IP Library › Patent Application 18853037
Patent Application
App. No. 18/853,037

METHOD FOR MANUFACTURING LIQUID CRYSTAL POLYMER FILM, LIQUID CRYSTAL POLYMER FILM, METHOD FOR MANUFACTURING HIGH FREQUENCY CIRCUIT BOARD MATERIAL, AND METHOD FOR MANUFACTURING HIGH FREQUENCY CIRCUIT BOARD

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Patent No.
US None
App. No.
18/853,037
Abstract

The present invention relates to a method for manufacturing a liquid crystal polymer film having excellent strength, a liquid crystal polymer film manufactured by the method, a method for manufacturing a high frequency circuit board material, and a method for manufacturing a high frequency circuit board. More specifically, the present invention provides a method for manufacturing a liquid crystal polymer film including a thermoplastic liquid crystal polymer film and a thermoplastic liquid crystal polymer layer, the method for manufacturing a liquid crystal polymer film including forming the thermoplastic liquid crystal polymer layer on a surface of the thermoplastic liquid crystal polymer film using a liquid thermoplastic liquid crystal polymer, a liquid crystal polymer film manufactured by the method, a method for manufacturing a high frequency circuit board material, and a method for manufacturing a high frequency circuit board.

Claims (17)

1 : A method for manufacturing a liquid crystal polymer film including a thermoplastic liquid crystal polymer film and a thermoplastic liquid crystal polymer layer, the method for manufacturing a liquid crystal polymer film comprising forming the thermoplastic liquid crystal polymer layer on a surface of the thermoplastic liquid crystal polymer film using a liquid thermoplastic liquid crystal polymer.

2 : The manufacturing method according to claim 1 , wherein the forming the thermoplastic liquid crystal polymer layer is applying a thermoplastic liquid crystal polymer solution.

3 : The manufacturing method according to claim 1 , wherein the forming the thermoplastic liquid crystal polymer layer is extruding a molten thermoplastic liquid crystal polymer.

4 : The manufacturing method according to claim 2 , wherein the thermoplastic liquid crystal polymer solution is applied by a method selected from the group consisting of die coating, gravure coating, screen printing, and inkjet printing.

5 : The manufacturing method according to claim 1 , wherein the thermoplastic liquid crystal polymer film is manufactured by a method selected from the group consisting of melt extrusion, stretching, an inflation method, and a solution casting method.

6 : The manufacturing method according to claim 1 , wherein the thermoplastic liquid crystal polymer film is a film of liquid crystal polyester or liquid crystal polyester amide, and the thermoplastic liquid crystal polymer layer is a layer of liquid crystal polyester or liquid crystal polyester amide.

7 : A liquid crystal polymer film manufactured by the manufacturing method according to claim 1 .

8 : The liquid crystal polymer film according to claim 7 , wherein an elastic modulus in a TD direction of the liquid crystal polymer film obtained by forming the thermoplastic liquid crystal polymer layer has a value larger than the elastic modulus in the TD direction of the thermoplastic liquid crystal polymer film before the thermoplastic liquid crystal polymer layer is formed.

9 : The liquid crystal polymer film according to claim 7 , wherein an anisotropy of a linear expansion coefficient (CTE) of the liquid crystal polymer film obtained by forming the thermoplastic liquid crystal polymer layer has a value smaller than the anisotropy of the linear expansion coefficient (CTE) of the thermoplastic liquid crystal polymer film before the thermoplastic liquid crystal polymer layer is formed.

10 : The liquid crystal polymer film according to claim 7 , which is used for manufacturing a high frequency circuit board material.

11 : A method for manufacturing a high frequency circuit board material, the method comprising:

manufacturing a liquid crystal polymer film by the manufacturing method according to claim 1 ; and

laminating a copper foil on a surface of the thermoplastic liquid crystal polymer film on a side opposite to the thermoplastic liquid crystal polymer layer.

12 : A method for manufacturing a high frequency circuit board, the method comprising:

manufacturing a liquid crystal polymer film by the manufacturing method according to claim 1 ;

laminating a copper foil on a surface of the thermoplastic liquid crystal polymer film on a side opposite to the thermoplastic liquid crystal polymer layer; and

forming a circuit from the copper foil.

Assignments (2)
CHANGE OF NAME Recorded Jan 30, 2025
From: FUJIMORI KOGYO CO., LTD.
To: ZACROS CORPORATION
Reel/Frame 070060/0612 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 25, 2024
From: MASAKI, AKIRA; MINAKUCHI, MASAO; SUZUKI, SHINICHIROU; KASAHARA, JUNYA
To: FUJIMORI KOGYO CO., LTD.
Reel/Frame 069016/0927 →