ADHESIVE-EQUIPPED METAL SUBSTRATE AND LAMINATE
The present invention relates to an adhesive-attached metal substrate and a laminate which have low dielectric properties in a high frequency region and can sufficiently ensure adhesive strength between a resin film and a metal layer. More specifically, the present invention relates to an adhesive-attached metal substrate including a metal layer and an adhesive resin layer formed of an adhesive resin composition, in which the adhesive resin composition contains a polyimide resin, a maleimide compound, a radical initiator, and an epoxy resin, a mass ratio between the polyimide resin and the maleimide compound is 10:1 to 3:2, the content of the radical initiator, with respect to 100 parts by mass of the maleimide compound, is equal to or more than 1 part by mass and less than 15 parts by mass, and the content of the epoxy resin, with respect to 100 parts by mass of the polyimide resin and the maleimide compound in total, is 1 part by mass or more and 5 parts by mass or less; and a laminate including the adhesive-attached metal substrate.
1 . An adhesive-attached metal substrate comprising a metal layer and an adhesive resin layer formed of an adhesive resin composition,
wherein the adhesive resin composition contains a polyimide resin (A), a maleimide compound (B), a radical initiator, and an epoxy resin,
a mass ratio between the polyimide resin (A) and the maleimide compound (B) is 10:1 to 3:2,
the content of the radical initiator, with respect to 100 parts by mass of the maleimide compound (B), is equal to or more than 1 part by mass and less than 15 parts by mass, and
the content of the epoxy resin, with respect to 100 parts by mass of the polyimide resin (A) and the maleimide compound (B) in total, is 1 part by mass or more and 5 parts by mass or less.
2 . The adhesive-attached metal substrate according to claim 1 , wherein the metal layer is a copper foil having a surface roughness of 1.5 μm or less.
3 . The adhesive-attached metal substrate according to claim 1 , wherein the adhesive resin layer has a thickness of 1 μm or more and 15 μm or less.
4 . (canceled)
5 . The adhesive-attached metal substrate according to claim 2 , wherein the adhesive resin layer has a thickness of 1 μm or more and 15 μm or less.
6 . A laminate comprising the adhesive-attached metal substrate according to claim 1 on one surface or both surfaces of a resin film,
wherein the resin film is laminated on a surface opposite a surface on which the adhesive resin layer included in the adhesive-attached metal substrate is in contact with the metal layer, and
the resin film is one or more selected from the group consisting of a modified polyimide resin film, a polyester resin film, a liquid crystal polymer film, a cyclic olefin resin film, a polyphenylene ether resin film, a polyphenylene sulfide resin film, a polyether ether ketone resin film, a bismaleimide resin film, a triazine resin film, a benzocyclobutene resin film, and a low dielectric epoxy resin film.
7 . A laminate comprising the adhesive-attached metal substrate according to claim 2 on one surface or both surfaces of a resin film,
wherein the resin film is laminated on a surface opposite a surface on which the adhesive resin layer included in the adhesive-attached metal substrate is in contact with the metal layer, and
the resin film is one or more selected from the group consisting of a modified polyimide resin film, a polyester resin film, a liquid crystal polymer film, a cyclic olefin resin film, a polyphenylene ether resin film, a polyphenylene sulfide resin film, a polyether ether ketone resin film, a bismaleimide resin film, a triazine resin film, a benzocyclobutene resin film, and a low dielectric epoxy resin film.
8 . A laminate comprising the adhesive-attached metal substrate according to claim 3 on one surface or both surfaces of a resin film,
wherein the resin film is laminated on a surface opposite a surface on which the adhesive resin layer included in the adhesive-attached metal substrate is in contact with the metal layer, and
the resin film is one or more selected from the group consisting of a modified polyimide resin film, a polyester resin film, a liquid crystal polymer film, a cyclic olefin resin film, a polyphenylene ether resin film, a polyphenylene sulfide resin film, a polyether ether ketone resin film, a bismaleimide resin film, a triazine resin film, a benzocyclobutene resin film, and a low dielectric epoxy resin film.
9 . A laminate comprising the adhesive-attached metal substrate according to claim 5 on one surface or both surfaces of a resin film,
wherein the resin film is laminated on a surface opposite a surface on which the adhesive resin layer included in the adhesive-attached metal substrate is in contact with the metal layer, and
the resin film is one or more selected from the group consisting of a modified polyimide resin film, a polyester resin film, a liquid crystal polymer film, a cyclic olefin resin film, a polyphenylene ether resin film, a polyphenylene sulfide resin film, a polyether ether ketone resin film, a bismaleimide resin film, a triazine resin film, a benzocyclobutene resin film, and a low dielectric epoxy resin film.