Light emitting diode module and display apparatus having the same
A light emitting diode (LED) module is provided. The LED module includes: a substrate including upper pads; a passivation layer on the substrate and defining openings exposing the upper pads; an LED chip on the passivation layer and including electrode pads electrically connected to the upper pads of the substrate; an adhesive layer on the LED chip and extending along a side surface of the LED chip; and a phosphor film covering an external surface of the adhesive layer and including an end portion around the LED chip.
1 . A light emitting diode (LED) module comprising:
a substrate comprising upper pads;
a passivation layer on the substrate and defining openings exposing the upper pads;
a plurality of LED chips on the passivation layer, wherein the plurality of LED chips comprises an LED chip, and the LED chip comprises electrode pads electrically connected to the upper pads of the substrate;
an adhesive layer on the LED chip and extending along a side surface of the LED chip; and
a phosphor film covering an external surface of the adhesive layer and comprising an end portion around the LED chip, wherein the end portion extends along the external surface of the adhesive layer to contact at least a portion of the passivation layer,
wherein the phosphor film of the LED chip is spaced apart from phosphor films of adjacent LED chips among the plurality of LED chips.
2 . The light emitting diode module of claim 1 , wherein the LED chip comprises an active surface on which the electrode pads are provided and an inactive surface opposite to the active surface, and
wherein the active surface faces an upper surface of the passivation layer.
3 . The light emitting diode module of claim 2 , further comprising connection bumps in the openings of the passivation layer,
wherein the connection bumps electrically connect the upper pads of the substrate to the electrode pads of the LED chip.
4 . The light emitting diode module of claim 1 , wherein the LED chip comprises a light emitting device configured to emit source light, and
wherein the phosphor film comprises a phosphor configured to be excited by the source light and emit white light.
5 . The light emitting diode module of claim 1 , wherein the LED chip comprises a blue light emitting device configured to emit blue light, and
wherein the phosphor film comprises a red phosphor and a green phosphor.
6 . The light emitting diode module of claim 1 , wherein the phosphor film comprises a first portion on top of the adhesive layer and a second portion extending from an end of the first portion along a side of the adhesive layer, and
wherein the first portion and the second portion have a substantially similar thickness.
7 . The light emitting diode module of claim 1 , wherein a thickness of the phosphor film is 20 μm to 500 μm.
8 . The light emitting diode module of claim 7 , wherein the phosphor film comprises a first portion on top of the adhesive layer and a second portion extending from an end of the first portion along a side of the adhesive layer,
wherein the first portion has a first thickness and the second portion has a second thickness, and
wherein a difference between the first thickness and the second thickness is 5 μm or less.
9 . The light emitting diode module of claim 1 , further comprising a reflector surrounding the LED chip on the passivation layer and covering a side surface of the end portion of the phosphor film in plan view.
10 . The light emitting diode module of claim 9 , wherein the reflector has a protrusion covering at least a portion of an upper surface of the end portion.
11 . The light emitting diode module of claim 9 , wherein the reflector comprises a white silicone resin composition.
12 . The light emitting diode module of claim 1 , wherein the passivation layer further defines an open region surrounding the openings and exposing at least a portion of an upper surface of the substrate,
wherein a lower portion of the adhesive layer extends to the open region of the passivation layer, and
wherein the end portion of the phosphor film contacts at least the portion of the upper surface of the substrate within the open region of the passivation layer.
13 . The light emitting diode module of claim 12 , wherein the open region of the passivation layer has a first side and a second side opposite to the first side,
wherein the lower portion of the adhesive layer contacts the first side of the open region, and
wherein the end portion of the phosphor film contacts at least a portion of the second side of the open region.
14 . The light emitting diode module of claim 12 , wherein a thickness of the passivation layer is ¼ or more of a thickness of the phosphor film.
15 . A light emitting diode (LED) module comprising:
a substrate comprising upper pads;
a plurality of LED chips on the substrate, wherein the plurality of LED chips comprises an LED chip, the LED chip comprises an active surface on which electrode pads electrically connected to the upper pads are provided, and an inactive surface opposite to the active surface, and the active surface faces an upper surface of the substrate;
an adhesive layer on the LED chip and extending along a side surface of the LED chip; and
a phosphor film covering an external surface of the adhesive layer and comprising an end portion around the LED chip,
wherein the end portion of the phosphor film extends along the external surface of the adhesive layer to contact a passivation layer on the upper surface of the substrate, and the end portion of the phosphor film extends between the upper surface of the substrate and lower surfaces of the electrode pads of the LED chip, and
wherein the phosphor film of the LED chip is spaced apart from phosphor films of adjacent LED chips among the plurality of LED chips.
16 . The light emitting diode module of claim 15 , further comprising connection bumps between the substrate and the LED chip, and electrically connecting the upper pads to the electrode pads,
wherein the adhesive layer contacts at least a portion of a lower surface of the LED chip and a portion of side surfaces of the connection bumps.
17 . The light emitting diode module of claim 15 , further comprising a reflector surrounding the LED chip on the substrate in plan view,
wherein the reflector covers at least a portion of side and upper surfaces of the end portion of the phosphor film.
18 . The light emitting diode module of claim 15 ,
wherein the passivation layer defines openings between the substrate and the LED chip, and an open region surrounding the openings,
wherein the light emitting diode module further comprises connection bumps within the openings of the passivation layer and electrically connecting the upper pads to the electrode pads, and
wherein the end portion of the phosphor film is within the open region of the passivation layer.
19 . A display apparatus comprising:
a backlight assembly comprising a substrate, upper pads on the substrate, a passivation layer on the substrate and defining openings exposing the upper pads, and a plurality of light emitting diode (LED) modules spaced apart from each other on the passivation layer; and
a display panel on the backlight assembly and configured to display an image using light emitted from the plurality of LED modules,
wherein each of the plurality of LED modules of the backlight assembly comprises:
an LED chip on the passivation layer and comprising electrode pads;
connection bumps in the openings of the passivation layer and electrically connecting the upper pads to the electrode pads;
a phosphor film covering the LED chip and comprising a lower end; and
an adhesive layer between the LED chip and the phosphor film,
wherein the lower end of the phosphor film extends along an external surface of the adhesive layer to contact at least a portion of the passivation layer;
wherein adjacent phosphor films among the phosphor film of the each of the plurality of LED modules of the backlight assembly are spaced apart from each other on the substrate.
20 . The display apparatus of claim 19 , wherein each of the plurality of LED modules of the backlight assembly further comprises a reflective structure surrounding at least a portion of the lower end of the phosphor film on the passivation layer in plan view.