IP Library Granted Patent US 12,332,810
Granted Patent B1
US 12,332,810 · App. 18/939,311 · Granted Jun 17, 2025

Electronic device having a plurality of chiplets

Inventors: Young-Jae Jin (Seongnam-si, KR); Miock Chi (Seongnam-si, KR); Sanggyu Park (Seongnam-si, KR); Chang-Hyo Yu (Seongnam-si, KR); Changsoo Ha (Seongnam-si, KR); Jaewan Bae (Seongnam-si, KR)
Assignee: REBELLIONS INC.
G06F13/14G06F11/3006G06F11/3051G06F13/28G06F13/36G06F13/409G06F2213/0026
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,332,810
App. No.
18/939,311
Granted
Jun 17, 2025
Kind
B1
Abstract

Provided is an electronic device, including a first chiplet including a first bus interface, a first interconnect management module, and a first interconnect module, and a second chiplet connected to the first chiplet through the first interconnect module, wherein, in response to an occurrence of a request transaction associated with the second chiplet, the first interconnect management module stores, in a register, first information associated with the request transaction.

Claims (55)

1. An electronic device, comprising:

a first chiplet comprising a first bus interface, a first interconnect management module, and a first interconnect module; and

a second chiplet connected to the first chiplet through the first interconnect module,

wherein, in response to an occurrence of a request transaction associated with the second chiplet, the first interconnect management module stores first information associated with the request transaction in a register,

wherein the first information comprises information associated with a first time of occurrence of the request transaction in the first interconnect management module, and

the first interconnect management module determines occurrence or non-occurrence of a request transaction timeout in the first chiplet, based on whether a transfer of the request transaction is completed before a first threshold time elapses since the first time, and

in response to determining that the request transaction timeout occurs in the first chiplet, the first bus interface is determined as a debugging point candidate.

2. The electronic device according to claim 1 , wherein

the request transaction is a burst transaction transferred with a burst transfer method, and

the request transaction timeout occurs in response to a part of the burst transaction not being transferred.

3. The electronic device according to claim 1 , wherein the request transaction is transferred to the second chiplet through the first interconnect module.

4. The electronic device according to claim 3 , wherein

the first interconnect management module determines occurrence or non-occurrence of a response transaction timeout in the first chiplet, based on whether a transfer of a response transaction corresponding to the request transaction is completed before a second threshold time elapses since the first time, and

the response transaction is transferred from the second chiplet to the first chiplet through the first interconnect module.

5. The electronic device according to claim 4 , wherein

the response transaction is a burst transaction transferred with a burst transfer method, and

the response transaction timeout occurs in response to all or a part of the burst transaction not being transferred.

6. The electronic device according to claim 3 , wherein

the second chiplet includes a second bus interface, a second interconnect management module, and a second interconnect module, and

in response to the occurrence of the request transaction, the second interconnect management module stores, in a register, second information associated with the request transaction.

7. The electronic device according to claim 6 , wherein

the second information includes information associated with a second time of occurrence of the request transaction in the second interconnect management module, and

the second interconnect management module determines occurrence or non-occurrence of a request transaction timeout in the second chiplet, based on whether a transfer of the request transaction is completed before a second threshold time elapses since the second time.

8. The electronic device according to claim 7 , wherein, in response to determining the occurrence of the request transaction timeout in the second chiplet, the second interconnect module is determined as a debugging point candidate.

9. The electronic device according to claim 6 , wherein

the second information includes information associated with a second time of occurrence of the request transaction in the second interconnect management module, and

the second interconnect management module determines occurrence or non-occurrence of a response transaction timeout in the second chiplet, based on whether a transfer of a response transaction corresponding to the request transaction is completed before a second threshold time elapses since the second time.

10. The electronic device according to claim 9 , wherein, in response to determining the occurrence of the response transaction timeout in the second chiplet, the second bus interface is determined as a debugging point candidate.

11. The electronic device according to claim 3 , wherein, in response to occurrence of a timeout associated with the request transaction in the first chiplet or the second chiplet, a transfer of the request transaction is initiated again in the chiplet where the timeout occurs.

