Chip card with radio-frequency antennas
A chip card having a card body having a metal layer that is at least partially covered by a coating that is more conductive than the metal layer, an RF chip, and a first RF antenna that is placed in a cut-out zone and connected to the chip. The metal layer includes at least one RF antenna portion that is electrically insulated from the metal layer and from the first RF antenna and that is configured to collect an image current induced by first eddy currents flowing at least over the coating of the metal layer and to allow coupling to the first antenna.
1. A chip card comprising:
a card body formed at least partly by a metal layer having a cut-out zone;
an RF chip;
a first RF antenna that is placed in or facing the cut-out zone and electrically connected to the RF chip;
at least one RF antenna portion that is electrically insulated from the metal layer and from the first RF antenna, said at least one antenna portion being a second RF antenna including:
a first antenna portion lying facing a portion of the metal layer; and
a second antenna portion, electrically connected to the first antenna portion, and lying facing the cut-out zone so as to allow magnetic coupling to the first antenna,
wherein the metal layer is at least partially covered by a coating that is more conductive than the metal layer, and
wherein said first antenna portion lies facing one portion of the metal layer covered by said coating to collect a second current induced by first eddy currents flowing at least over the coating of the metal layer and to allow the second antenna portion to be coupled to the first RF antenna.
2. The chip card according to claim 1 , wherein the metal layer is entirely covered by said coating.
3. The chip card according to claim 2 , wherein a thickness of the coating is greater than a skin depth of said coating.
4. The chip card according to claim 2 , wherein the conductivity of said coating is greater than 3.5×10 7 S/m.
5. The chip card according to claim 2 , wherein said coating is made of copper, silver or gold.
6. The chip card according to claim 2 , wherein said cut-out zone opens onto a peripheral edge of the metal layer.
7. The chip card according to claim 1 , wherein a thickness of the coating is greater than a skin depth of said coating.
8. The chip card according to claim 7 , wherein the conductivity of said coating is greater than 3.5×10 7 S/m.
9. The chip card according to claim 7 , wherein said coating is made of copper, silver or gold.
10. The chip card according to claim 7 , wherein said cut-out zone opens onto a peripheral edge of the metal layer.
11. The chip card according to claim 1 , wherein the conductivity of said coating is greater than 3.5×10 7 S/m.
12. The chip card according to claim 11 , wherein said coating is made of copper, silver or gold.
13. The chip card according to claim 11 , wherein said cut-out zone opens onto a peripheral edge of the metal layer.
14. The chip card according to claim 1 , wherein said coating is made of copper, silver or gold.
15. The chip card according to claim 1 , wherein said cut-out zone opens onto a peripheral edge of the metal layer.
16. The chip card according to claim 1 , wherein the card body is rectangular, said metal layer consisting of a first region and second region that are delineated by a straight line parallel to a short side of the card, the first region containing the cut-out zone,
wherein the chip card includes a first slit connecting the cut-out zone to a peripheral edge of the first region and a second slit opening either onto a peripheral edge of the metal layer or into the cut-out zone, the second slit ending with a closed portion in the second region, and
wherein said at least one antenna portion is a second RF antenna including at least one turn located facing the first slit and at least one turn located facing said second slit.
17. A method for manufacturing a chip card from a card body formed at least partly by a metal layer comprising a cut-out zone, the method comprising:
covering, at least partially, the metal layer with a coating that is more conductive than the metal layer;
forming, on or in the card body, a first RF antenna in or facing the cut-out zone of the metal layer;
assembling an RF chip with the card body so that the RF chip is electrically connected to the first RF antenna; and
forming, on or in the card body, at least one RF antenna portion that is electrically insulated from the metal layer and from the first RF antenna and that is configured to collect a second current induced by first eddy currents flowing at least over the coating of the metal layer and to allow coupling to the first antenna.
18. The method for manufacturing a chip card according to claim 17 , wherein said cut-out zone opens onto a peripheral edge of the metal layer, said at least one antenna portion being a second RF antenna including:
a first antenna portion lying facing the metal layer with a view to collecting an image current induced by first eddy currents flowing at least over the coating of the metal layer, and
a second antenna portion, electrically connected to the first antenna portion, and lying facing the cut-out zone to allow magnetic coupling between the first RF antenna and the second RF antenna.
19. The method for manufacturing a chip card according to claim 17 ,
wherein the body of the card is of generally rectangular shape,
wherein said metal layer consists of a first region and second region entirely delineated by a straight line parallel to a short side of the card, the first region entirely containing the cut-out zone and an area of the cut-out zone being smaller than the area of the second region,
wherein a first slit is included in the metal layer connecting the cut-out zone to a peripheral edge of the first region and a second slit is included in the metal layer opening either onto a peripheral edge of the metal layer or into the cut-out zone, the second slit ending with a closed portion in the second region, and
wherein said at least one antenna portion is a second antenna having at least one turn located facing the first slit and at least one turn located facing the second slit.
20. The method for manufacturing a chip card according to claim 17 , wherein the covering the metal layer with the coating that is more conductive than the metal layer further comprises entirely covering the metal layer with the coating that is more conductive than the metal layer.