IP Library Granted Patent US 12,402,288
Granted Patent B2
US 12,402,288 · App. 18/853,835 · Granted Aug 26, 2025

Enclosure

Inventor: Goran Eriksson (Västerås, SE)
Assignee: HITACHI ENERGY LTD
H05K9/0007
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Quick Facts
Patent No.
US 12,402,288
App. No.
18/853,835
Granted
Aug 26, 2025
Kind
B2
Abstract

The present disclosure relates to an enclosure for an electric device in a high voltage electric field, the enclosure including at least one top element and at least one corresponding bottom element extending circumferentially from a center portion, wherein the top and the bottom elements are plate-like elements disposed substantially parallel to each other at a predetermined distance to provide a space therebetween. The top and bottom elements are each electrically connected at one end at the center portion, and in electrical contact at respective circumferential ends to form at least a portion of the enclosure. The enclosure is at least partially constructed of a conductive material. At least two slots are provided in the enclosure extending from the center portion to a circumference to separate different portions of the enclosure.

Claims (21)

1. An enclosure for an electric device in a high voltage electric field, the enclosure comprising:

at least one top element and at least one corresponding bottom element extending circumferentially from a center portion, wherein the top and the bottom elements are plate-like elements disposed substantially parallel to each other at a predetermined distance to provide a space therebetween,

wherein the top and bottom elements are each electrically connected at one end at the center portion, and in electrical contact at respective circumferential ends to form at least a portion of the enclosure;

wherein the enclosure is at least partially constructed of a conductive material; and

wherein at least two slots are provided in the enclosure extending from the center portion to a circumference to separate different portions of the enclosure; and

wherein the top and bottom elements are configured to be oriented substantially perpendicular to a direction of the electric field.

2. The enclosure according to claim 1 , wherein the enclosure is configured to allow wireless power transmission to the space.

3. The enclosure according claim 1 , wherein the enclosure is split in two parts at the center portion, and

wherein an antenna feeding circuit is connected to both parts of the enclosure.

4. The enclosure according to claim 1 , wherein the top element and the bottom element are connected by a connecting portion at the circumference of the top and bottom element, wherein particularly the top element, the bottom element and the connecting portion are integrally formed.

5. The enclosure according to claim 1 , wherein the slots are symmetrically provided with respect to the center portion.

6. The enclosure according to claim 1 , wherein the top element and the bottom element forming the portion of the enclosure form a circular sector around the center portion,

wherein a radius of the top element and the bottom element is particularly between 5 mm and 75 mm, and/or

wherein a distance between the top element and the bottom element is particularly between 5 mm and 15 mm.

7. The enclosure according to claim 1 , wherein the top element, the bottom element and the connecting portion comprise a respective thickness and a respective conductivity.

8. The enclosure according to claim 1 , wherein the space is at least partially filled with a dielectric and insulating material.

9. The enclosure according to claim 1 , wherein an opening is provided in the enclosure to enable inserting an electronic device.

10. The enclosure according to claim 1 , wherein the enclosure comprises an electrically conductive layer.

11. The enclosure according to claim 1 , wherein a width of the slots at the circumference of the disclosure is less than 25% of a distance between the top element and the bottom element.

12. The enclosure according to claim 1 , wherein a distance between the slots at the circumference of the disclosure is equal to or smaller than a distance between the top element and the bottom element.

13. The enclosure according to claim 1 , wherein a width of the slots gradually increases from the center portion towards the circumference.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 3, 2024
From: ERIKSSON, GORAN
To: HITACHI ENERGY SWITZERLAND AG
Reel/Frame 069106/0602 →
MERGER Recorded Oct 3, 2024
From: HITACHI ENERGY SWITZERLAND AG
To: HITACHI ENERGY LTD
Reel/Frame 069106/0625 →
Priority Claims (1)
EP 22167475 · Apr 8, 2022 · regional
Continuity (1)
Related Publication 20250113470A1 · Apr 3, 2025
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