Anisotropic conductive electrical connection from a conductive pathway through a ceramic casing to a circuit board electronic component housed inside the casing
An AIMD includes a ceramic base closed with a ceramic lid, both cooperatively separating body fluid and device sides. The lid and circuit board both have active and conductive pathways. A circuit board has active and ground conductive pathways. An anisotropic conductive layer disposed between the lid device side and the circuit board has a first thickness where a first conductive particle is in electrical contact with the lid and the circuit board active conductive pathways electrically connected to the active terminal of an electronic component on the circuit board, a second thickness where a second conductive particle is in electrical contact with the lid and the circuit board ground conductive pathways electrically connected to the ground terminal of the electronic component. The anisotropic conductive layer has a third, greater thickness where no conductive particles are in electrical contact with the lid and circuit board conductive active and ground pathways.
1. An implantable medical device (IMD), the IMD comprising:
a) a ceramic base comprising a sidewall defining an open space and extending to a base annular edge surrounding a base open end;
b) a ceramic lid closing the open end of the ceramic base, the lid extending to a lid annular edge meeting a lid device side spaced from a lid body fluid side, wherein at least a lid first conductive pathway extends to spaced apart lid first conductive pathway device and body fluid side ends, and a lid second conductive pathway extends to spaced apart lid second conductive pathway device and body fluid side ends;
c) a circuit board residing in the interior space of the ceramic base closed by the lid, the circuit board extending to spaced apart circuit board first and second sides, wherein a circuit board first conductive pathway extends to spaced apart circuit board first conductive pathway first and second ends adjacent to the respective circuit board first and second sides, and a circuit board second conductive pathway extends to spaced apart circuit board second conductive pathway first and second ends adjacent to the respective circuit board first and second sides;
d) at least one electronic component supported by the circuit board, the electronic component having a first terminal spaced from a second terminal, wherein the circuit board first and second conductive pathway second ends are electrically connected to the respective first and second terminals of the at least one electronic component; and
e) an anisotropic conductive layer disposed between the circuit board first side and the device side of the ceramic lid, the anisotropic conductive layer comprising an electrically insulative matrix supporting a plurality of electrically conductive particles, wherein the anisotropic conductive layer comprises:
i) a first thickness that is longitudinally aligned with the lid first conductive pathway device side end and the circuit board first conductive pathway first end adjacent to the circuit board first side, wherein the electrically conductive matrix of the anisotropic conductive layer residing in the first thickness has at least a first one of the plurality of electrically conductive particles in electrical contact with the lid first conductive pathway device side end and the circuit board first conductive pathway first end to thereby provide electrical continuity from the lid first conductive pathway body fluid side end to the circuit board first conductive pathway second end electrically connected to the first terminal of the at least one electronic component;
ii) a second thickness that is longitudinally aligned with the lid second conductive pathway device side end and the circuit board second conductive pathway first end adjacent to the circuit board first side, wherein the electrically conductive matrix of the anisotropic conductive layer residing in the second thickness has at least a second one of the plurality of electrically conductive particles in electrical contact with the lid second conductive pathway device side end and the circuit board second conductive pathway first end to thereby provide electrical continuity from the lid second conductive pathway body fluid side end to the circuit board second conductive pathway second end electrically connected to the second terminal of the at least one electronic component; and
iii) a third thickness that is greater than the first and second thicknesses where the lid and circuit board first conductive pathways are not longitudinally aligned and where the lid and circuit board second conductive pathways are not longitudinally aligned, wherein, even though the electrically conductive matrix supporting the plurality of electrically conductive particles resides in the third thickness, a third one of the plurality of electrically conductive particles is not in electrical contact with either of the lid first conductive pathway and the circuit board first conductive pathway, and with either of the lid second conductive pathway and the circuit board second conductive pathway,
iv) wherein the third, greater thickness of the anisotropic conductive layer electrically isolates at least the first and second ones of the plurality of electrically conductive particles from each other.
