IP Library Granted Patent US 12,534,600
Granted Patent B2
US 12,534,600 · App. 18/671,219 · Granted Jan 27, 2026

Hollow resin particle and method for producing same

Inventor: Haruhiko Matsuura (Osaka, JP)
Assignee: SEKISUI KASEI CO., LTD.
C08L23/02C08L33/14
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Quick Facts
Patent No.
US 12,534,600
App. No.
18/671,219
Granted
Jan 27, 2026
Kind
B2
Abstract

Provided is a hollow resin particle that can reduce the dielectricity and dielectric loss tangent of a resin layer by introducing an empty area thereinto, and can be obtained by forming a hollow portion in a simple manner. Also provided is a method of producing such hollow resin particle in a simple manner. A hollow resin particle according to an embodiment of the present invention is a hollow resin particle including a shell portion and a hollow portion surrounded by the shell portion, wherein the shell portion contains an aromatic polymer (P1) obtained by polymerizing a monomer composition containing an aromatic crosslinkable monomer (a), an aromatic monofunctional monomer (b), and a (meth)acrylic acid ester-based monomer (c) having a specific structure.

Claims (15)

1 . A hollow resin particle, comprising:

a shell portion; and

a hollow portion surrounded by the shell portion,

wherein the shell portion contains an aromatic polymer (P1) obtained by polymerizing a monomer composition containing:

an aromatic crosslinkable monomer (a);

an aromatic monofunctional monomer (b); and

a (meth)acrylic acid ester-based monomer (c) represented by the formula (1):

where R 1 represents H or CH 3 , R 2 represents H, an alkyl group, or a phenyl group, R 3 —O represents an oxyalkylene group having 2 to 18 carbon atoms, and “m” represents an average number of moles added of the oxyalkylene group and represents a number of from 1 to 100,

and wherein the shell portion contains a non-crosslinked polymer (P2) that is a polyolefin.

2 . The hollow resin particle according to claim 1 , wherein the oxyalkylene group is at least one kind selected from the group consisting of: an oxyethylene group; an oxypropylene group; and an oxybutylene group.

3 . The hollow resin particle according to claim 1 , wherein the monomer composition contains 10 wt % to 70 wt % of the aromatic crosslinkable monomer (a), 10 wt % to 70 wt % of the aromatic monofunctional monomer (b), and 0.5 wt % to 30 wt % of the (meth)acrylic acid ester-based monomer (c) represented by the formula (1).

4 . The hollow resin particle according to claim 1 , wherein the aromatic crosslinkable monomer (a) is divinylbenzene.

5 . The hollow resin particle according to claim 1 , wherein the aromatic monofunctional monomer (b) is at least one kind selected from the group consisting of: styrene; and ethylvinylbenzene.

6 . A method of producing the hollow resin particle of claim 1 , comprising dispersing an organic mixed solution in an aqueous solution containing at least one kind selected from the group consisting of: a dispersion stabilizer; and a surfactant, followed by suspension polymerization, the organic mixed solution containing a monomer composition containing the aromatic crosslinkable monomer (a), the aromatic monofunctional monomer (b), and the (meth)acrylic acid ester-based monomer (c) represented by the formula (1), the non-crosslinked polymer (P2), a polymerization initiator, and an organic solvent having a boiling point of less than 100° C.

7 . A semiconductor material, comprising the hollow resin particle of claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 24, 2024
From: MATSUURA, HARUHIKO
To: SEKISUI KASEI CO., LTD.
Reel/Frame 067518/0962 →
Priority Claims (1)
JP 2019-195808 · Oct 29, 2019 · national
Continuity (2)
Continuation 17768103
Related Publication 20240309182A1 · Sep 19, 2024
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