Electrical device with potting material
A mechanism for providing ingress protection for an electrical device. A protective element is coupled between an electrical element and a support element supporting the electrical element. Potting material covers exposed areas of the electrical element, support element and protective element. The adhesion between the protective element and the potting material is greater/stronger than between the support element and the potting material.
1 . An electrical device comprising:
an electrical element;
a support element for supporting the electrical element;
a housing configured to house the electrical element, wherein the support element is coupled to the housing and is configured to support the electrical element within the housing; wherein the support element is configured to support the electrical element away from at least one side of the housing;
a protective element coupled between the electrical element and the support element; and
potting material configured to cover exposed areas of the electrical element, exposed areas of the support element and exposed areas of the protective element,
wherein the adhesion between the protective element and the potting material is stronger than the adhesion between the support element and the potting material;
wherein the electrical element comprises a circuit board, wherein the protective element is configured to wrap around a portion of an edge of the circuit board.
2 . The electrical device of claim 1 , wherein the surface energy of the protective element ( 130 ) is greater than the surface energy of the support element.
3 . The electrical device of claim 1 , wherein the surface energy of the protective element is no less than 35 mJ/m 2 .
4 . The electrical device of claim 3 , wherein the surface energy of the protective element is not less than 38 mJ/m 2 .
5 . The electrical device of claim 1 , wherein the circuit board is a printed circuit board.
6 . The electrical device of claim 1 , wherein the protective element is configured to cover a portion of at least three surfaces of the circuit board.
7 . The electrical device of claim 1 , wherein the protective element is formed of silicone, plastic, rubber, polymeric material, and/or a composite of silicone, plastic, rubber and/or polymeric material.
8 . The electrical device of claim 1 , wherein the protective element is formed of silicone, silicone rubber, styrene-butadiene rubber, polyamide or nylon, polyurethane, poly(methylmethacrylate), polystyrene, poly(vinylcloride) and/or polyethylene terephthalate.
9 . The electrical device of claim 1 , wherein the protective element comprises one or more fasteners configured to fasten or secure the protective element to the electrical element.
10 . The electrical device of claim 9 , wherein each of the one or more fasteners comprises:
a first fastening portion sized and/or configured to pass through a hole of the electrical element; and
a second fastening portion configured to engage with the first fastening portion to thereby prevent or restrict the movement of the first fastening portion through the hole of the electrical element, to thereby fasten or secure the protective element to the electrical element.
11 . The electrical device of claim 10 , wherein the second fastening portion is configured to clip to the first fastening portion to thereby engage with the first fastening portion.
12 . The electrical device of claim 1 , wherein the potting material comprises a silicon-based resin, an epoxy resin, a polyurethane-based glue or tar.
13 . The electrical device of claim 1 , wherein the electrical device comprises:
a plurality of support elements for supporting the electrical element;
a plurality of protective elements, each protective element being coupled between the electrical element and a respective support element,
wherein:
the potting material is configured to cover exposed areas of each support element and exposed areas of each protective element; and
the adhesion between each protective element and the potting material is greater than the adhesion between each support element and the potting material.