IP Library › Granted Patent US 12,718,870
Granted Patent B2
US 12,718,870 · App. 18/820,840 · Granted Aug 25, 2026

Memory device for wafer-on-wafer formed memory and logic

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Quick Facts
Patent No.
US 12,718,870
App. No.
18/820,840
Filed
Aug 30, 2024
Granted
Aug 25, 2026
Kind
B2
Examiner
HUANG, MIN
Art Unit
2827
USPC
365/244
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2024
From: HUSH, GLEN E.; ZAIDY, ALIASGER T.; EILERT, SEAN S.; PAREKH, KUNAL R.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 068451/0728 →
Continuity (3)
Continuation 17712935 · Apr 4, 2022
Provisional Application 63231660 · Aug 10, 2021
Related Publication 20240420757A1 · Dec 19, 2024
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US 20230048855A1 · Eilert et al. · 2023 [cited by applicant]