12. The electronic device according to claim 1 , wherein

the first interconnect module is configured to communicate based on a first protocol, and

at least one of the first or second chiplet comprises a second interconnect module, which is configured to communicate with a host based on a second protocol.

13. The electronic device according to claim 12 , wherein

the first interconnect module is a Universal Chiplet Interconnect Express (UCIe) module, and

the second interconnect module is a Peripheral Component Interconnect Express (PCIe) module.

14. The electronic device according to claim 1 , wherein the first bus interface is an advanced eXtensible interface (AXI) type interface.

15. An electronic device, comprising:

a first chiplet comprising a first bus interface, a first interconnect management module, and a first interconnect module; and

a second chiplet connected to the first chiplet through the first interconnect module,

wherein, in response to an occurrence of a request transaction associated with the second chiplet, the first interconnect management module stores specific information associated with the request transaction in a register,

the request transaction is transferred to the second chiplet through the first interconnect module,

the specific information comprises information associated with a specific time of occurrence of the request transaction,

the first interconnect management module determines occurrence or non-occurrence of a response transaction timeout in the first chiplet, based on whether a transfer of a response transaction corresponding to the request transaction is completed before a specific threshold time elapses since the specific time, and

the response transaction is transferred from the second chiplet to the first chiplet through the first interconnect module,

in response to determining the occurrence of the response transaction timeout in the first chiplet, the first interconnect module is determined as a debugging point candidate.

16. An electronic device, comprising:

a first chiplet comprising a first bus interface, a first interconnect management module, and a first interconnect module; and

a second chiplet connected to the first chiplet through the first interconnect module,

wherein, in response to an occurrence of a request transaction associated with the second chiplet, the first interconnect management module stores specific information associated with the request transaction in a register,

the first interconnect module is configured to communicate based on a first protocol, and

at least one of the first or second chiplet comprises a second interconnect module, which is configured to communicate with a host based on a second protocol,

wherein, an interrupt signal is transferred to the host in response to an occurrence of a transaction timeout in at least one of the first or second chiplets.

17. The electronic device according to claim 16 , wherein, in response to receiving the interrupt signal, the host accesses a register associated with an interconnect management module of the chiplet where the transaction timeout occurs.

18. The electronic device according to claim 16 , wherein

a register associated with an interconnect management module of the chiplet where the timeout occurs comprises at least one of: information associated with the chiplet where the timed-out transaction is generated; information associated with an interconnect management module of the chiplet where the transaction is generated, or information associated with a bus interface through which the transaction is passed.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVING PROPERTY NUMBERS PREVIOUSLY RECORDED AT REEL: 71344 FRAME: 934. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Oct 21, 2025
From: REBELLIONS INC.
To: REBELLIONS INC.
Reel/Frame 073150/0270 →
MERGER AND CHANGE OF NAME Recorded May 21, 2025
From: REBELLIONS INC.; SAPEON KOREA INC.
To: REBELLIONS INC.
Reel/Frame 071344/0934 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 6, 2024
From: JIN, YOUNG-JAE; CHI, MIOCK; PARK, SANGGYU; YU, CHANG-HYO; HA, CHANGSOO; BAE, JAEWAN
To: REBELLIONS INC.
Reel/Frame 069322/0779 →
Priority Claims (1)
KR 10-2023-0195639 · Dec 28, 2023 · national
References Cited (8)
US 11669474B1 · Lee · 2023 [cited by examiner]
US 20230080284A1 · Lee · 2023 [cited by applicant]
US 20240030172A1 · Das Sharma · 2024 [cited by examiner]
US 20240220438A1 · Loh · 2024 [cited by examiner]
US 20240311330A1 · Das Sharma · 2024 [cited by examiner]
KR 1020230038082A · 2023 [cited by applicant]
WO 2023121812A1 · 2023 [cited by applicant]
WO WO2024205614A1 · 2024 [cited by examiner]