IP Library Granted Patent US 12,396,132
Granted Patent B2
US 12,396,132 · App. 18/671,698 · Granted Aug 19, 2025

Fluid immersion cooling system with multiple layers of coolant fluids and method of using same

Inventors: Yueh Ming Liu (Taipei, TW); Yu Hsiang Huang (Taipei, TW); Yu Chuan Chang (Taipei, TW); Tan Hsin Chang (Taipei, TW); Hsiao Chung Chen (Taipei, TW); Chia-Wei Chen (Taipei, TW); Chih-Ta Chen (Taipei, TW); Cheng-Hung Lin (Taipei, TW); Ming-Te Hsu (Taipei, TW)
Assignee: Super Micro Computer, Inc.
H05K7/203H05K7/20318H05K7/20327
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Quick Facts
Patent No.
US 12,396,132
App. No.
18/671,698
Granted
Aug 19, 2025
Kind
B2
Abstract

A fluid immersion cooling system includes a fluid tank that contains a layer of a dual-phase coolant fluid and one or more layers of single-phase coolant fluids. The dual-phase and single-phase coolant fluids are immiscible, with the dual-phase coolant fluid having a lower boiling point and higher density than a single-phase coolant fluid. A substrate of an electronic system is submerged in the tank such that high heat-generating components are immersed at least in the layer of the dual-phase coolant fluid. Heat from the components is dissipated to the dual-phase coolant fluid to generate vapor bubbles of the dual-phase coolant fluid. The vapor bubbles rise to a layer of a single-phase coolant fluid that is above the layer of the dual-phase coolant fluid. The vapor bubbles condense to droplets of the dual-phase coolant fluid. The droplets fall down into the layer of the dual-phase coolant fluid.

Claims (24)

1. A fluid immersion cooling system comprising:

a fluid tank containing a component of an electronic system;

a layer of a dual-phase coolant fluid in the fluid tank, the layer of the dual-phase coolant fluid is in liquid state, the component of the electronic system is immersed at least in the layer of the dual-phase coolant fluid; and

a layer of a single-phase coolant fluid that is over the layer of the dual-phase coolant fluid in the fluid tank, the layer of the single-phase coolant fluid is in liquid state, the layer of the single-phase coolant fluid and the layer of the dual-phase coolant fluid are immiscible, a liquid density of the layer of the dual-phase coolant fluid is higher than a liquid density of the layer of the single-phase coolant fluid, and a boiling point of the layer of the dual-phase coolant fluid is lower than a boiling point of the layer of the single-phase coolant fluid.

2. The fluid immersion cooling system of claim 1 , wherein the layer of the single-phase coolant fluid comprises a dielectric oil.

3. The fluid immersion cooling system of claim 1 , wherein the layer of the dual-phase coolant fluid comprises a fluorochemical.

4. The fluid immersion cooling system of claim 1 , further comprising:

a cooler unit that is coupled to an outlet and an inlet of the fluid tank.

5. The fluid immersion cooling system of claim 4 , wherein the cooler unit comprises:

a pump; and

a heat exchanger.

6. The fluid immersion cooling system of claim 1 , further comprising:

a condenser that is disposed above the layer of the single-phase coolant fluid.

7. The fluid immersion cooling system of claim 1 , wherein the component of the electronic system is a central processing unit (CPU).

8. The fluid immersion cooling system of claim 1 , wherein the tank is an open container.

9. A method of cooling an electronic system, the method comprising:

submerging a component of an electronic system in a layer of a dual-phase coolant fluid that is in liquid state in a fluid tank;

dissipating heat from the component of the electronic system to the layer of the dual-phase coolant fluid to generate vapor bubbles of the layer of the dual-phase coolant fluid; and

condensing the vapor bubbles of the layer of the dual-phase coolant fluid in a layer of a single-phase coolant fluid in the fluid tank, the layer of the single-phase coolant fluid is over the layer of the dual-phase coolant fluid in the fluid tank, the layer of the single-phase coolant fluid is in liquid state,

wherein the layer of the dual-phase coolant fluid and the layer of the single-phase coolant fluid are immiscible, a liquid density of the layer of the dual-phase coolant fluid is higher than a liquid density of the layer of the single-phase coolant fluid, and a boiling point of the layer of the dual-phase coolant fluid is lower than a boiling point of the layer of the single-phase coolant fluid.

10. The method of claim 9 , further comprising:

collecting and condensing, in a condenser unit, vapor bubbles of the dual-phase coolant fluid that have not been contained in the layer of the single-phase coolant fluid, the condenser unit is disposed above the layer of the single-phase coolant fluid.

11. The method of claim 9 , wherein the layer of the dual-phase coolant fluid comprises a fluorochemical.

12. The method of claim 9 , wherein the layer of the single-phase coolant fluid comprises a dielectric oil.

Assignments (2)
SECURITY INTEREST Recorded Jan 20, 2026
From: SUPER MICRO COMPUTER, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 074447/0643 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 1, 2024
From: LIU, YUEH MING; HUANG, YU HSIANG; CHANG, YU CHUAN; CHANG, TAN HSIN; CHEN, HSIAO CHUNG; CHEN, CHIA-WEI; CHEN, CHIH-TA; LIN, CHENG-HUNG; HSU, MING-TE
To: SUPER MICRO COMPUTER, INC.
Reel/Frame 068759/0855 →
Continuity (2)
Continuation 17383607 · Jul 23, 2021
Related Publication 20240314976A1 · Sep 19, 2024
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