2. The IMD of claim 1 , wherein at least one of the lid first conductive pathway device side end and the circuit board first conductive pathway first side end is proud of the respective lid device side and the circuit board first side, and wherein the first thickness of the anisotropic conductive layer is longitudinally aligned with the at least one proud lid first conductive pathway device side end and the circuit board first conductive pathway first side end, and wherein the third, greater thickness of the anisotropic conductive layer resides where the at least one proud lid first conductive pathway device side end and the circuit board first conductive pathway first side end are not longitudinally aligned.
3. The IMD of claim 1 , wherein the lid first and second conductive pathway device side ends and the circuit board first and second conductive pathways first and second side ends are proud of the respective lid device side end and the circuit board first side.
4. The IMD of claim 1 , wherein:
a) a first plurality of longitudinally aligned electrically conductive particles are in contact with each other and with the lid first conductive pathway device side end and the circuit board first conductive pathway first side end in the first thickness of the anisotropic conductive layer to thereby provide electrical continuity from the lid first conductive pathway body fluid side end to the circuit board first conductive pathway second side end electrically connected to the first terminal of the at least one electronic component;
b) a second plurality of longitudinally aligned electrically conductive particles are in contact with each other and with the lid second conductive pathway device side end and the circuit board second conductive pathway first side end in the second thickness of the anisotropic conductive layer to thereby provide electrical continuity from the lid second conductive pathway body fluid side end to the circuit board second conductive pathway second side end electrically connected to the second terminal of the at least one electronic component; and
c) a third plurality of electrically conductive particles reside in the third thickness of the anisotropic conductive layer, but they are not in electrical continuity with either the lid first conductive pathway device side end and the circuit board first conductive pathway first side end in the first thickness or with the lid second conductive pathway device side end and the circuit board second conductive pathway first end.
5. The IMD of claim 1 , wherein the electrically conductive particles are either compressible or rigid.
6. The IMD of claim 1 , wherein the anisotropic conductive layer is selected from the group of a film, a paste, a tape, and an adhesive.
7. The IMD of claim 1 , wherein the electrically conductive particles of the anisotropic conductive layer are selected from metallic particles, metal-coated particles, electrically conductive composite particles and electrically conductive coated polymer, glass, glass-ceramic, and ceramic particles.
8. The IMD of claim 1 , wherein the lid first and second conductive pathways, and the circuit board first and second conductive pathways are individually comprised of a leadwire, an eyelet, and a substantially pure platinum at least partially filling the respective lid and circuit board first and second passageways.
9. The IMD of claim 1 , wherein the lid first and second conductive pathways are individually a first and a second nail head leadwire that is proud of the lid device side.
10. The IMD of claim 1 , wherein the lid first and second conductive pathways, and the circuit board first and second conductive pathways are individually comprised of a leadwire, an eyelet, and a substantially pure platinum at least partially filling the respective lid and circuit board first and second passageways.
11. The IMD of claim 1 , wherein:
a) a base metallization is contacted the base annular edge and a base titanium ring is brazed to the base metallization opposite the ceramic base;
b) a lid metallization is contacted the lid annular edge and a lid titanium ring is brazed to the lid metallization opposite the lid; and
c) a weld secures the base titanium ring to the lid titanium ring to thereby connect the lid to the base to close the open end of the ceramic base.
12. The IMD of claim 11 , wherein the base and lid metallizations comprise a wetting layer contacted to the base annular edge and the lid annular edge, and a respective adhesion layer contacted to the wetting layer.
13. The IMD of claim 1 , wherein:
a) the ceramic lid comprises an alumina ceramic; and
b) the lid first and second conductive pathways individually comprise a composite fill characterized as having been co-sintered with the alumina ceramic or a substantially pure platinum fill characterized as having been co-sintered with the alumina ceramic.
14. The IMD of claim 13 , wherein the composite fill comprises a ceramic reinforced metal composite comprising a mixture of alumina and platinum surrounding a substantially pure platinum fill or a metallic wire.
15. The IMD of claim 1 , wherein the at least one electronic component supported by the circuit board is selected from a biological sensing circuit, a therapeutic delivery circuit, a memory circuit, a monitoring circuit, a programming circuit, and a telemetry circuit.
