IP Library Granted Patent US 12,382,210
Granted Patent B2
US 12,382,210 · App. 18/641,484 · Granted Aug 5, 2025

Earphones

Inventors: Zhen Wang (Shenzhen, CN); Zhiqing Liu (Shenzhen, CN); Yonggen Wang (Shenzhen, CN); Xinnan Mao (Shenzhen, CN); Fen You (Shenzhen, CN)
Assignee: SHENZHEN SHOKZ CO., LTD.
H04R1/105H04R1/1025H04R1/1041H04R1/1058H04R1/1075H04R5/033H04R9/066H04R2201/105H04R2460/13
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Quick Facts
Patent No.
US 12,382,210
App. No.
18/641,484
Granted
Aug 5, 2025
Kind
B2
Abstract

The present disclosure provides an earphone including a core module. The core module may include a core housing and a core. The core housing may include a bottom wall and an annular peripheral wall. When a user wears the earphone, the bottom wall may face the head of the user. One end of the annular peripheral wall may be integrally connected with the bottom wall, the other end of the annular peripheral wall that is away from the bottom wall includes an opening, and the core may be disposed in the core housing through the opening. The core may include a magnet configured such that the core module is attachable to a magnetic object through one side of the bottom wall.

Claims (36)

1. A core module including a core housing and a core, wherein

one end of the core housing includes an opening, and the core is disposed in the core housing through the opening; and

the core includes a magnetic conduction shield, a magnet, a magnetic conduction plate, and a coil, wherein

the magnetic conduction shield includes a bottom plate and an annular side plate integrally connected with the bottom plate, and the magnet is disposed inside the annular side plate and fixed on the bottom plate,

the magnetic conduction plate is fixed on one side of the magnet that is away from the bottom plate, and

the coil is disposed in a magnetic gap between the magnet and the annular side plate,

wherein the magnet is configured to generate a magnetic field such that the coil located in the magnetic field generates mechanical vibrations under an excitation of electrical signals, and

the magnet is further configured such that the core module is attachable to a magnetic object through a bottom wall of the core housing.

2. The core module of claim 1 , wherein a diameter of the magnetic conduction plate is equal to a diameter of the magnet.

3. The core module of claim 1 , wherein a thickness of the magnetic conduction plate is equal to a thickness of the magnetic conduction shield.

4. The core module of claim 1 , wherein a material of the magnetic conduction plate is the same as a material of the magnetic conduction shield.

5. The core module of claim 1 , wherein a thickness of the magnetic conduction shield is in a range of 0.4 mm-0.8 mm.

6. The core module of claim 5 , the thickness of the magnetic conduction shield is 0.5 mm.

7. The core module of claim 1 , wherein a height of the annular side plate is in a range of 3.4 mm-4.0 mm.

8. The core module of claim 7 , wherein the height of the annular side plate is 3.7 mm.

9. The core module of claim 1 , wherein the annular side plate is cylindrical, and a diameter of the annular side plate is a sum of a diameter of the magnet and twice the magnetic gap.

10. The core module of claim 1 , further comprising a core bracket disposed in the core housing, and the coil is fixed on the core bracket.

11. The core module of claim 1 , wherein the magnetic gap between the magnet and the annular side plate is in a range of 1.0 mm-1.5 mm.

12. The core module of claim 1 , wherein the magnet is cylindrical, and a diameter of the magnet is in a range of 10.5 mm-11.5 mm.

13. The core module of claim 12 , wherein the diameter of the magnet is 10.8 mm.

14. The core module of claim 1 , wherein a thickness of the magnet is in a range of 3.0 mm-4.0 mm.

15. The core module of claim 14 , wherein the thickness of the magnet is 3.5 mm.

16. The core module of claim 1 , wherein

the core housing includes a bottom wall configured to face a head of a user and an annular peripheral wall, one end of the annular peripheral wall being integrally connected with the bottom wall, and the opening being disposed on the other end of the annular peripheral wall that is away from the bottom wall; and

the core module further includes a cover plate disposed on the opening to form a chamber structure for accommodating the core.

17. The core module of claim 16 , wherein a ratio of a difference between a rigidity of the bottom wall and a rigidity of the cover plate to the rigidity of the bottom wall is less than or equal to 10%.

18. The core module of claim 16 , wherein an area of the bottom wall is less than or equal to an area of the cover plate.

19. The core module of claim 16 , wherein a thickness of the bottom wall is less than or equal to a thickness of the cover plate.

20. An earphone, comprising an ear hook assembly, a battery, and a core module, the core module being disposed at one end of the ear hook assembly, the battery being disposed at the other end of the ear hook assembly, and the core module including a core housing and a core, wherein

one end of the core housing includes an opening, and the core is disposed in the core housing through the opening; and

the core includes a magnetic conduction shield, a magnet, a magnetic conduction plate, and a coil, wherein

the magnetic conduction shield includes a bottom plate and an annular side plate integrally connected with the bottom plate, and the magnet is disposed inside the annular side plate and fixed on the bottom plate,

the magnetic conduction plate is fixed on one side of the magnet that is away from the bottom plate, and

the coil is disposed in a magnetic gap between the magnet and the annular side plate,

wherein the magnet is configured to generate a magnetic field such that the coil located in the magnetic field generates mechanical vibrations under an excitation of electrical signals, and

the magnet is further configured such that the core module is attachable to a magnetic object through a bottom wall of the core housing.

Assignments (2)
CHANGE OF NAME Recorded Sep 12, 2024
From: SHENZHEN VOXTECH CO., LTD.
To: SHENZHEN SHOKZ CO., LTD.
Reel/Frame 068561/0887 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 12, 2024
From: WANG, ZHEN; LIU, ZHIQING; WANG, YONGGEN; MAO, XINNAN; YOU, FEN
To: SHENZHEN VOXTECH CO., LTD.
Reel/Frame 068561/0927 →
Priority Claims (3)
CN 202010367108.X · Apr 30, 2020 · national
CN 202020720094.0 · Apr 30, 2020 · national
CN 202020720106.X · Apr 30, 2020 · national
Continuity (3)
Continuation 17809013 · Jun 27, 2022
Continuation PCTCN2021089713 · Apr 25, 2021
Related Publication 20240267668A1 · Aug 8, 2024
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