 , further comprising a blocking structure adjacent to the plurality of pads, wherein a thickness of the encapsulation layer is thicker at one side closer to the blocking structure.

12 . The electronic device of claim 7 , further comprising a blocking structure adjacent to the plurality of pads, wherein a thickness of the encapsulation layer is taper at one side closer to the blocking structure.

13 . An electronic device, comprising:

a protection layer comprising an opening and a blocking structure configured to block an encapsulation layer from entering the opening; and a connection element disposed in the opening and configured to connect an external device other than the electronic device, wherein the protection layer comprises a plurality of recesses, wherein the opening is disposed between the recesses, wherein the plurality of recesses are filled with the encapsulation layer.

14 . The electronic device of claim 13 , further comprising a conductive pad exposed by the opening and connected to the connection element.

15 . The electronic device of claim 14 , wherein a portion of the conductive pad is covered by the protection layer.