MODULAR PACKAGE ON PACKAGE (POP) THERMOELECTRIC SUBASSEMBLIES FOR THERMO ELECTRIC GENERATOR DEVICES
The embodiments herein provide for thermoelectric generators (TEGs) with low coefficients of thermal expansion. In one embodiment, a TEG includes a hot-side substrate comprising a plurality of solder pads. Each solder pad having a p-type semiconductor pellet and an n-type semiconductor pellet affixed thereto. The TEG also includes a cold-side substrate comprising a corresponding plurality of solder pads dimensioned and arranged according to the plurality of solder pads of the hot-side substrate. The corresponding plurality of solder pads of the cold-side substrate is affixed to the hot-side substrate at locations of the plurality of solder pads of the hot-side substrate.
1 . A thermoelectric generator (TEG), comprising:
a hot-side substrate comprising a plurality of solder pads, with each solder pad having a p-type semiconductor pellet and an n-type semiconductor pellet affixed thereto; and
a cold-side substrate comprising a corresponding plurality of solder pads dimensioned and arranged according to the plurality of solder pads of the hot-side substrate, wherein the corresponding plurality of solder pads of the cold-side substrate is affixed to the hot-side substrate at locations of the plurality of solder pads of the hot-side substrate.
2 . The TEG of claim 1 , further comprising:
a controller affixed to the cold-side substrate and operable to monitor at least one of a power output, a fault condition, and a temperature measurement of the TEG.
3 . The TEG of claim 1 , wherein:
the hot-side substrate forms a first cartridge of the TEG; and
the TEG further comprises a plurality of cartridges, each configured as the first cartridge and affixed to other locations of the cold side substrate.
4 . The TEG of claim 3 , wherein:
the cold side substrate comprises at least one circuit trace connecting at least two of the cartridges.
5 . The TEG of claim 3 , wherein:
each of the cartridges are separated on the cold side substrate to reduce thermal expansion.
6 . The TEG of claim 1 , wherein:
the plurality of solder pads of the hot-side substrate arc dimensioned and arranged to reduce thermal expansion.
7 . A method of manufacturing a thermoelectric generator (TEG), comprising:
configuring a hot-side substrate with a plurality of solder pads;
affixing a p-type semiconductor pellet and an n-type semiconductor pellet to each of the solder pads of the hot-side substrate;
configuring a cold-side substrate with a corresponding plurality of solder pads dimensioned and arranged according to the plurality of solder pads of the hot-side substrate; and
affixing the corresponding plurality of solder pads of the cold-side substrate to the hot-side substrate at locations of the plurality of solder pads of the hot-side substrate to affix the cold-side substrate to the hot-side substrate.
8 . The method of claim 7 , further comprising:
affixing a controller to the cold-side substrate to monitor at least one of a power output, a fault condition, and a temperature measurement of the TEG.
9 . The method of claim 8 , further comprising:
forming a plurality of TEG cartridges, each cartridge being configured as the hot-side substrate; and
affixing the TEG cartridges at other locations of the cold side substrate.
10 . The method of claim 9 , further comprising
forming one or more circuit traces on the cold-side substrate to couple the controller to the cartridges.
11 . The method of claim 9 , further comprising:
separating the TEG cartridges from one another to provide for thermal expansion.
12 . The method of claim 1 , further comprising:
dimensioning and arranging the plurality of solder pads of the hot-side substrate to reduce thermal expansion.