16. The IMD of claim 1 , wherein, in addition to the at least one electronic component, the circuit board supports an energy transfer module connected to a storage capacitor, the energy transfer module being configured to capture electromagnetic energy from an external RF power transmitting source to power the at least one electronic component.
17. The IMD of claim 1 , wherein, in addition to the at least one electronic component, the circuit board supports a primary or secondary battery which is configured to power the at least one electronic component.
18. The IMD of claim 1 , wherein the at least one electronic component is supported on the circuit board first side, the circuit board second side or it is embedded in the circuit board.
19. An implantable medical device (IMD), the IMD comprising:
a) a ceramic base comprising a sidewall defining an open space and extending to a base annular edge surrounding a base open end;
b) a feedthrough comprising:
i) a metallic ferrule having a ferrule opening extending to a ferrule device side spaced from a ferrule body fluid side;
ii) an insulator extending to an insulator device side spaced from an insulator body fluid side, wherein, with insulator hermetically sealed to the ferrule in the ferrule opening, the insulator device and body fluid sides reside adjacent to the ferrule device and body fluid sides;
iii) a first conductive pathway in the insulator extending to spaced apart insulator first conductive pathway device and body fluid side ends; and
iv) a second conductive pathway in the insulator extending to spaced apart insulator second conductive pathway device and body fluid side ends,
v) wherein the ferrule of the feedthrough is secured to the base annular edge to close the open end of the ceramic base; and
c) a circuit board residing in the interior space of the ceramic base closed by the feedthrough, the circuit board extending to spaced apart circuit board first and second sides, wherein a circuit board first conductive pathway extends to spaced apart circuit board first conductive pathway first and second ends adjacent to the respective circuit board first and second sides, and a circuit board second conductive pathway extends to spaced apart circuit board second conductive pathway first and second ends adjacent to the respective circuit board first and second sides;
d) at least one electronic component supported by the circuit board, the electronic component having a first terminal spaced from a second terminal, wherein the circuit board first and second conductive pathway second ends are electrically connected to the respective first and second terminals of the at least one electronic component;
e) an anisotropic conductive layer disposed between the circuit board and the device side of the insulator of the feedthrough, the anisotropic conductive layer comprising an electrically insulative matrix supporting a plurality of electrically conductive particles, wherein the anisotropic conductive layer comprises:
i) a first thickness that is longitudinally aligned with the insulator first conductive pathway device side end and the circuit board first conductive pathway first end adjacent to the circuit board first side, wherein the electrically conductive matrix of the anisotropic conductive layer residing in the first thickness has at least a first one of the plurality of electrically conductive particles in electrical contact with the insulator first conductive pathway device side end and the circuit board first conductive pathway first end to thereby provide electrical continuity from the insulator first conductive pathway body fluid side end to the circuit board first conductive pathway second end electrically connected to the first terminal of the at least one electronic component;
ii) a second thickness that is longitudinally aligned with the insulator second conductive pathway device side end and the circuit board second conductive pathway first end adjacent to the circuit board first side, wherein the electrically conductive matrix of the anisotropic conductive layer residing in the second thickness has at least a second one of the plurality of electrically conductive particles in electrical contact with the insulator second conductive pathway device side end and the circuit board second conductive pathway first end to thereby provide electrical continuity from the insulator second conductive pathway body fluid side end to the circuit board second conductive pathway second end electrically connected to the second terminal of the at least one electronic component; and
iii) a third thickness that is greater than the first and second thicknesses where the insulator and circuit board first conductive pathways are not longitudinally aligned and where insulator and circuit board second conductive pathways are not longitudinally aligned, wherein, even though the electrically conductive matrix supporting the plurality of electrically conductive particles resides in the third thickness, a third one of the plurality of electrically conductive particles is not in electrical contact with either of the insulator first conductive pathway and the circuit board first conductive pathway, and with either the insulator second conductive pathway and the circuit board second conductive pathway,
iv) wherein the third, greater thickness of the anisotropic conductive layer electrically isolates at least the first and second ones of the plurality of electrically conductive particles from each other.
