Multi-layer patch antenna device and vehicle
The multi-layer patch antenna device comprises a lower antenna layer, a middle antenna layer and an upper antenna layer. An upper metal layer of the middle antenna layer is contacted by two feed pins which are guided through the lower and middle antenna layers. Metal layers of the lower antenna layer are connected to each other via a first hollow pin which is guided through the lower dielectric substrate layer. Metal layers of the middle antenna layer are connected via a second hollow pin which is guided through the middle dielectric substrate layer. An upper metal layer of the upper antenna layer is contacted by a further feed pin which is guided through the antenna layers and is coaxially sheathed by the first hollow pin and the second hollow pin.
1 . A multi-layer patch antenna device comprising:
a lower antenna layer,
a middle antenna layer, and
an upper antenna layer,
wherein the antenna layers are arranged in a predetermined installation position in a manner stacked on top of each other from bottom to top,
the respective antenna layers comprise a respective dielectric substrate layer,
wherein an underside of the respective dielectric substrate layer is coated with a lower metal layer, and a top side of the respective dielectric substrate layer is coated with an upper metal layer,
the upper metal layer of the middle antenna layer is contacted by two feed pins which are guided through the lower and middle antenna layers,
the metal layers of the lower antenna layer are connected to each other via a first hollow pin which is guided through the lower dielectric substrate layer,
the metal layers of the middle antenna layer are connected via a second hollow pin which is guided through the middle dielectric substrate layer, and
the upper metal layer of the upper antenna layer is contacted by a further feed pin which is guided through the antenna layers and is coaxially sheathed by the first hollow pin and the second hollow pin.
2 . The multi-layer patch antenna device as claimed in claim 1 ,
wherein the first hollow pin, the second hollow pin and the further feed pin are guided through an area center of the patch antenna device.
3 . The multi-layer patch antenna device as claimed in claim 1 ,
wherein the two feed pins contact the upper metal layer of the middle antenna layer via capacitive connections.
4 . The multi-layer patch antenna device as claimed in claim 1 ,
wherein the upper metal layer of the upper antenna layer comprises a rectangular basic structure, wherein two diagonally opposite corners of the rectangular structure are designed as beveled corners.
5 . The multi-layer patch antenna device as claimed in claim 1 ,
wherein the metal layers of the upper antenna layer are connected via four shorting pins which are guided through the upper dielectric substrate layer.
6 . The multi-layer patch antenna device as claimed in claim 1 ,
wherein the upper metal layer of the upper antenna layer has a U-slot arranged around a feed point of the upper metal layer of the upper antenna layer.
7 . The multi-layer patch antenna device as claimed in claim 1 ,
wherein the dielectric substrate layer of the upper antenna layer has two cutouts which are arranged opposite feed points of the upper metal layer of the middle antenna layer by way of the feed pins.
8 . A multi-layer patch antenna device, comprising:
a lower antenna layer,
a middle antenna layer, and
an upper antenna layer,
wherein the antenna layers are arranged in a predetermined installation position in a manner stacked on top of each other from bottom to top,
the respective antenna layers comprise a respective dielectric substrate layer,
wherein an underside of the respective dielectric substrate layer is coated with a lower metal layer, and a top side of the respective dielectric substrate layer is coated with an upper metal layer,
the upper metal layer of the middle antenna layer is contacted by two feed pins which are guided through the lower and middle antenna layers,
the metal layers of the lower antenna layer are connected to each other via a first hollow pin which is guided through the lower dielectric substrate layer,
the metal layers of the middle antenna layer are connected via a second hollow pin which is guided through the middle dielectric substrate layer,
the metal layers of the upper antenna layer are connected via shorting pins which are guided through the dielectric substrate layer of the upper antenna layer, and
the upper metal layer of the upper antenna layer is contacted by a further feed pin which is guided through the antenna layers and is coaxially sheathed by the first hollow pin and the second hollow pin.
9 . The multi-layer patch antenna device as claimed in claim 8 ,
wherein the dielectric substrate layers have the same dielectric constant.
10 . The multi-layer patch antenna device as claimed in claim 8 ,
wherein the dielectric substrate layers have different dielectric constants.
11 . The multi-layer patch antenna device as claimed in claim 8 ,
wherein the upper metal layer of the upper antenna layer has a feed structure which is configured to supply a signal from a feed point of the upper metal layer of the upper antenna layer, via two feed paths of different path lengths, to a ring antenna structure of the upper metal layer of the upper antenna layer.
12 . The multi-layer patch antenna device as claimed in claim 11 ,
wherein the ring antenna structure comprises two diagonally opposite beveled corners.
13 . The multi-layer patch antenna device as claimed in claim 2 ,
wherein the two feed pins contact the upper metal layer of the middle antenna layer via capacitive connections.
14 . The multi-layer patch antenna device as claimed in claim 13 ,
wherein the upper metal layer of the upper antenna layer comprises a rectangular basic structure, wherein two diagonally opposite corners of the rectangular structure are designed as beveled corners.
15 . The multi-layer patch antenna device as claimed in claim 14 ,
wherein the metal layers of the upper antenna layer are connected via four shorting pins which are guided through the upper dielectric substrate layer.
16 . The multi-layer patch antenna device as claimed in claim 15 , wherein the upper metal layer of the upper antenna layer has a U-slot arranged around a feed point of the upper metal layer of the upper antenna layer.
17 . The multi-layer patch antenna device as claimed in claim 16 ,
wherein the dielectric substrate layer of the upper antenna layer has two cutouts which are arranged opposite feed points of the upper metal layer of the middle antenna layer by way of the feed pins.
18 . The multi-layer patch antenna device as claimed in claim 10 ,
wherein the upper metal layer of the upper antenna layer has a feed structure which is configured to supply a signal from a feed point of the upper metal layer of the upper antenna layer, via two feed paths of different path lengths, to a ring antenna structure of the upper metal layer of the upper antenna layer.
19 . The multi-layer patch antenna device as claimed in claim 9 ,
wherein the upper metal layer of the upper antenna layer has a feed structure which is configured to supply a signal from a feed point of the upper metal layer of the upper antenna layer, via two feed paths of different path lengths, to a ring antenna structure of the upper metal layer of the upper antenna layer.
20 . The multi-layer patch antenna device as claimed in claim 19 ,
wherein the ring antenna structure comprises two diagonally opposite beveled corners.