LED filament and LED light bulb
An LED light filament includes an LED section, first and second conductive electrodes, and a conductive portion. The LED section includes LED chips. The first conductive electrode and the second conductive electrode are disposed at two ends of the LED section. The conductive portion is electrically connected between the LED chips. An LED chip among the LED chips has an electrical connecting portion, an end portion of the conductive portion is connected to the electrical connecting portion, the conductive portion has a first bent portion and a second bent portion. The conductive portion extends from the electrical connecting portion along a first direction of the LED chip, toward a second direction of the LED chip through the first bent portion, and toward a third direction of the LED chip through the second bent portion, and the first to third directions are different directions. An LED light bulb is also provided.
1. An LED filament, comprising:
an LED section comprising a plurality of LED chips connected in series and a light conversion layer wrapping the plurality of LED chips;
a first conductive electrode disposed at one of two ends of the LED section and electrically connected to the plurality of LED chips, wherein a portion of the first conductive electrode is wrapped by the light conversion layer;
a second conductive electrode disposed at the other one of the two ends of the LED section and electrically connected to the plurality of LED chips, wherein a portion of the second conductive electrode is wrapped by the light conversion layer; and
a conductive portion electrically connected between the plurality of LED chips;
wherein an LED chip among the plurality of LED chips has an electrical connecting portion, an end portion of the conductive portion is connected to the electrical connecting portion, the conductive portion has a first bent portion and a second bent portion, and the conductive portion extends from the electrical connecting portion along a first direction of the LED chip, extends toward a second direction of the LED chip through the first bent portion, and extends toward a third direction of the LED chip through the second bent portion, and wherein the first direction, the second direction, and the third direction are different directions.
2. The LED filament according to claim 1 , wherein the first direction is a height direction of the LED chip, the second direction is a width direction of the LED chip, and the third direction is a length direction of the LED chip.
3. The LED filament according to claim 1 , wherein a distance between the first bent portion and a surface of the LED chip is between 80 μm and 120 μm and a distance between the first bent portion and the second bent portion is between 100 μm and 120 μm.
4. The LED filament according to claim 1 , further comprising a first solder layer, wherein the first solder layer is made of a soldering material, and the end portion of the conductive portion is between the electrical connecting portion of the LED chip and the first solder layer.
5. The LED filament according to claim 4 , wherein a projection area of the first solder layer on the electrical connecting portion of the LED chip is larger than a projection area of a bonding region between the conductive portion and the electrical connecting portion of the LED chip.
6. The LED filament according to claim 4 , wherein the end portion of the conductive portion, the electrical connecting portion of the LED chip, and the first solder layer together form a joining portion, the joining portion has a meshy surface, and a plurality of bulges and a plurality of indents are alternately arranged on the meshy surface.
7. The LED filament according to claim 4 , further comprising a second solder layer, wherein the second solder layer is made of the solder material, and the end portion of the conductive portion is between the first solder layer and the second solder layer.
8. The LED filament according to claim 7 , wherein each of a projection area of the first solder layer on the electrical connecting portion of the LED chip and a projection area of the second solder layer on the electrical connecting portion of the LED chip is larger than a projection area of a bonding region between the conductive portion and the first solder layer, and between the conductive portion and the second solder layer on the electrical connecting portion of the LED chip.
9. The LED filament according to claim 7 , wherein a projection area of a bonding region between the conductive portion and the electrical connecting portion of the LED chip is smaller than the projection area of the first solder layer, and the projection area of the first solder layer is smaller than the projection area of the second solder layer.
10. The LED filament according to claim 1 , wherein the plurality of LED chips further comprises a first row of LED chips and a second row of LED chips, the first row of LED chips and the second row of LED chips are connected in parallel, the LED chips of the first row of LED chips are connected in series, the LED chips of the second row of LED chips connected in series, and the first row of LED chips and the second row of LED chips are alternately arranged along a width direction of the LED filament.
11. The LED filament according to claim 1 , further comprising a first conductive portion and a second conductive portion electrically connected between the LED chip and the first conductive electrode; wherein one of two ends of the first conductive portion is connected to the LED chip, the other end of the first conductive portion is connected to the first conductive electrode, one of two ends of the second conductive portion is connected to the first conductive electrode, and the other end of the second conductive portion is connected to the LED chip; wherein the first conductive portion firstly extends downwards and then upwards by taking a first bending point of the first conductive portion as a first turning point of the first conductive portion, and the first conductive portion then extends upwards and then downwards by taking a second bending point of the first conductive portion as a second turning point of the first conductive portion; the second conductive portion firstly extends upwards and then downwards by taking a first bending point of the second conductive portion as a first turning point of the second conductive portion, and the second conductive portion then extend downwards and then upwards by taking a second bending point of the second conductive portion as a second turning point of the second conductive portion.
