IP Library › Patent Application 18874034
Patent Application
App. No. 18/874,034

Optical Semiconductor Integrated Circuit

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Quick Facts
Patent No.
US None
App. No.
18/874,034
Abstract

An optical semiconductor integrated circuit of the present disclosure realizes efficient wafer level testing by including electrical input/output terminals disposed around a chip and optical input/output terminals in the periphery in which electrical input/output terminals are not disposed. The optical semiconductor integrated circuit chip includes a plurality of electrical input/output terminals in at least one peripheral portion of a chip region. The electrical input/output terminals may be disposed in a U shape around the three sides. The optical semiconductor integrated circuit chip further includes an optical input/output terminal on one side on which an electrical input/output terminal is not disposed. The optical input/output terminal may be a grating coupler formed on a substrate.

Claims (10)

1 . An optical semiconductor integrated circuit having an optical circuit and an electrical circuit, comprising:

a plurality of electrical input/output terminals disposed around at least one periphery of a chip region; and

one or more optical input/output terminals disposed around one periphery in which the plurality of electrical input/output terminals are not disposed.

2 . The optical semiconductor integrated circuit according to claim 1 , wherein the optical circuit includes a Mach-Zehnder interferometer type modulator, and

the high frequency signal input terminals of the Mach-Zehnder interferometer type modulator are included in the plurality of electrical input/output terminals.

3 . The optical semiconductor integrated circuit according to claim 1 , wherein the optical circuit includes a photodiode, and

the high frequency signal output terminals of the photodiode are included in the plurality of electrical input/output terminals.

4 . The optical semiconductor integrated circuit according to claim 1 , wherein a distance between the electrical input/output terminal closest to the one or more optical input/output terminals among the electrical input/output terminals disposed along a periphery orthogonal to the one periphery on which the one or more optical input/output terminals are disposed and an optical input/output point of the optical input/output terminal is 250 μm or more.

5 . The optical semiconductor integrated circuit according to claim 1 , wherein the optical input/output terminal is a grating coupler which can input and output light toward the outside of the chip region.

6 . The optical semiconductor integrated circuit according to claim 1 , which is prepared using a silicon photonics technique.

Assignments (2)
CHANGE OF NAME Recorded Aug 18, 2025
From: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
To: NTT, INC.
Reel/Frame 072507/0699 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 11, 2024
From: TAKAHASHI, MASAYUKI; IKUMA, YUICHIRO; HINAKURA, YOSUKE
To: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
Reel/Frame 069557/0894 →