Planarity control for load pull tuner on wafer
View Patent ↗Planarity adjustment of RF microprobes in a load pull setup on wafer, using a low-profile impedance tuner that is mounted on a 3-axis tuner positioner at an angle matching approximately the angle of the wafer probe, is performed using a wedge-shaped interface block and a gimbal linking the vertical axis of the 3-axis tuner positioner with the tuner body. The gimbal is required when the axis of the slabline is not aligned with the tips of the RF microprobes, in which case the tuner rotates on a planetary trajectory around the rotation axis of the probe tips. The amplitude of the rotation does not exceed ±5° and can be absorbed using flexible RF cables between the tuner and auxiliary equipment.
1. A planarity control mechanism for RF wafer microprobes attached to load pull tuners comprising:
a fixed attachment between the tuners and the RF wafer microprobes, and
a rotational attachment of the tuner to a vertical axis of a three-axis positioner, and
means for controlling a rotation of the tuners and the attached RF wafer microprobes, wherein
the RF wafer microprobes have a body, probe tips and a coaxial connector; the tuners have a slabline with a center conductor linking a test and an idle port which are equipped with coaxial connectors,
and wherein
the fixed attachment between the tuners and the RF wafer microprobes allows the coaxial connector of the RF wafer microprobe and the coaxial connector of the tuner test port to be aligned, matched, and directly connected,
and wherein
the rotation axis through the tips of the RF wafer microprobes is different than the rotation axis through the coaxial connector of the RF wafer microprobe and the center conductor of the slabline;
and wherein
the rotational attachment of the tuner to the vertical axis of the three-axis positioner comprises a support block attached to the vertical axis of the three-axis positioner and a gimbal linking the tuner with the support block and allowing tilting the tuner versus the vertical axis of the three-axis positioner and rotating the tuner around the rotation axis of the tips of the RF wafer microprobes;
and wherein
the means for controlling the tilting and the rotation of the tuners comprise a handle including a knob and a shaft attached to the tuner and guided by a fork.
2. The planarity control mechanism for RF wafer microprobes of claim 1 , wherein
the support block of the attachment between the tuner and the three-axis positioner is rotationally attached to a base with an adjustable slope allowing aligning and directly connecting the coaxial connector of the tuner test port to the coaxial connector of the wafer probe.