12. An LED light bulb, comprising:
a lamp housing with a central axis;
a bulb base connected to the lamp housing;
a stem disposed in the lamp housing along the central axis of the lamp housing;
two conductive supports disposed in the lamp housing, the two conductive supports having opposite polarities;
a driving circuit disposed in the bulb base and electrically connected to the two conductive supports; and
a flexible LED filament disposed in the lamp housing and electrically connected to the two conductive supports, the flexible LED filament comprising:
an LED section comprising a plurality of LED chips connected in series and a light conversion layer wrapping the plurality of LED chips;
a first conductive electrode disposed at one of two ends of the LED section and electrically connected to the plurality of LED chips and one of the two conductive supports, wherein a portion of the first conductive electrode is wrapped by the light conversion layer;
a second conductive electrode disposed at the other one of the two ends of the LED section and electrically connected to the plurality of LED chips and the other one of the two conductive supports, wherein a portion of the second conductive electrode is wrapped by the light conversion layer; and
a conductive portion electrically connected between the plurality of LED chips;
wherein an LED chip among the plurality of LED chips has an electrical connecting portion, an end portion of the conductive portion is connected to the electrical connecting portion, the conductive portion has a first bent portion and a second bent portion, and the conductive portion extends from the electrical connecting portion along a first direction of the LED chip, extends toward a second direction of the LED chip through the first bent portion, and extends toward a third direction of the LED chip through the second bent portion, and wherein the first direction, the second direction, and the third direction are different directions.
13. The LED light bulb according to claim 12 , wherein the first direction is a height direction of the LED chip, the second direction is a width direction of the LED chip, and the third direction is a length direction of the LED chip.
14. The LED light bulb according to claim 12 , wherein a distance between the first bent portion and a surface of the LED chip is between 80 μm and 120 μm and a distance between the first bent portion and the second bent portion is between 100 μm and 120 μm.
15. The LED light bulb according to claim 12 , wherein the LED filament further comprises a first solder layer, the first solder layer is made of a soldering material, and the end portion of the conductive portion is between the electrical connecting portion of the LED chip and the first solder layer.
16. The LED light bulb according to claim 15 , wherein a projection area of the first solder layer on the electrical connecting portion of the LED chip is larger than a projection area of a bonding region between the conductive portion and the electrical connecting portion of the LED chip.
17. The LED light bulb according to claim 15 , wherein the end portion of the conductive portion, the electrical connecting portion of the LED chip, and the first solder layer together form a joining portion, the joining portion has a meshy surface, and a plurality of bulges and a plurality of indents are alternately arranged on the meshy surface.
18. The LED light bulb according to claim 15 , wherein the LED filament comprises a second solder layer, the second solder layer is made of the solder material, and the end portion of the conductive portion is between the first solder layer and the second solder layer.
19. The LED light bulb according to claim 18 , wherein each of a projection area of the first solder layer on the electrical connecting portion of the LED chip and a projection area of the second solder layer on the electrical connecting portion of the LED chip is larger than a projection area of a bonding region between the conductive portion and the first solder layer, and between the conductive portion and the second solder layer on the electrical connecting portion of the LED chip.
20. The LED light bulb according to claim 18 , wherein a projection area of a bonding region between the conductive portion and the electrical connecting portion of the LED chip is smaller than the projection area of the first solder layer, and the projection area of the first solder layer is smaller than the projection area of the second solder layer.
21. The LED light bulb according to claim 12 , wherein the plurality of LED chips further comprises a first row of LED chips and a second row of LED chips, the first row of LED chips and the second row of LED chips are connected in parallel, the LED chips of the first row of LED chips are connected in series, the LED chips of the second row of LED chips connected in series, and the first row of LED chips and the second row of LED chips are alternately arranged along a width direction of the LED filament.
22. The LED light bulb according to claim 12 , wherein the LED filament further comprises a first conductive portion and a second conductive portion electrically connected between the LED chip and the first conductive electrode; wherein one of two ends of the first conductive portion is connected to the LED chip, the other end of the first conductive portion is connected to the first conductive electrode, one of two ends of the second conductive portion is connected to the first conductive electrode, and the other end of the second conductive portion is connected to the LED chip; wherein the first conductive portion firstly extends downwards and then upwards by taking a first bending point of the first conductive portion as a first turning point of the first conductive portion, and the first conductive portion then extends upwards and then downwards by taking a second bending point of the first conductive portion as a second turning point of the first conductive portion; the second conductive portion firstly extends upwards and then downwards by taking a first bending point of the second conductive portion as a first turning point of the second conductive portion, and the second conductive portion then extend downwards and then upwards by taking a second bending point of the second conductive portion as a second turning point of the second conductive portion.