Polishing interconnect structures in semiconductor devices
A method includes forming a first conductive feature over a semiconductor substrate, forming an ILD layer over the first conductive feature, patterning the ILD layer to form a trench, and forming a conductive layer over the patterned ILD layer to fill the trench. The method further includes polishing the conductive layer to form a via contact configured to interconnect the first conductive feature with a second conductive feature, where polishing the conductive layer exposes a top surface of the ILD layer, polishing the exposed top surface of the ILD layer, such that a top portion of the via contact protrudes from the exposed top surface of the ILD layer, and forming the second conductive feature over the via contact, such that the top portion of the via contact extends into the second conductive feature.
1 . A device comprising:
a first source/drain contact disposed on a substrate;
a first interlayer dielectric (ILD) layer disposed over the first source/drain contact;
a first interconnect feature disposed in the first ILD layer, wherein the first interconnect feature physically contacts the first source/drain contact and extends to below a top surface of the first source/drain contact;
a second ILD layer disposed over and interfacing with the first ILD layer;
a second interconnect feature disposed in the second ILD layer, wherein the first interconnect feature couples the first source/drain contact to the second interconnect feature, wherein a top surface of the second interconnect feature is above a top surface of the second ILD layer.
2 . The device of claim 1 , further comprising:
a butted contact that extends into the second ILD layer without extending above the top surface of the second ILD layer.
3 . The device of claim 1 , further comprising:
a second source/drain contact; and
a gate stack,
wherein the first ILD layer is disposed over the second source/drain contact and the gate stack.
4 . The device of claim 2 , further comprising:
a third ILD layer disposed on and interfacing with the first source/drain contact; and
an etch stop layer disposed on the third ILD layer and interfacing with the first interconnect feature, the second interconnect feature and the butted contact.
5 . The device of claim 4 , wherein the second interconnect feature has a top surface facing away from the substrate, and
wherein the etch stop layer interfaces with the top surface of the second interconnect feature.
6 . The device of claim 4 , wherein the butted contact has a top surface facing away from the substrate and an opposing bottom surface facing the substrate,
wherein the third ILD layer interfaces with the bottom surface of the butted contact, and
wherein the second ILD layer interfaces with the top surface of the butted contact.
7 . The device of claim 1 , wherein the first interconnect feature extends above a top surface of the first ILD layer.
8 . The device of claim 1 , wherein the top surface of the second interconnect feature is convex.
9 . A device comprising:
a first interlayer dielectric layer disposed over a substrate;
a first conductive feature extending through first interlayer dielectric layer, the first conductive feature having a top surface recessed relative to a top surface of the first interlayer dielectric layer;
a second interlayer dielectric layer disposed on the first interlayer dielectric layer;
a first interconnect feature disposed in the first interlayer dielectric layer and interfacing with the top surface of the first conductive feature, the first interconnect feature having a convex top surface extending above a top surface of the first interlayer dielectric layer; and
a second interconnect feature disposed on and interfacing with the convex top surface of the first interconnect feature.
10 . The device of claim 9 , wherein a top surface of the second interconnect feature is above a top surface of the second interlayer dielectric layer and wherein the top surface of the second interconnect feature is convex.
11 . The device of claim 9 , further comprising a butted contact disposed in the first interlayer dielectric layer and the second interlayer dielectric layer.
12 . The device of claim 11 , further comprising:
a gate structure disposed on a fin structure;
a source/drain feature disposed on the fin structure; and
a contact disposed on the source/drain feature, and
wherein the butted contact interfaces with the gate structure and the contact.
13 . The device of claim 9 , wherein the second interconnect feature is wider than the first interconnect feature.
14 . The device of claim 9 , further comprising:
a gate structure disposed on a fin structure;
a third interlayer dielectric layer disposed over the second interlayer dielectric layer;
a third interconnect feature disposed within the third interlayer dielectric layer; and
a gate contact extending from the gate structure to the third interconnect feature.
15 . The device of claim 14 , wherein a top surface of the third interconnect feature is above the top surface of the second interlayer dielectric layer.
16 . A method comprising:
providing a gate structure and source/drain feature disposed on a substrate;
forming a first source/drain contact on the source/drain feature;
forming a first dielectric layer over the first source/drain contact and the gate structure;
forming a first trench through the first dielectric layer to expose the first source/drain contact and the gate structure;
forming a conductive layer in the first trench; and
polishing the conductive layer to form a butted contact such that a top portion of the butted contact protrudes from a top surface of the first dielectric layer.
17 . The method of claim 16 , wherein the polishing of the conductive layer includes performing a first polishing process using a first composition of material and a second polishing process using a second composition of material, the second composition of material being different than the first composition of material.
18 . The method of claim 17 , wherein the first composition of material has a different pH than the second composition of material.
19 . The method of claim 16 , wherein the polishing the conductive layer includes:
performing a first polishing process on the conductive layer, wherein a top surface of the conductive layer is substantially planarized with a first portion of the first dielectric layer after the performing of the first polishing process; and
after performing the first polishing process, performing a second polishing process on the conductive layer to form the butted contact that includes the top portion that protrudes from top surface of the first dielectric layer.
20 . The method of claim 16 , wherein the top portion of the butted contact has rounded edges after the polishing of the conductive layer to form the butted contact.