IP Library › Granted Patent US 12,659,563
Granted Patent B2
US 12,659,563 · App. 18/829,349 · Granted Jun 16, 2026

Camera module

Inventors: Yuan-Yu Lee (Taipei, TW); Chih-Hsuan Shih (Taipei, TW); Kun-Ta Ho (Taipei, TW); Chih-Hao Tsai (Taipei, TW)
Assignee: LITE-ON TECHNOLOGY CORPORATION
H04N23/55H04N23/51
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Quick Facts
Patent No.
US 12,659,563
App. No.
18/829,349
Granted
Jun 16, 2026
Kind
B2
Abstract

A camera module includes a housing including a first housing, wherein the first housing includes a body portion and a first protruding portion, and the body portion and the first protruding portion are integrally formed; the first protruding portion is disposed in an inner side of the body portion, an outer side of the body portion is a mounting surface for mounting to an object, and the inner side is opposite to the outer side; a first circuit board disposed on the first protruding portion, a photo sensor disposed on a first surface of the first circuit board, wherein a first angle is formed between the first circuit board and the mounting surface, the first angle is greater than 0 degrees and less than 90 degrees; and a lens disposed on the first surface of the first circuit board and corresponding to the photo sensor.

Claims (29)

1 . A camera module, comprising:

a housing comprising a first housing, the first housing comprising a body portion and a first protruding portion, and the body portion and the first protruding portion integrally formed, wherein the first protruding portion is disposed in an inner side of the body portion, an outer side of the body portion is a mounting surface for mounting to an object, and the inner side is opposite to the outer side;

a first circuit board disposed on the first protruding portion, a photo sensor disposed on a first surface of the first circuit board, wherein a first angle is formed between the first circuit board and the mounting surface, the first angle is greater than 0 degrees and less than 90 degrees; and

a lens disposed on the first surface of the first circuit board and corresponding to the photo sensor;

wherein the first housing further comprises a second protruding portion, the second protruding portion is disposed in the inner side of the body portion, the second protruding portion and the body portion are an integral structure, and the camera module further comprises:

a second circuit board disposed on the second protruding portion, wherein a second angle is formed between the second circuit board and the mounting surface, the second angle is greater than 0 degrees and less than 90 degrees; and

a light-emitting element disposed on the second circuit board.

2 . The camera module according to claim 1 , wherein the first angle is equal to the second angle.

3 . The camera module according to claim 1 , wherein the first housing further comprises an edge portion disposed on a periphery of the body portion and a distance between a top portion of the edge portion and the mounting surface is greater than 0.

4 . The camera module according to claim 3 , wherein a height of a top portion of the first protruding portion in a first direction and a height of a top portion of the second protruding portion in the first direction are greater than a height of the top portion of the edge portion in the first direction, and the first direction is parallel to a normal direction of the mounting surface.

5 . The camera module according to claim 3 , wherein the edge portion and the body portion are an integral structure.

6 . The camera module according to claim 1 , wherein the first circuit board is disposed on a first inclined surface of the first protruding portion to form the first angle; the second circuit board is disposed on a second inclined surface of the second protruding portion to form the second angle.

7 . The camera module according to claim 1 , further comprising an adhesive layer disposed between the lens and the first circuit board, wherein the lens is fixed on the first surface of the first circuit board through the adhesive layer.

8 . The camera module according to claim 7 , wherein the adhesive layer comprises a light-curable adhesive.

9 . The camera module according to claim 7 , wherein the first housing further comprises an edge portion disposed on a periphery of the body portion, a height of a top portion of the edge portion in a first direction is less than a minimum height of the adhesive layer in the first direction, and the first direction is parallel to a normal direction of the mounting surface.

10 . The camera module according to claim 1 , further comprising:

a third circuit board disposed in the inner side of the body portion;

a first transmission member electrically connected to the first circuit board and the third circuit board; and

a second transmission member electrically connected to the second circuit board and the third circuit board.

11 . The camera module according to claim 10 , wherein the first transmission member and the second transmission member are flexible circuit boards.

12 . The camera module according to claim 1 , wherein the housing further comprises a second housing assembled with the first housing, and the second housing has an opening corresponding to the lens.

13 . The camera module according to claim 12 , further comprising a filter covering the opening.

14 . A camera module, comprising:

a housing comprising a first housing, the first housing comprising a body portion and a single inclined protruding portion, and the body portion and the single inclined protruding portion integrally formed, wherein the single inclined protruding portion is disposed in an inner side of the body portion, an outer side of the body portion is a mounting surface for mounting to an object, and the inner side is opposite to the outer side;

a circuit board disposed on an inclined surface of the single inclined protruding portion;

a photo sensor disposed on a surface of the circuit board, wherein an angle is formed between the inclined surface of the single inclined protruding portion and the mounting surface, the angle is greater than 0 degrees and less than 90 degrees;

a lens disposed on the surface of the circuit board and corresponding to the photo sensor; and

a light-emitting element disposed on the surface of the circuit board,

wherein the lens and the light-emitting element are mounted on the circuit board disposed on the single inclined protruding portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2024
From: LEE, YUAN-YU; SHIH, CHIH-HSUAN; HO, KUN-TA; TSAI, CHIH-HAO
To: LITE-ON TECHNOLOGY CORPORATION
Reel/Frame 068534/0261 →
Priority Claims (1)
CN 202410105015.8 · Jan 25, 2024 · national
Continuity (1)
Related Publication 20250247596A1 · Jul 31, 2025
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