LASER SCORING OF POLYMERIC SUBSTRATES FOR USE IN PACKAGING
A method for laser scoring a polymeric substrate for packaging. The method includes providing a polymeric substrate and a laser apparatus. The laser apparatus includes a laser arranged and disposed to provide laser energy to a surface of the polymeric substrate. The laser apparatus is configured with a control sequence having a power setting and a frequency setting to deliver the laser energy. The laser energy is directed from the laser apparatus according to the control sequence at a power corresponding to the power setting and a frequency corresponding to the frequency setting to the polymeric substrate to form a score channel into the surface. The laser energy ablates the polymeric substrate to form the score channel. A laser scoring system and an easy-open package utilizing score channels formed by laser ablation are also disclosed.
1 . A method for laser scoring a polymeric substrate for packaging, the method comprising:
providing a polymeric substrate;
providing a laser apparatus having a laser arranged and disposed to provide laser energy to a surface of the polymeric substrate;
configuring the laser apparatus with a control sequence having a power setting and a frequency setting to deliver the laser energy;
directing the laser energy from the laser apparatus according to the control sequence at a power corresponding to the power setting and a frequency corresponding to the frequency setting to the polymeric substrate to form a score channel into the surface;
wherein the laser energy ablates the polymeric substrate to form the score channel.
2 . The method of claim 1 , wherein the polymeric substrate comprises polyethylene.
3 . The method of claim 1 , wherein the power from about 120 to about 250 kilowatts.
4 . The method of claim 1 , wherein the frequency is from about 150 Hz to about 300 Hz.
5 . The method of claim 1 , wherein the polymeric substrate is a polymeric web.
6 . The method of claim 5 , wherein the polymeric web is unsupported at the location where the laser interacts with the polymeric substrate.
7 . The method of claim 5 , wherein the polymeric web is advanced along a path substantially perpendicular to the directing of the laser energy.
8 . The method of claim 7 , wherein the control sequence further includes a dwell setting wherein the speed of the advancing of the polymeric web is from about 200 to about 400 feet per minute.
9 . The method of claim 1 , wherein the score channels are devoid of melted polymer.
10 . A laser scoring system for packaging material comprising:
a laser apparatus having a laser arranged and disposed to provide laser energy to a surface of the polymeric substrate, the laser apparatus having a controller configured with a control sequence having a power setting and a frequency setting;
wherein the control sequence produces laser energy from the laser at a power corresponding to the power setting and a frequency corresponding to the frequency setting that interacts with the substrate to ablate a portion of the surface of the polymeric web to form a score channel.
11 . The system of claim 10 , wherein the polymeric substrate comprises polyethylene.
12 . The system of claim 10 , wherein the power is from about 120 to about 250 kilowatts.
13 . The system of claim 10 , wherein the frequency is from about 150 Hz to about 300 Hz.
14 . The system of claim 10 , wherein the polymeric substrate is a polymeric web.
15 . The system of claim 14 , wherein the polymeric web is unsupported at the location where the laser interacts with the polymeric substrate.
16 . The system of claim 14 , wherein the polymeric web is advanced along a path substantially perpendicular to the directing of the laser energy.
17 . The system of claim 16 , wherein the control sequence further includes a dwell setting wherein the speed of the advancing of the polymeric web is from about 200 to about 400 feet per minute.
18 . An easy-open package comprising:
a package body formed from a polymeric web, the polymeric web having a score pattern of score channels formed by laser ablation.
19 . The package of claim 18 , wherein the polymeric web comprises polyethylene.
20 . The package of claim 18 , wherein the score channels are devoid of melted polymer.