Interface Bridge Between Integrated Circuit Die
An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.
1 . A multi-die package comprising:
a first die comprising a communication interface; and
a second die communicatively coupled to the first die via the communication interface, wherein the second die comprises memory in a three-dimensional (3D) arrangement.
2 . The multi-die package of claim 1 , wherein the memory is coupled to the second die by interconnection points.
3 . The multi-die package of claim 1 , comprising a management subsystem configurable to communicate control information transmitted between the first die and the second die.
4 . The multi-die package of claim 3 , wherein the second die comprises a processor.
5 . The multi-die package of claim 1 , wherein the first die comprises a security manager configurable create a secure portion of the multi-die package.
6 . The multi-die package of claim 1 , wherein the first die comprises a plurality of communication interfaces, wherein the plurality of communication interfaces comprises a plurality of drivers configurable to couple to a plurality of single-ended data connections.
7 . The multi-die package of claim 6 , wherein the second die comprises peripheral component interconnect express (PCIe) circuitry that implements a PCIe protocol.
8 . The multi-die package of claim 1 , wherein the communication interface of the first die comprises a double data rate (DDR) interface.
9 . The multi-die package of claim 8 , wherein the second die comprises a central processing unit (CPU).
10 . A multi-die package comprising:
a first die mounted on a substrate;
a second die coupled to the first die, wherein the second die comprises a processor; and
a third die coupled to the second die and comprising memory, wherein the third die is stacked on top of the second die.
11 . The multi-die package of claim 10 , wherein the first die comprises communication interfaces.
12 . The multi-die package of claim 11 , wherein the first die is configurable to route data from the second die to an off-package electronic device.
13 . The multi-die package of claim 12 , wherein the second die comprises one or more processor cores.
14 . The multi-die package of claim 10 , wherein the first die comprises a PCIe layer.
15 . A multi-die package comprising:
a processor die;
an input/output (I/O) die comprising a communication interface configurable to route data between the processor die and off-package device; and
a memory, wherein the processor die and the memory are in a three-dimensional (3D) stacked configuration.
16 . The multi-die package of claim 15 , comprising a management subsystem configurable to communicate status and control information between the processor die and the I/O die.
17 . The multi-die package of claim 16 , comprising a security manager configurable to create a secure portion of the processor die.
18 . The multi-die package of claim 15 , wherein the I/O die comprises a PCIe layer.
19 . The multi-die package of claim 18 , wherein the I/O die comprises a double data date (DDR) interface.
20 . The multi-die package of claim 15 , wherein the processor die and the memory and coupled together via interconnects.