ADHESIVE-ATTACHED METAL SUBSTRATE AND LAMINATE
An adhesive-attached metal substrate and a laminate have low dielectric properties in a high frequency region and can sufficiently ensure adhesive strength between a resin film and a metal layer. More specifically, an adhesive-attached metal substrate includes a metal layer and an adhesive resin layer formed of an adhesive resin, in which the adhesive resin contains a polyimide resin, a maleimide compound, and a radical initiator, a mass ratio between the polyimide resin and the maleimide compound is 10:1 to 3:2, the content of the radical initiator, with respect to 100 parts by mass of the maleimide compound, is equal to or more than 1 part by mass and less than 15 parts by mass, and the adhesive resin layer has a thickness of 1 μm or more and 5 μm or less; and a laminate including the adhesive-attached metal substrate.
1 . An adhesive-attached metal substrate comprising a metal layer and an adhesive resin layer formed of an adhesive resin composition,
wherein the adhesive resin composition contains a polyimide resin (A), a maleimide compound (B), and a radical initiator,
a mass ratio between the polyimide resin (A) and the maleimide compound (B) is 10:1 to 3:2,
the content of the radical initiator, with respect to 100 parts by mass of the maleimide compound (B), is equal to or more than 1 part by mass and less than 15 parts by mass, and
the adhesive resin layer has a thickness of 1 μm or more and 5 μm or less.
2 . The adhesive-attached metal substrate according to claim 1 , wherein the metal layer is a copper foil having a surface roughness of 1.5 μm or less.
3 . A laminate comprising the adhesive-attached metal substrate according to claim 1 on one surface or both surfaces of a resin film,
wherein the resin film is laminated on a surface opposite a surface on which the adhesive resin layer included in the adhesive-attached metal substrate is in contact with the metal layer, and
the resin film is one or more selected from the group consisting of a modified polyimide resin film, a polyester resin film, a liquid crystal polymer film, a cyclic olefin resin film, a polyphenylene ether resin film, a polyphenylene sulfide resin film, a polyether ether ketone resin film, a bismaleimide resin film, a triazine resin film, a benzocyclobutene resin film, and a low dielectric epoxy resin film.
4 . The laminate according to claim 3 ,
wherein the adhesive resin layer has a thickness of 1 μm or more and 5 μm or less,
the resin film has a thickness of 38 μm or more and 100 μm or less,
the metal layer has a thickness of 3 μm or more and 18 μm or less, and
mathematical formula (1) below is satisfied:
1
%
□
(
X
/
Y
)
×
100
□
8
%
(
1
)
(in mathematical formula (1), X is the thickness (μm) of the adhesive resin layer, and Y is the thickness (μm) of the resin film).
5 . A laminate comprising the adhesive-attached metal substrate according to claim 2 on one surface or both surfaces of a resin film,
wherein the resin film is laminated on a surface opposite a surface on which the adhesive resin layer included in the adhesive-attached metal substrate is in contact with the metal layer, and
the resin film is one or more selected from the group consisting of a modified polyimide resin film, a polyester resin film, a liquid crystal polymer film, a cyclic olefin resin film, a polyphenylene ether resin film, a polyphenylene sulfide resin film, a polyether ether ketone resin film, a bismaleimide resin film, a triazine resin film, a benzocyclobutene resin film, and a low dielectric epoxy resin film.
6 . The laminate according to claim 5 ,
wherein the adhesive resin layer has a thickness of 1 μm or more and 5 μm or less,
the resin film has a thickness of 38 μm or more and 100 μm or less,
the metal layer has a thickness of 3 μm or more and 18 μm or less, and
mathematical formula (1) below is satisfied:
1
%
□
(
X
/
Y
)
×
100
□
8
%
(
1
)
(in mathematical formula (1), X is the thickness (μm) of the adhesive resin layer, and Y is the thickness (μm) of the resin film).