Electronic Devices Having Oval Power Delivery Pads

1 . An electronic device comprising:

first conductive pads on a first surface of the electronic device, wherein each of the first conductive pads has an oval shape, and wherein the first conductive pads are coupled to deliver at least one of a power supply voltage or a ground voltage between an external device and the electronic device.

2 . The electronic device of claim 1 , wherein the electronic device is an integrated circuit die.

3 . The electronic device of claim 1 , wherein the electronic device is a package substrate of an integrated circuit package.

4 . The electronic device of claim 1 further comprising:

power through vias; and

second conductive pads on a second surface of the electronic device that is opposite the first surface, wherein the first conductive pads are coupled through conductive material in the power through vias to the second conductive pads.

5 . The electronic device of claim 4 , wherein the second conductive pads are coupled to capacitors, wherein the second conductive pads are non-overlapping with the power through vias, and wherein the electronic device is a circuit board.

6 . The electronic device of claim 1 , wherein the first conductive pads are coupled to provide the power supply voltage between the electronic device and an integrated circuit package.

7 . The electronic device of claim 1 , wherein the first conductive pads are coupled to provide multiple power supply voltages between the electronic device and the external device.

8 . The electronic device of claim 1 further comprising:

second conductive pads on the first surface of the electronic device, wherein the second conductive pads are coupled to provide input and output signals between the electronic device and the external device, and wherein the second conductive pads have oval shapes and surround the first conductive pads.

9 . The electronic device of claim 1 , wherein each of the first conductive pads has an elliptical shape comprising a major axis and a minor axis, and wherein the major axis of each of the first conductive pads is longer than the minor axis of that one of the first conductive pads.

10 . A method for delivering power between an electronic device and an external device, the method comprising:

coupling the electronic device to the external device through first conductive pads on a surface of the electronic device, wherein the first conductive pads have non-circular elliptical shapes; and

transmitting a power supply voltage between the electronic device and the external device through at least one of the first conductive pads.

11 . The method of claim 10 , wherein the electronic device is an integrated circuit die.

12 . The method of claim 10 , wherein the electronic device is a package substrate of an integrated circuit package.

13 . The method of claim 10 , wherein the electronic device is a circuit board.

14 . The method of claim 10 further comprising:

storing charge for the power supply voltage in a capacitor coupled to a power through via in the electronic device; and

transmitting the power supply voltage from the capacitor through the power through via and through the at least one of the first conductive pads to the external device.

15 . The method of claim 10 further comprising:

providing input and output signals between the electronic device and the external device through second conductive pads on the surface of the electronic device, wherein the second conductive pads have the non-circular elliptical shapes.

16 . A circuit system comprising:

an electrical device comprising first conductive pads on a first surface of the electrical device, wherein the first conductive pads are coupled to an external device, wherein each one of the first conductive pads has a major axis and a minor axis, wherein the major axis of each one of the first conductive pads is longer than the minor axis of the respective one of the first conductive pads, and wherein the first conductive pads are coupled to provide a power supply voltage between the electrical device and the external device.

17 . The circuit system of claim 16 , wherein the electrical device is an integrated circuit.

18 . The circuit system of claim 16 , wherein the electrical device is a package substrate in an integrated circuit package.

19 . The circuit system of claim 16 , wherein the electrical device is a circuit board.

20 . The circuit system of claim 19 , wherein the electrical device further comprises:

power through vias; and

second conductive pads on a second surface of the electrical device, wherein the second conductive pads are coupled to capacitors, and wherein the first conductive pads are coupled through conductive material in the power through vias to the second conductive pads.