Multichip Module
Provided is a multi-chip optical module in which a plurality of IC chips mounted on one substrate are packaged, the multi-chip optical module including: a lid component that forms an accommodation space for accommodating the plurality of IC chips together with the substrate and has protrusions protruding toward each of the IC chips; and adhesive layers formed between the protrusions and the IC chips, in which protrusion lengths of the protrusions vary according to heights of the protrusions with respect to the substrate.
1 . A multichip module in which a plurality of chip components mounted on one substrate are packaged, the multichip module comprising:
a lid component that forms an accommodation space for accommodating the plurality of chip components together with the substrate and has protrusions protruding toward each of the chip components; and
first adhesive layers formed between the protrusions and the chip components,
wherein protrusion lengths of the protrusions vary according to heights of the chip components with respect to the substrate.
2 . The multichip module according to claim 1 , wherein
the first adhesive layer between at least one of the chip components and the protrusion includes a spacer, and
a sum of thicknesses of the first adhesive layer including the spacer and the one chip component is equal to a sum of thicknesses of another one of the chip components and the first adhesive layer between the other one and the protrusion.
3 . The multichip module according to claim 1 , wherein an area of a protruding facing surface of the protrusion facing the chip component is smaller than an area of a chip facing surface of the chip component facing the protrusion.
4 . The multichip module according to claim 1 , wherein a protruding facing surface of the protrusion facing the chip component includes a stepped portion having a different protrusion length.
5 . The multichip module according to claim 1 , wherein
the lid component includes a side wall portion disposed around the protrusion,
the side wall portion includes a side wall facing surface facing the substrate,
the side wall facing surface is closer to the substrate than a protruding facing surface of the protrusion facing the substrate, and
a second adhesive layer is formed between the side wall facing surface and at least a part of the substrate.
6 . The multichip module according to claim 5 , wherein the second adhesive layer is further formed between a side surface of the substrate and the side wall portion.
7 . The multichip module according to claim 5 , wherein
at least a part of the side wall facing surface includes a stepped portion having a different distance from the substrate, and
the stepped portion is formed to be separated from the substrate on a side of the side wall facing surface that is farther from the protrusion than on a side closer to the protrusion.
8 . The multichip module according to claim 1 , wherein the lid component is at least partially made of metal.