Semiconductor module inspection device
A semiconductor module inspection device of the present disclosure includes a PCB substrate, an IC socket that accommodates a semiconductor module disposed on a first main surface of the PCB substrate, a first temperature control device disposed in contact with an upper surface of the IC socket, and a second temperature control device disposed in contact with a second main surface of the PCB substrate. In an embodiment, the first temperature control device and the second temperature control device have a Peltier element and a heat dissipation fin. In an embodiment, the semiconductor module inspection device further includes a chamber structure including a chamber upper portion connected to the heat dissipation surface of the first temperature control device, a chamber lower portion connected to the heat dissipation surface of the second temperature control device, and a purge mechanism for purging the chamber internal space with dried air.
1 . A semiconductor module inspection device, comprising:
a printed circuit board (PCB) substrate;
an integrated circuit (IC) socket that accommodates a semiconductor module disposed on a first main surface of the PCB substrate;
a first temperature control device disposed in contact with an upper surface of the IC socket;
a second temperature control device disposed in contact with a second main surface of the PCB substrate; and
a chamber structure including a chamber upper portion in direct contact with a heat dissipation surface of the first temperature control device and a chamber lower portion in direct contact with a heat dissipation surface of the second temperature control device.
2 . The semiconductor module inspection device according to claim 1 , wherein the first temperature control device and the second temperature control device have a Peltier element and a heat dissipation fin.
3 . The semiconductor module inspection device according to claim 2 , wherein the first temperature control device and the second temperature control device further include a cooling fan.
4 . The semiconductor module inspection device according to claim 3 , wherein
the chamber upper portion and the chamber lower portion are fitted to each other to form a chamber internal space, and
the chamber structure includes a purge mechanism for purging the chamber internal space with dried air.
5 . The semiconductor module inspection device according to claim 4 , further comprising:
a positioning mechanism including a positioning pin for positioning the IC socket and the first temperature control device, and a pin receiver to be fitted with the positioning pin, wherein
the first temperature control device includes the positioning pin, and
a lid portion of the IC socket includes the pin receiver.
6 . The semiconductor module inspection device according to claim 3 , further comprising:
a positioning mechanism including a positioning pin for positioning the IC socket and the first temperature control device, and a pin receiver to be fitted with the positioning pin, wherein
the first temperature control device includes the positioning pin, and
a lid portion of the IC socket includes the pin receiver.
7 . The semiconductor module inspection device according to claim 2 , wherein
the chamber upper portion and the chamber lower portion are fitted to each other to form a chamber internal space, and
the chamber structure includes a purge mechanism for purging the chamber internal space with dried air.
8 . The semiconductor module inspection device according to claim 7 , further comprising:
a positioning mechanism including a positioning pin for positioning the IC socket and the first temperature control device, and a pin receiver to be fitted with the positioning pin, wherein
the first temperature control device includes the positioning pin, and
a lid portion of the IC socket includes the pin receiver.
9 . The semiconductor module inspection device according to claim 2 , further comprising:
a positioning mechanism including a positioning pin for positioning the IC socket and the first temperature control device, and a pin receiver to be fitted with the positioning pin, wherein
the first temperature control device includes the positioning pin, and
a lid portion of the IC socket includes the pin receiver.
10 . The semiconductor module inspection device according to claim 1 , wherein
the chamber upper portion and the chamber lower portion are fitted to each other to form a chamber internal space, and
the chamber structure includes a purge mechanism for purging the chamber internal space with dried air.
11 . The semiconductor module inspection device according to claim 10 , further comprising:
a positioning mechanism including a positioning pin for positioning the IC socket and the first temperature control device, and a pin receiver to be fitted with the positioning pin, wherein
the first temperature control device includes the positioning pin, and
a lid portion of the IC socket includes the pin receiver.
12 . The semiconductor module inspection device according to claim 1 , further comprising:
a positioning mechanism including a positioning pin for positioning the IC socket and the first temperature control device, and a pin receiver to be fitted with the positioning pin, wherein
the first temperature control device includes the positioning pin, and
a lid portion of the IC socket includes the pin receiver.
13 . A semiconductor module inspection device, comprising:
a printed circuit board (PCB) substrate;
an integrated circuit (IC) socket that accommodates a semiconductor module disposed on a first main surface of the PCB substrate;
a first temperature control device disposed in contact with an upper surface of the IC socket;
a second temperature control device disposed in contact with a second main surface of the PCB substrate; and
a chamber structure including a chamber upper portion in direct contact with a heat dissipation surface of the first temperature control device and a chamber lower portion in direct contact with a heat dissipation surface of the second temperature control device, and
wherein the chamber upper portion comprises an opening, and an edge of the opening of the chamber upper portion contacts an edge of the first temperature control device, and wherein the chamber lower portion comprises an opening, and an edge of the opening of the chamber lower portion contacts an edge of the second temperature control device.