20. The IMD of claim 19 , wherein at least one of the insulator first conductive pathway device side end and the circuit board first conductive pathway first side end is proud of the respective insulator device side and the circuit board first side, and wherein the first thickness of the anisotropic conductive layer is longitudinally aligned with the at least one proud insulator first conductive pathway device side end and the circuit board first conductive pathway first side end, and wherein the third, greater thickness of the anisotropic conductive layer resides where the at least one proud insulator first conductive pathway device side end and the circuit board first conductive pathway first side end are not longitudinally aligned.
21. The IMD of claim 19 , wherein the insulator first and second conductive pathways, and the circuit board first and second conductive pathways are individually comprised of a leadwire, an eyelet, and a substantially pure platinum at least partially filling the respective insulator and circuit board first and second passageways.
22. An implantable medical device (IMD), the IMD comprising:
a) a ceramic base comprising a sidewall defining an open space and extending to a base annular edge surrounding a base open end;
b) a ceramic lid closing the open end of the ceramic base, the lid extending to a lid annular edge meeting a lid device side spaced from a lid body fluid side, wherein at least a lid first conductive pathway extends to spaced apart lid first conductive pathway device and body fluid side ends, and a lid second conductive pathway extends to spaced apart lid second conductive pathway device and body fluid side ends;
c) a circuit board residing in the interior space of the ceramic base closed by the lid, the circuit board extending to spaced apart circuit board first and second sides, wherein a circuit board first conductive pathway extends to spaced apart circuit board first conductive pathway first and second ends adjacent to the respective circuit board first and second sides, and a circuit board second conductive pathway extends to spaced apart circuit board second conductive pathway first and second ends adjacent to the respective circuit board first and second sides;
d) a first electronic component supported by the circuit board, the first electronic component having at least a first terminal, wherein first conductive pathway second end is electrically connected to the first terminal of the first electronic component;
e) at least a second electronic component supported by the circuit board, the second electronic component having at least a second terminal, wherein second conductive pathway second end is electrically connected to the second terminal of the second electronic component; and
f) an anisotropic conductive layer disposed between the circuit board first side and the device side of the ceramic lid, the anisotropic conductive layer comprising an electrically insulative matrix supporting a plurality of electrically conductive particles, wherein the anisotropic conductive layer comprises:
i) a first thickness that is longitudinally aligned with the lid first conductive pathway device side end and the circuit board first conductive pathway first end adjacent to the circuit board first ide, wherein the electrically conductive matrix of the anisotropic conductive layer residing in the first thickness has at least a first one of the plurality of electrically conductive particles in electrical contact with the lid first conductive pathway device side end and the circuit board first conductive pathway first end to thereby provide electrical continuity from the lid first conductive pathway body fluid side end to the circuit board first conductive pathway second end electrically connected to the first terminal of the first electronic component;
ii) a second thickness that is longitudinally aligned with the lid second conductive pathway device side end and the circuit board second conductive pathway first end adjacent to the circuit board first side, wherein the electrically conductive matrix of the anisotropic conductive layer residing in the second thickness has at least a second one of the plurality of electrically conductive particles in electrical contact with the lid second conductive pathway device side end and the circuit board second conductive pathway first end to thereby provide electrical continuity from the lid second conductive pathway body fluid side end to the circuit board second conductive pathway second end electrically connected to the second terminal of at least the second electronic component; and
iii) a third thickness that is greater than the first and second thicknesses where the lid and circuit board first conductive pathways are not longitudinally aligned and where the lid and circuit board second conductive pathways are not longitudinally aligned, wherein, even though the electrically conductive matrix supporting the plurality of electrically conductive particles resides in the third thickness, a third one of the plurality of electrically conductive particles is not in electrical contact with either of the lid first conductive pathway and the circuit board first conductive pathway, and with either of the lid second conductive pathway and the circuit board second conductive pathway,
iv) wherein the third, greater thickness of the anisotropic conductive layer electrically isolates at least the first and second ones of the plurality of electrically conductive particles from each other.
23. The IMD of claim 22 , wherein the lid first and second conductive pathway device side ends and the circuit board first and second conductive pathways first and second side ends are proud of the respective lid device side end and the circuit board first side.