IP Library Granted Patent US 12,563,692
Granted Patent B2
US 12,563,692 · App. 18/747,025 · Granted Feb 24, 2026

Server device

Inventors: JiaQi Yuan (Shanghai, CN); Zhao Geng (Shanghai City, CN); Guang-Zhao Tian (Shanghai City, CN); Wei Wang (Shanghai City, CN); Hong-Chou Lin (Taipei City, TW); Yu-Fan Chen (Taipei City, TW)
Assignees: SQ TECHNOLOGY(SHANGHAI) CORPORATION; INVENTEC CORPORATION
H05K7/1487H05K7/1492
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Quick Facts
Patent No.
US 12,563,692
App. No.
18/747,025
Granted
Feb 24, 2026
Kind
B2
Abstract

A server device includes a chassis, a processor assembly, a graphics card assembly and a backplane. The processor assembly is disposed in the chassis. The graphics card assembly is disposed in the chassis. The processor assembly and the graphics card assembly are arranged vertically. The backplane is vertically disposed in the chassis. The processor assembly and the graphics card assembly are electrically connected to the backplane in a board-to-board manner.

Claims (15)

1 . A server device, comprising:

a chassis;

a processor assembly, disposed in the chassis;

a graphics card assembly, disposed in the chassis, wherein the processor assembly and the graphics card assembly are arranged vertically;

a backplane, vertically disposed in the chassis, wherein the processor assembly and the graphics card assembly are electrically connected to the backplane in a board-to-board manner;

a mounting cage, disposed in the chassis, wherein the backplane is disposed at the mounting cage; and

a fan assembly, disposed in the mounting cage, wherein the fan assembly corresponds to the graphics card assembly, and the fan assembly is electrically connected to the backplane in a board-to-board manner.

2 . The server device according to claim 1 , wherein the backplane has a first side surface and a second side surface, the first side surface faces away from the second side surface, a normal direction of an extension surface where the first side surface is located and a normal direction of an extension surface where the second side surface is located are perpendicular to an arrangement direction of the processor assembly and the graphics card assembly, the processor assembly and the graphics card assembly are disposed at the first side surface, and the fan assembly is disposed at the second side surface.

3 . The server device according to claim 2 , further comprising a power supply assembly, wherein the power supply assembly is disposed in the chassis, the processor assembly, the graphics card assembly and the power supply assembly are arranged vertically, and the power supply assembly is electrically connected to the backplane.

4 . The server device according to claim 3 , wherein the graphics card assembly is located between the processor assembly and the power supply assembly.

5 . The server device according to claim 3 , wherein the processor assembly comprises a first riser card, the first riser card is disposed at the first side surface, and the first riser card is electrically connected to the backplane in a board-to-board manner.

6 . The server device according to claim 3 , further comprising a network interface card assembly, wherein the network interface card assembly is disposed in the mounting cage, the fan assembly is located between the network interface card assembly and the power supply assembly, the network interface card assembly disposed at the second side surface, and the network interface card assembly is electrically connected to the processor assembly in a board-to-board manner.

7 . The server device according to claim 6 , wherein the graphics card assembly comprises a second riser card, the second riser card is disposed at the first side surface, and the second riser card is electrically connected to the backplane in a board-to-board manner.

8 . The server device according to claim 3 , wherein the power supply assembly comprises at least one power supply unit and at least one power distribution unit, the at least one power distribution unit is electrically connected to the at least one power supply unit, and the at least one power distribution unit is electrically connected to the backplane in a board-to-board manner.

9 . The server device according to claim 1 , further comprising a disk drive assembly, wherein the disk drive assembly is disposed in the processor assembly, and the disk drive assembly is electrically connected to the processor assembly.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 20, 2024
From: YUAN, JIAQI; GENG, ZHAO; TIAN, GUANG-ZHAO; WANG, WEI; LIN, HONG-CHOU; CHEN, YU-FAN
To: SQ TECHNOLOGY(SHANGHAI) CORPORATION; INVENTEC CORPORATION
Reel/Frame 067787/0394 →
Priority Claims (1)
CN 202410728013.4 · Jun 5, 2024 · national
Continuity (1)
Related Publication 20250380372A1 · Dec 11, 2025
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