Power semiconductor device and manufacturiing method
A power semiconductor device comprises a semiconductor body, a gate electrode, and an extraction electrode, wherein the semiconductor body comprises a source region of a first conductivity type, well region of a second conductivity type different from the first conductivity type at the gate electrode, a drift region which is of the first conductivity type, and a barrier region which is of the first conductivity type, the barrier region is located between the drift region and the extraction electrode.
1. A power semiconductor device comprising a semiconductor body, a gate electrode, a source electrode and an extraction electrode, the gate electrode is separated from the semiconductor body by a gate insulator which is electrically insulating, wherein the semiconductor body comprises:
a source region of a first conductivity type directly at the source electrode and directly at the gate insulator,
a well region of a second conductivity type different from the first conductivity type directly at the gate insulator and directly at the source region,
a drift region which is of the first conductivity type that electrically follows the well region at a side remote from the source region and is directly at the gate insulator,
an extraction region directly at the extraction electrode which is of the second conductivity type, and
a barrier region assigned to the extraction electrode which is of the first conductivity type, the barrier region is located directly between the drift region and the extraction electrode ( 34 ) so that the extraction region is located between the barrier region and the extraction electrode and is surrounded all around by the barrier region which forms a well the extraction region is located in, and the barrier region is distant from the gate insulator,
wherein the well region and the extraction region have the same maximum doping concentrations and/or the same doping depth profile.
2. The power semiconductor device according to claim 1 ,
wherein the semiconductor body further comprises a deep doping region which is of the second conductivity type, the deep doping region is located between the barrier region and at least part of the drift region,
wherein a depth of the deep doping region into the semiconductor body exceeds a depth of the well region.
3. The power semiconductor device according to claim 2 ,
wherein the deep doping region is located directly at least at some lateral sides of the barrier region,
wherein a maximum doping concentration of the deep doping region exceeds a maximum doping concentration of the well region by at least a factor of two.
4. The power semiconductor device according to claim 2 ,
wherein a bottom side of the barrier region is at least partially free of the deep doping region.
5. The power semiconductor device according to claim 2 ,
wherein the gate electrode is accommodated in a trench,
wherein the gate electrode extends deeper into the semiconductor body than the well region,
wherein the deep doping region extends at least as far into the semiconductor body as the gate electrode.
6. The power semiconductor device according to claim 1 ,
wherein the semiconductor body further comprises an enhancement region which is of the first conductivity type,
wherein the enhancement region is located directly at a bottom side of the well region so that the enhancement region is located between the drift region and the well region,
wherein a maximum doping concentration of the enhancement region exceeds a maximum doping concentration of the drift region by at least a factor of two.
7. A method to produce a power semiconductor device according to claim 6 , the method comprising:
providing the semiconductor body having the drift region which is of the first conductivity type,
simultaneously creating the enhancement region and the barrier region which are of the first conductivity type,
simultaneously creating the well region and the extraction region which are of the second conductivity type different from the first conductivity type,
creating a source region which is of the first conductivity type, and
applying the source electrode at the source region, the gate electrode at the well region and the extraction electrode at the extraction region, the barrier region is located directly between the drift region and the extraction electrode.
8. The power semiconductor device according to claim 1 ,
wherein the gate electrode is accommodated in a trench,
wherein the gate electrode extends deeper into the semiconductor body than the well region.
9. The power semiconductor device according to claim 1 ,
wherein, seen in top view of the semiconductor body, the gate electrode comprises 2N stripes, N is a natural number larger than or equal to one,
wherein the 2N stripes define N active cells of the power semiconductor device.
10. The power semiconductor device according to claim 9 ,
wherein the source electrode comprises N lines,
wherein, seen in top view of the semiconductor body, each one of the N lines is assigned to one of the N active cells and is located between the respective two stripes of the gate electrode.
11. The power semiconductor device according to claim 9 ,
wherein N is a natural number larger than or equal to two,
wherein the extraction electrode comprises a plurality of contact points,
wherein, seen in top view of the semiconductor body, the contact points are arranged in each case between two adjacent active cells.
12. The power semiconductor device according to claim 11 ,
wherein, seen in top view of the semiconductor body, the contact points are arranged along a straight line,
wherein the contact points fill at most 5% of the straight line, and
wherein a length of each one of the contact points along the straight line is at most 50% of a distance between the adjacent active cells.
13. The power semiconductor device according to claim 1 ,
wherein the semiconductor body further comprises a plug which is of the second conductivity type,
wherein the plug is configured to electrically contact the well region,
wherein the source region, the plug and the extraction electrode are configured to be at the same electric potential.
14. The power semiconductor device according to claim 1 ,
which is an insulated-gate bipolar transistor, IGBT, configured for a voltage of at least 0.65 kV between a drain electrode and an emitter electrode of the IGBT.